Patents by Inventor Charles C.C. Liu

Charles C.C. Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to determine optimal micro-bump-probe pad pairing for efficient PGD testing in interposer designs
    Patent number: 8707238
    Abstract: The present disclosure relates to a method of routing probe pads to micro-bumps of an interposer. An interposer is provided having target micro-bumps and probe pads. The probe pads are initially unassigned. Target micro-bump locations and probe pad locations are obtained. Possible route assignments from the probe pads to the target micro-bumps are obtained. Costs are developed for the possible route assignments at least partially according to the target micro-bump locations and the probe pad locations. Final assignments are selected from the possible assignments according to the costs.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: April 22, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Yi-Lin Chuang, Cheng-Pin Chiu, Ching-Fang Chen, Ji-Jan Chen, Sandeep Kumar Goel, Yun-Han Lee, Charles C. C. Liu
  • Method to Determine Optimal Micro-Bump-Probe Pad Pairing for Efficient PGD Testing in Interposer Designs
    Publication number: 20130326463
    Abstract: The present disclosure relates to a method of routing probe pads to micro-bumps of an interposer. An interposer is provided having target micro-bumps and probe pads. The probe pads are initially unassigned. Target micro-bump locations and probe pad locations are obtained. Possible route assignments from the probe pads to the target micro-bumps are obtained. Costs are developed for the possible route assignments at least partially according to the target micro-bump locations and the probe pad locations. Final assignments are selected from the possible assignments according to the costs.
    Type: Application
    Filed: May 31, 2012
    Publication date: December 5, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Lin Chuang, Cheng-Pin Chiu, Ching-Fang Chen, Ji-Jan Chen, Sandeep Kumar Goel, Yun-Han Lee, Charles C.C. Liu