Patents by Inventor Charles Blessing

Charles Blessing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11997800
    Abstract: A method is provided for modifying a via from a PCB including a plurality of subassemblies comprising a plurality of layers. The method may include drilling a via of the PCB to form a through-hole to remove an unwanted material in the via of the PCB. The method may also include depositing a carbon-based material over an inner wall of the through-hole. The method may further include back drilling a first portion of the through-hole by a drill from the top of the PCB to form a first blind via. The method may also include selectively plating a conductive material over the carbon-based material to form a plated through-hole.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: May 28, 2024
    Assignee: TTM Technologies, Inc.
    Inventors: Mace Lehrer, James McKay, Charles Blessing
  • Publication number: 20210136928
    Abstract: A method is provided for modifying a via from a PCB including a plurality of subassemblies comprising a plurality of layers. The method may include drilling a via of the PCB to form a through-hole to remove an unwanted material in the via of the PCB. The method may also include depositing a carbon-based material over an inner wall of the through-hole. The method may further include back drilling a first portion of the through-hole by a drill from the top of the PCB to form a first blind via. The method may also include selectively plating a conductive material over the carbon-based material to form a plated through-hole.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 6, 2021
    Inventors: Mace Lehrer, James McKay, Charles Blessing