Patents by Inventor Charles C. Stratton

Charles C. Stratton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D checkerboard perforation pattern for increased shielding effectiveness
    Patent number: 7442882
    Abstract: An improved electromagnetic radiation (EMR) shield that has minimal airflow resistance is presented. The EMR shield includes: a base plate; and plurality of columns that project away from the base plate, wherein each of the columns has a first end that is attached to the base plate, a second end that is distal to the base plate, and a side surface that has at least one side hole therein.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: October 28, 2008
    Assignee: International Business Machines Corporation
    Inventors: Don A. Gilliland, Charles C. Stratton
  • Method of installing a land grid array multi-chip modules
    Patent number: 6757965
    Abstract: A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: July 6, 2004
    Assignee: International Business Machines Corporation
    Inventors: John L. Colbert, John S. Corbin, Jr., Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha, Charles C. Stratton
  • Apparatus for mounting a land grid array module
    Patent number: 6634095
    Abstract: An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: October 21, 2003
    Assignee: International Business Machines Corporation
    Inventors: John L. Colbert, John S. Corbin, Jr., Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha, Charles C. Stratton
  • Holding member for the installation of land grid array multi-chip modules
    Publication number: 20030192180
    Abstract: An installation apparatus and method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
    Type: Application
    Filed: June 5, 2003
    Publication date: October 16, 2003
    Inventors: John L. Colbert, John S. Corbin, Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha, Charles C. Stratton
  • Holding member for the installation of land grid array multi-chip modules
    Publication number: 20030000080
    Abstract: An installation apparatus and method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.
    Type: Application
    Filed: June 27, 2001
    Publication date: January 2, 2003
    Applicant: International Business Machines Corporation
    Inventors: John L. Colbert, John S. Corbin, Roger D. Hamilton, Danny E. Massey, Arvind K. Sinha, Charles C. Stratton