Abstract: An orthogonal chip mount system module (10) comprising a base module (12), an interconnect chip (14), orthogonal slots (16) and semiconductor chips (18) is provided. The interconnect chip (14) is fixed to the base module (12) by high thermal conductivity epoxy. The semiconductor chips (18) are interference fitted into the slots (16). Solder pads (20) on the semiconductor chips (18) are aligned with solder pads (22) on the interconnect chip (14) and the system module (10) is then heated to the reflow temperature of the solder forming joints (24).