Abstract: A radiation shielding assembly for an electronic component is provided. The assembly includes a printed wiring board and a radiation shield having first and second covers on the printed wiring board. The first cover has first cover walls and the second cover has second cover walls. The first cover walls define a housing and have first cover cavities. The second cover walls have second cover thru passages. The assembly has the electronic component disposed on the printed wiring board and within the housing. The electronic component has a perimeter on the printed wiring board where the printed wiring board has passages at the electronic component perimeter. The first walls are located at the electronic component perimeter to enclose the electronic component.

Abstract: A system includes a substrate and an electrical component mounted to the substrate. The electrical component includes multiple conductive connectors physically and electrically connecting the electrical component to the substrate. The system also includes a structural enclosure positioned around lateral edges of the electrical component and mounted to the substrate. The structural enclosure includes raised walls extending away from the substrate and surrounding the electrical component. The raised walls are configured to block foreign object debris from contacting the conductive connectors. The electrical component may further include a semiconductor die and a lid, the lid may be in thermal contact with the semiconductor die, and the structural enclosure may be attached to the lid. The structural enclosure may further include multiple projections extending from the raised walls, and the lid may be attached to the projections of the structural enclosure.

Abstract: A system includes a substrate and an electrical component mounted to the substrate. The system also includes a structural enclosure positioned around lateral edges of the electrical component and mounted to the substrate. The structural enclosure includes raised walls extending away from the substrate and surrounding the electrical component. The raised walls are configured to block foreign object debris from the electrical component. The system further includes a lid connected to the substrate, where the lid covers the electrical component and the structural enclosure. The system also includes a seal positioned between the structural enclosure and the lid, where the seal is configured to be compressed when the lid is connected to the substrate. In addition, the system includes a thermal interface material positioned between and contacting the electrical component and the lid.

Abstract: The present disclosure generally relates to laser range finders. In one embodiment, a shallow-trench isolation diode operates in a reverse-biased mode. In another embodiment, a poly-defined diode operates in a forward-biased mode. In both embodiments, the diode emits photons in response to a radio frequency current, and the photons are received by an avalanche photo diode during a calibration process.

Abstract: A system or structure subject to external mechanical dynamic loading excitations propagated within the system or structure comprising a fluid filled structure and a fluid volume operable to facilitate fluid flow about at least part of the structure. Excitations within the structure can be propagated throughout. The system can further comprise a tuned mass damper (TMD) located within the fluid volume. The TMD can leverage the viscous properties of the fluid to attenuate the excitations within the structure. The TMD can comprise a mass and a spring operably connected to the mass. The TMD can further comprise a fluid resistance facilitating fluid flow about the mass and the spring for damping and a secondary tuning device operably connected to at least one of the mass and the spring and the supporting fluid-filled structure.

Abstract: Processing methods may be performed to produce semiconductor structures that may include a high-k dielectric material. The methods may include delivering a nitrogen-containing precursor or an oxygen-containing precursor to a substrate contained in a semiconductor processing chamber. The methods may include forming reactive ligands on an exposed surface of the substrate with the nitrogen-containing precursor or the oxygen-containing precursor. The methods may also include forming a high-k dielectric material overlying the substrate.

Abstract: The invention relates to capturing a still or moving image as well as object position and displacement data for the image, storing the image and the data as a dimension extractable object, and utilizing the dimension extractable object. In one embodiment, the dimension extractable object is used in a method of stitching a plurality of images together to form a stitched image. In another embodiment, the dimension extractable object is used in a method of generating a stitched image from a video image. In another embodiment, the dimension extractable object is used in a method of generating a three-dimensional model from a video image.

Abstract: Processing methods may be performed to produce semiconductor structures that may include a high-k dielectric material. The methods may include delivering a nitrogen-containing precursor or an oxygen-containing precursor to a substrate contained in a semiconductor processing chamber. The methods may include forming reactive ligands on an exposed surface of the substrate with the nitrogen-containing precursor or the oxygen-containing precursor. The methods may also include forming a high-k dielectric material overlying the substrate.

Abstract: The present disclosure generally relates to laser range finders. In one embodiment, a shallow-trench isolation diode operates in a reverse-biased mode. In another embodiment, a poly-defined diode operates in a forward-biased mode. In both embodiments, the diode emits photons in response to a radio frequency current, and the photons are received by an avalanche photo diode during a calibration process.

Abstract: The invention relates to capturing a still or moving image as well as object position and displacement data for the image, storing the image and the data as a dimension extractable object, and utilizing the dimension extractable object. In one embodiment, the dimension extractable object is used in a method of stitching a plurality of images together to form a stitched image. In another embodiment, the dimension extractable object is used in a method of generating a stitched image from a video image. In another embodiment, the dimension extractable object is used in a method of generating a three-dimensional model from a video image.

Abstract: Embodiments of the present disclosure use an “on chip” silicon LED to generate a light signal for calibration of a range finder. The light signal from the silicon LED may be detected by photo detectors in a reference path and a receive path of the range finder to generate a calibration phase offset, which may be subtracted out from a phase offset measurement of the range finder to correct the phase offset measurement for component mismatch due to, for example, environment, process variation, aging, etc.

Abstract: The invention relates to capturing a still or moving image as well as object position and displacement data for the image, storing the image and the data as a dimension extractable object, and utilizing the dimension extractable object.

Abstract: The invention relates to capturing a still or moving image as well as object position and displacement data for the image, storing the image and the data as a dimension extractable object, and utilizing the dimension extractable object.

Abstract: A system or structure subject to external mechanical dynamic loading excitations propagated within the system or structure comprising a fluid filled structure and a fluid volume operable to facilitate fluid flow about at least part of the structure. Excitations within the structure can be propagated throughout. The system can further comprise a tuned mass damper (TMD) located within the fluid volume. The TMD can leverage the viscous properties of the fluid to attenuate the excitations within the structure. The TMD can comprise a mass and a spring operably connected to the mass. The TMD can further comprise a fluid resistance facilitating fluid flow about the mass and the spring for damping and a secondary tuning device operably connected to at least one of the mass and the spring and the supporting fluid-filled structure.

Abstract: The invention relates to capturing a still or moving image as well as object position and displacement data for the image, storing the image and the data as a dimension extractable object, and utilizing the dimension extractable object, such as in improved e-commerce systems.

Abstract: A system or structure subject to external mechanical dynamic loading excitations propagated within the system or structure comprising a fluid filled structure and a fluid volume operable to facilitate fluid flow about at least part of the structure. Excitations within the structure can be propagated throughout. The system can further comprise a tuned mass damper (TMD) located within the fluid volume. The TMD can leverage the viscous properties of the fluid to attenuate the excitations within the structure. The TMD can comprise a mass and a spring operably connected to the mass. The TMD can further comprise a fluid resistance facilitating fluid flow about the mass and the spring for damping and a secondary tuning feature operably connected to at least one of the mass and the spring and the supporting fluid-filled structure.

Abstract: A system or structure subject to external mechanical dynamic loading excitations propagated within the system or structure comprising a fluid filled structure and a fluid volume operable to facilitate fluid flow about at least part of the structure. Excitations within the structure can be propagated throughout. The system can further comprise a tuned mass damper (TMD) located within the fluid volume. The TMD can leverage the viscous properties of the fluid to attenuate the excitations within the structure. The TMD can comprise a mass and a spring operably connected to the mass. The TMD can further comprise a fluid resistance facilitating fluid flow about the mass and the spring for damping and a secondary tuning feature operably connected to at least one of the mass and the spring and the supporting fluid-filled structure.

Abstract: Embodiments of the present disclosure use an “on chip” silicon LED to generate a light signal for calibration of a range finder. The light signal from the silicon LED may be detected by photo detectors in a reference path and a receive path of the range finder to generate a calibration phase offset, which may be subtracted out from a phase offset measurement of the range finder to correct the phase offset measurement for component mismatch due to, for example, environment, process variation, aging, etc.

Abstract: An apparatus for cooling semiconductor elements uses heat exchangers to transfer heat from the semiconductor elements to a coolant flowing through the heat exchangers. A central body, made from a flexible material, is positioned between the heat exchangers and a manifold from which the coolant is provided. The central body includes a plurality of flexible runners fluidly coupled to each heat exchanger and the manifold to provide the coolant to the heat exchanger. Heat is transferred away from the semiconductor elements by the coolant and heated coolant is returned from the heat exchanger to the manifold. Each flexible runner is configured to flex to conform to a height of a respective semiconductor element and thereby apply a force to the heat exchanger to maintain contact with the semiconductor element.

Abstract: In some embodiments, a semiconductor cooling apparatus includes a heat exchanger configured to thermally couple to a semiconductor element to transfer heat to coolant flowing through the heat exchanger. The apparatus also includes a flexible coolant supply manifold and a flexible coolant return manifold. The flexible coolant supply manifold and flexible coolant return manifold flex to conform to a height of the semiconductor element to apply a force to maintain the thermal coupling between the heat exchanger and the semiconductor element. The apparatus also includes a cold plate located under the semiconductor element, the cold plate configured to couple to the flexible coolant supply manifold via a first riser to provide coolant to the flexible coolant supply manifold and configured to couple to the flexible coolant return manifold via a second riser to exhaust returned coolant to the cold plate.