Abstract: Small-, medium-, and large-caliber combustible cartridge cases and propellant combustible containers that are manufactured using reactive injection molding of azido polymers. An injection process for a single propellant combustible charge including the steps of: providing a quantity of azido bearing polymer; providing a quantity of curing agent; optionally providing a quantity of chemical blowing agent; optionally providing a quantity of fibers; optionally providing a quantity of additives and catalysts; and providing a mold defining a male cavity, a female cavity, and an injection port. The injection process further includes mixing together the azido bearing polymer, the curing agent, the optional chemical blowing agent, the optional fibers, the optional additives and catalysts, and injecting the resulting mixture into the mold.

Abstract: Small-, medium-, and large-caliber combustible cartridge cases and propellant combustible containers that are manufactured using reactive injection molding of azido polymers. An injection process for a single propellant combustible charge including the steps of: providing a quantity of azido bearing polymer; providing a quantity of curing agent; optionally providing a quantity of chemical blowing agent; optionally providing a quantity of fibers; optionally providing a quantity of additives and catalysts; and providing a mold defining a male cavity, a female cavity, and an injection port. The injection process further includes mixing together the azido bearing polymer, the curing agent, the optional chemical blowing agent, the optional fibers, the optional additives and catalysts, and injecting the resulting mixture into the mold.

Abstract: There is provided a method for the fabrication of porous SiC ceramic. The method comprises oxidizing particles of SiC ceramic thereby forming amorphous silica on the surface of the particles. The oxidized SiC particles are then mixed with an additive. Alternatively, layer(s) of the additive is (are) deposited on their surface by sol-gel technique. The oxidized SiC particles mixed or coated with the additive are then mixed with at least one pore-former. Alternatively, the oxidized SiC particles mixed or coated with the additive are coated with layer(s) of a polymer or pore-former by in-situ polymerization. In embodiments where the oxidized SiC particles are mixed with an additive and a pore-former or polymer, a further additive may be used. In each of these embodiments, the resulting product is then compacted into a green body which is heated and sintered to yield the porous SiC ceramic material. There is also provided a porous SiC ceramic fabricated by the method according to the invention.

Abstract: The present disclosure relates to a continuous extrusion process for producing a celluloid article including several steps and a celluloid article prepared by the continuous extrusion process.

Abstract: The present disclosure relates to a continuous extrusion process for producing a celluloid article including several steps and a celluloid article prepared by the continuous extrusion process.

Abstract: There is provided a method for the fabrication of porous SiC ceramic. The method comprises oxidizing particles of SiC ceramic thereby forming amorphous silica on the surface of the particles. The oxidized SiC particles are then mixed with an additive. Alternatively, layer(s) of the additive is (are) deposited on their surface by sol-gel technique. The oxidized SiC particles mixed or coated with the additive are then mixed with at least one pore-former. Alternatively, the oxidized SiC particles mixed or coated with the additive are coated with layer(s) of a polymer or pore-former by in-situ polymerization. In embodiments where the oxidized SiC particles are mixed with an additive and a pore-former or polymer, a further additive may be used. In each of these embodiments, the resulting product is then compacted into a green body which is heated and sintered to yield the porous SiC ceramic material. There is also provided a porous SiC ceramic fabricated by the method according to the invention.

Abstract: The present invention provides articles that exhibit exceptional peel strength and have a thermoplastic volume, a metal volume, and an interpenetrated volume that includes both thermoplastic and metal portions. The present invention also provides for methods of producing the articles of the invention.

Abstract: There are provided electrically conducting polymer compositions comprising an electrically conductive polymer or copolymer and an organic solvent wettable fluorinated acid polymer. Electrically conductive polymer materials are derived from thiophene, pyrrole, aniline and polycyclic heteroaromatic precursor monomers. Non-conductive polymers derived from alkenyl, alkynyl, arylene, and heteroarylene precursor monomers. The organic-solvent wettable fluorinated acid polymer is fluorinated or highly fluorinated and may be colloid-forming. Acidic groups include carboxylic acid groups, sulfonic acid groups, sulfonimide groups, phosphoric acid groups, phosphonic acid groups, and combinations thereof. The compositions can be used in organic electronic devices.

Abstract: The present disclosure relates to electrically conductive polymer compositions, comprising at least one electrically conductive copolymer; and at least one fluorinated acid polymer, their use in organic electronic devices, and methods for preparation.

Abstract: An insensitive melt cast explosive composition obtained by dissolving an energetic copolyurethane thermoplastic elastomer (“ETPE”) in melted trinitrotoluene (“TNT”) is disclosed. The resulting ETPE-TNT solution is easy to mix with other ingredients such as nitramines, plasticizers, aluminum and can be processed with the existing melt cast facilities. The energetic solution can be poured into shells and upon cooling to produce a recyclable plastic bonded explosive. Instead of melted TNT, the same process works equally well with melted Octol or melted Composition B to dissolve the ETPE.

Abstract: An insensitive melt cast explosive composition obtained by dissolving an energetic copolyurethane thermoplastic elastomer (“ETPE”) in melted trinitrotoluene (“TNT”) is disclosed. The resulting ETPE-TNT solution is easy to mix with other ingredients such as nitramines, plasticizers, aluminum and can be processed with the existing melt cast facilities. The energetic solution can be poured into shells and upon cooling to produce a recyclable plastic bonded explosive. Instead of melted TNT, the same process works equally well with melted Octol or melted Composition B to dissolve the ETPE.

Abstract: Methods and apparatus are set forth for burn-in stressing and simultaneous testing of a plurality of semiconductor device chips laminated together in a stack configuration to define a multichip module. Testing is facilitated by connecting temporary interconnect wiring to an access surface of the multichip module. This temporary interconnect wiring electrically interconnects at least some semiconductor device chips within the module. Prior to burn-in stressing and testing, a separate electrical screening step occurs to identify any electrical defect in the connection between the temporary interconnect wiring and the multichip module. If an electrical defect is identified, various techniques for removing or isolating the defect are presented. Thereafter, burn-in stressing and simultaneous testing of the semiconductor chips within the multichip module occurs using the temporary interconnect wiring.

Abstract: Methods and apparatus are set forth for burn-in stressing and simultaneous testing of a plurality of semiconductor device chips laminated together in a stack configuration to define a multichip module. Testing is facilitated by connecting temporary interconnect wiring to an access surface of the multichip module. This temporary interconnect wiring electrically interconnects at least some semiconductor device chips within the module. Prior to burn-in stressing and testing, a separate electrical screening step occurs to identify any electrical defect in the connection between the temporary interconnect wiring and the multichip module. If an electrical defect is identified, various techniques for removing or isolating the defect are presented. Thereafter, burn-in stressing and simultaneous testing of the semiconductor chips within the multichip module occurs using the temporary interconnect wiring.