Patents by Inventor Charles C. Huse

Charles C. Huse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Content addressable memory match line detection
    Patent number: 7171595
    Abstract: According to one embodiment of the present invention, a content addressable memory (CAM) device includes a CAM array that includes a plurality of rows of CAM cells each coupled to a corresponding match line, and a test circuit coupled to the match lines that outputs row match results from the match lines onto a match output.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: January 30, 2007
    Assignee: Netlogic Microsystems, Inc.
    Inventors: Charles C. Huse, Bindiganavale S. Nataraj, Kumaresh Kavedi
  • Method and apparatus for testing a content addressable memory device
    Patent number: 7017089
    Abstract: According to one embodiment of the present invention, the CAM device includes a CAM array that includes a plurality of rows of CAM cells each coupled to a match line, a priority encoder coupled to the match lines to generate an index, a counter and compare logic coupled to the counter and the priority encoder to compare the index and a counter value from the counter.
    Type: Grant
    Filed: November 1, 2001
    Date of Patent: March 21, 2006
    Assignee: NetLogic Microsystems, Inc
    Inventor: Charles C. Huse
  • Multi-chip module having content addressable memory
    Patent number: 6864122
    Abstract: A monolithic Multi-chip Module (MCM) package includes two or more individual CAM dice mounted on a substrate formed as, for example, a plastic ball grid array (PBGA) package. The substrate includes an interconnect structure to route signals between corresponding pads of the CAM dice and balls of the MCM package. In some embodiments, the footprint of the MCM ball grid array package is identical to the footprint of a similar PBGA package housing a single CAM die. Each CAM die within the MCM package may be assigned the same device identification number (DID).
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: March 8, 2005
    Assignee: NetLogic Microsystems, Inc.
    Inventors: Charles C. Huse, William G. Nurge, Varadarajan Srinivasan
  • Multi-chip module having content addressable memory
    Patent number: 6521994
    Abstract: A monolithic Multi-chip Module (MCM) package includes two or more individual CAM dice mounted on a substrate formed as, for example, a plastic ball grid array (PBGA) package. The substrate includes an interconnect structure to route signals between corresponding pads of the CAM dice and balls of the MCM package. In some embodiments, the footprint of the MCM ball grid array package is identical to the footprint of a similar PBGA package housing a single CAM die. Each CAM die within the MCM package may be assigned the same device identification number (DID).
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: February 18, 2003
    Assignee: NetLogic Microsystems, Inc.
    Inventors: Charles C. Huse, William G. Nurge, Varadarajan Srinivasan