Abstract: An apparatus for filtering is disclosed that implements a double-mode surface-acoustic-wave filter having a transition region with a partly uniform geometric property. In an example aspect, the double-mode surface-acoustic-wave filter includes at least one interdigital transducer with multiple fingers. The multiple fingers include a first set of fingers having a geometric property and a second set of fingers. The second set of fingers is positioned adjacent to the first set of fingers and is associated with an outer edge of the at least one interdigital transducer. The geometric property across a subset of the second set of fingers is substantially uniform. A value of the geometric property across the subset of the second set of fingers is different than a value of the geometric property across the first set of fingers.

Abstract: An apparatus is disclosed for a reconfigurable filter. In example aspects, the apparatus includes a filter circuit that has a first filter port and a second filter port. The filter circuit includes a filter network, an acoustic resonator, and a switch circuit. The filter network includes one or more acoustic resonators coupled between the first filter port and the second filter port. The acoustic resonator is coupled to the filter network and coupled between the first filter port and the second filter port. The switch circuit is coupled between the acoustic resonator and the second filter port, and the switch circuit is configured to connect the acoustic resonator into a parallel acoustic resonator arrangement in a first state and connect the acoustic resonator into a serial acoustic resonator arrangement in a second state.

Abstract: A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.

Abstract: The present invention concerns an electroacoustic filter (1), comprising an electrode (2) having a main layer (6) which consists of a metallic material comprising an alloy of copper and molybdenum. According to a second aspect, the present invention concerns a method of manufacturing an electroacoustic filter (1), comprising the steps of: providing a substrate (3), sputtering a metallic material comprising an alloy of copper and molybdenum onto the substrate (3), annealing the metallic material, and pattering the metallic material to form a main layer (6) of an electrode (2).

Abstract: A method for producing a dielectric layer on the surface of a component is described. In particular embodiments, a dielectric layer having a planar surface can be generated over a substrate topography having raised structures. In a trimming process, a component property, which depends on the thickness or the third topography of the dielectric layer, is adjusted.

Abstract: A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.

Abstract: A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum.

Abstract: A method for producing a dielectric layer on the surface of a component is described. In particular embodiments, a dielectric layer having a planar surface can be generated over a substrate topography having raised structures. In a trimming process, a component property, which depends on the thickness or the third topography of the dielectric layer, is adjusted.

Abstract: A metallization can be used for components working with acoustic waves. The metallization includes a base having a bottom layer comprising titanium, and an upper layer comprising copper. A top layer of the metallization disposed on the base comprises aluminum.