Abstract: The present invention is in the field of soybean variety CW1410185 breeding and development. The present invention particularly relates to the soybean variety CW1410185 and its seed, cells, germplasm, plant parts, and progeny, and methods of using CW1410185 in a breeding program.

Abstract: The present invention is in the field of soybean variety GO1312093 breeding and development. The present invention particularly relates to the soybean variety GO1312093 and its seed, cells, germplasm, plant parts, and progeny, and methods of using GO1312093 in a breeding program.

Abstract: The present invention is in the field of soybean variety AR1215503 breeding and development. The present invention particularly relates to the soybean variety AR1215503 and its seed, cells, germplasm, plant parts, and progeny, and methods of using AR1215503 in a breeding program.

Abstract: The present invention is in the field of soybean variety CW1410087 breeding and development. The present invention particularly relates to the soybean variety CW1410087 and its seed, cells, germplasm, plant parts, and progeny, and methods of using CW1410087 in a breeding program.

Abstract: The present invention is in the field of soybean variety GO1311890 breeding and development. The present invention particularly relates to the soybean variety GO1311890 and its seed, cells, germplasm, plant parts, and progeny, and methods of using GO1311890 in a breeding program.

Abstract: The present invention is in the field of soybean variety CW1410087 breeding and development. The present invention particularly relates to the soybean variety CW1410087 and its seed, cells, germplasm, plant parts, and progeny, and methods of using CW1410087 in a breeding program.

Abstract: The present invention is in the field of soybean variety GO1311890 breeding and development. The present invention particularly relates to the soybean variety GO1311890 and its seed, cells, germplasm, plant parts, and progeny, and methods of using GO1311890 in a breeding program.

Abstract: The present invention is in the field of soybean variety AR1215503 breeding and development. The present invention particularly relates to the soybean variety AR1215503 and its seed, cells, germplasm, plant parts, and progeny, and methods of using AR1215503 in a breeding program.

Abstract: The present invention is in the field of soybean variety AR1215506 breeding and development. The present invention particularly relates to the soybean variety AR1215506 and its progeny, and methods of making AR1215506.

Abstract: The present invention is in the field of soybean variety AR1215521 breeding and development. The present invention particularly relates to the soybean variety AR1215521 and its progeny, and methods of making AR1215521.

Abstract: The present invention is in the field of soybean variety AR1215506 breeding and development. The present invention particularly relates to the soybean variety AR1215506 and its progeny, and methods of making AR1215506.

Abstract: The present invention is in the field of soybean variety AR1215506 breeding and development. The present invention particularly relates to the soybean variety AR1215506 and its progeny, and methods of making AR1215506.

Abstract: The present invention is in the field of soybean variety AR1215521 breeding and development. The present invention particularly relates to the soybean variety AR1215521 and its progeny, and methods of making AR1215521.

Abstract: A technique for defining a wettable solder joint area for an electronic assembly reduces and/or dispenses with the use of polymer solder masks. According to the technique, a substrate is provided that includes at least one conductive trace. A nickel layer is provided on the conductive trace and gold is selectively applied on the nickel layer in a desired pattern to form a gold layer. An exposed portion of the nickel layer that does not include the gold in the desired pattern is then oxidized. Finally, a solder is applied to the gold layer, with the oxidized nickel layer providing a solder stop and defining a wettable solder joint area.

Abstract: An electronic module includes a substrate, at least one surface mounted integrated circuit (IC) component and an underfill material. The substrate includes a plurality of electrically conductive traces, formed on at least one surface of the substrate, and the component is electrically coupled to at least one of the conductive traces. The underfill material is positioned between the component and the substrate and provides at least one pedestal that supports the component during encapsulation. The underfill material, when cured, maintains the integrity of the electrical connections between the component and the conductive traces.

Abstract: A method of fabricating a printed circuit board assembly includes molding an array having a plurality of integrated circuits that are physically interconnected. Each integrated circuit has a molded body defining a lower surface. The integrated circuits have a plurality of electrical contacts on the bottom surface. The method includes singulating the array to form a plurality of separate integrated circuits, and at least a portion of the electrical contacts are cut. An organic solderability preservative is applied to the cut portion of the electrical contacts. Heat is applied to the integrated circuits to dry the circuits, and the integrated circuits are soldered to a printed circuit board by applying molten solder to remove the organic solderability preservative.