Abstract: In one embodiment, a vehicle wheel cover assembly is provided that includes a mount having an attachment portion with a release configuration that permits the attachment portion to engage inboard and outboard surfaces of a wheel hub flange of a wheel and a secured configuration that fixes the attachment portion to the wheel hub flange. The wheel cover assembly includes a retainer shiftable relative to the attachment portion of the mount from an unlocked position wherein the retainer permits the attachment portion to be reconfigured between the release configuration and the secured configured configuration to a locked position wherein the retainer maintains the attachment portion in the secured configuration. The wheel cover assembly further includes a cover assembly configured to be releasably secured to the mount to cover an opening of the wheel.

Abstract: In one embodiment, a vehicle wheel cover assembly is provided that includes a mount having an attachment portion with a release configuration that permits the attachment portion to engage inboard and outboard surfaces of a wheel hub flange of a wheel and a secured configuration that fixes the attachment portion to the wheel hub flange. The wheel cover assembly includes a retainer shiftable relative to the attachment portion of the mount from an unlocked position wherein the retainer permits the attachment portion to be reconfigured between the release configuration and the secured configured configuration to a locked position wherein the retainer maintains the attachment portion in the secured configuration. The wheel cover assembly further includes a cover assembly configured to be releasably secured to the mount to cover an opening of the wheel.

Abstract: The present Invention describes a method and system for calibrating, to an optimally ergonomic position, a surgical platform for use in laparoscopic surgeries. The bases of the method include the surgical site within a patient and the laparoscopic port placements within the ventral wall of the patient arranged in a three-dimensional coordinate system, and biometric data of the surgeon conducting the laparoscopic procedure.

Abstract: An electronics package is provided. The electronics package may include an underfill layer having a surface that defines an opening. The electronics package may include a polymer bump structure disposed within the opening. A laminate for use as an underfill layer is provided. Associated methods are provided.

Abstract: A lighting apparatus (10) comprises a light engine (12) producing ultra violet radiation. An enclosure (14) surrounds a radiation generating area of the light engine (12) to encompass the radiation. At least one wall (28) of the enclosure (14) is substantially reflective of the ultraviolet radiation. The enclosure (14) includes a replaceable top portion (30) which includes a phosphor portion (32). The phosphor portion (32) is spaced from the radiation generating area of the light engine (12) by a height of the enclosure (14).

Abstract: The design and use of a simplified, highly efficient, waveguide-based wireless distribution system are provided. A low-loss waveguide is used to transport wireless signals from a signal source or sources to one or more receiver locations. One or more adjustable signal coupling devices partially insert into the waveguide at predetermined locations along the length of the system to provide variable, controlled extraction of one or more wireless signals. Low-loss impedance matching circuitry is provided between the waveguide coupling devices and output connectors to maintain high system efficiency. The system offers the capability of supplying signals of high strength and high quality to a large number of receivers in a wide wireless coverage area via a plurality of signal radiators. Some embodiments of the system are readily adaptable for wireless distribution service in HVAC plenum spaces. A system that combines the functions of fire extinguishing and waveguide wireless distribution is also disclosed.

Abstract: A pressure sensor is provided. The pressure sensor includes a multi-layer laminate comprising a substrate and a semiconductor layer, wherein the substrate comprises single crystal or quasi-single crystal aluminum oxide, and a portion of the substrate that is spaced from a peripheral edge is wet etched to form an inwardly facing sidewall that defines a volume; and a substrate to which the multi-layer laminate is secured. The volume is an enclosed volume further defined by a substrate surface.

Abstract: An etchant including a halogenated salt, such as Cryolite (Na3AlF6) or potassium tetrafluoro borate (KBF4), is provided. The salt may be present in the etchant in an amount sufficient to etch a substrate and may have a melt temperature of greater than about 200 degrees Celsius. A method of wet etching may include contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the support layer may include aluminum oxide; or contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the etchant may include Cryolite (Na3AlF6), potassium tetrafluoro borate (KBF4), or both; and etching at least a portion of the support layer. The method may provide a laminate produced by growing a crystal onto an aluminum oxide support layer, and chemically removing at least a portion of the support layer by wet etch. An electronic device, optical device or combined device including the laminate is provided.

Abstract: A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.

Abstract: A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

Abstract: A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

Abstract: A method of applying at least two phosphors to an LED, wherein a first phosphor material having a lower absorption, shorter luminescence decay time, and/or lower thermal quenching than a second phosphor material is positioned closer to the LED than the second phosphor. Such an arrangement provides a light emitting device with improved lumen output and color stability over a range of drive currents.

Abstract: A semiconductor device die (10, 116) is disposed on a heat-sinking support structure (30, 100). Nanotube regions (52, 120) contain nanotubes (54, 126) are arranged on a surface of or in the heatsinking support structure (30, 100). The nanotube regions (52, 120) are arranged to contribute to heat transfer from the semiconductor device die (10, 116) to the heat-sinking support structure (30, 100). In one embodiment, the semiconductor device die (10) includes die electrodes (20, 22), and the support structure (30) includes contact pads (40, 42) defined by at least some of the nanotube regions (52). The contact pads (40, 42) electrically and mechanically contact the die electrodes (20, 22). In another embodiment, the heat-sinking support structure (100) includes microchannels (120) arranged laterally in the support structure (100). At least some of the nanotube regions are disposed inside the microchannels (100).

Abstract: A method of making a balloon includes providing two balloon films and providing two valve films. The two valve films are placed one on top of the other and then inserted between the two balloon films. Then a portion of each of the valve films is tack sealed to its respective adjacent balloon film. The valve films are then sealed together to form a valve passageway therein. During the valve sealing step, the balloon films are held in a fanned out manner. Finally, the balloon films are sealed together along the perimeter thereof to form the balloon.

Abstract: A balloon includes a pair of overlying valve film strips disposed between a pair of overlying balloon films, which include neck and body portions. The valve film strips extend at an angle to a central axis of the neck portions, and valve seals formed in the valve film strips direct incoming gas from an inlet adjacent the neck, to an outlet between the body portions. Methods of assembling the balloons by forming the valve seams and neck seams without moving the balloon films or valve film strips is also disclosed.

Abstract: Undesired glass particles emitted into the atmosphere from breakage of glass jars in the manufacturing process are removed utilizing an exhaust system, comprising a hood, exhaust piping, blower and cyclone. The hood and exhaust system protects the area adjacent to where glass jars are produced from emission of dangerous glass particles which result from breakage of glass jars during the assembly process.