Abstract: Improved electrical capacitors are formed utilizing a thin dielectric layer which is metallized with an aluminum layer and a protective layer of metal, such as lead, tin or zinc, which does not readily oxidize in air is deposited on the aluminum layer. Capacitors of this type are formed by pleating, or folding, the dielectric layer so that one portion of an electrode is brought into contact with or adjacent to another portion of the same or of the opposite electrode. The protective layer prevents conversion of the aluminum layer between the adjacent electrode areas to insulating aluminum oxide, which could otherwise occur during the application of a high voltage pulse during testing or use of the capacitor.

Abstract: A loading machine and a method for loading small chip capacitors into apertures on an elongated plastic carrier strip are disclosed. The carrier strip is fed along a guide channel which supplies chip capacitors to a feed station. Below the feed station a punch punches apertures in the carrier strip and a gripper engages the strip to index it upwardly to the level of the feed station. A pusher arm at the feed station pushes each chip through the aperture in the carrier strip against a micrometer adjustment member behind the strip. A chip unloading machine is also disclosed in which a loaded carrier strip is fed through a guide channel to a pusher member which is cam operated under the control of an electrical timing mechanism that allows the pusher to push the chip capacitors out of their respective apertures at the proper time.