Abstract: A printed board includes a base printed board including a trace; an electronic component operably associated with the base printed board; and a dielectric connector build-up extending from the base printed board. The dielectric connector build-up defines a via. The printed board further includes a land attachment site disposed in the via. The land attachment site extends through the dielectric connector build-up and into the base printed board. The land attachment site is electrically coupled with the trace and is configured to be electrically coupled to another printed board by one of an electrically conductive compound and a flowed solder ball.

Abstract: A cable includes a first portion, a second portion, and a first fold between the first portion and the second portion. The cable further includes a first shim bonded between the first portion and the second portion. A method for making a cable includes adhesively bonding a first surface of a first shim to a first surface of the cable, folding the cable over the first shim, and adhesively bonding the first surface of the cable to a second surface of the first shim. A method includes folding a cable and adhesively bonding a shim in the fold to the interior surfaces defined by the fold.

Abstract: A cable includes a first portion, a second portion, and a first fold between the first portion and the second portion. The cable further includes a first shim bonded between the first portion and the second portion. A method for making a cable includes adhesively bonding a first surface of a first shim to a first surface of the cable, folding the cable over the first shim, and adhesively bonding the first surface of the cable to a second surface of the first shim. A method includes folding a cable and adhesively bonding a shim in the fold to the interior surfaces defined by the fold.