Abstract: An improved dynamic MOS RAM having a plurality of selection lines and data lines and a plurality of storage cells connected thereto, wherein each storage cell includes a storage capacitor having first and second plates, wherein the second plate is adapted to be coupled to a reference potential terminal; and a MOSFET having a semiconductor substrate, a gate connected to one of the selection lines, a first conduction terminal coupled to one of the data lines, and a second conduction terminal connected in common with a first plate of the storage capacitor, is disclosed. The first plate of the storage capacitor includes first doped polysilicon conductive layer that has the majority of its area separated from the semiconductor substrate of the MOSFET by at least an insulating layer. The second plate of the storage capacitor includes a second doped polysilicon conductive layer that is at least coextensive with and insulated from the first conductive layer.

Abstract: This disclosure is directed to an improved semiconductor capacitor structure especially useful in an integrated semiconductor structure with an MOS device and fabrication methods therefor. This semiconductor capacitor is particularly useful for forming the capacitor portion of a single MOS memory cell structure in a dynamic MOS random access memory which utilizes one MOS device in combination with a capacitor. In one specific disclosure embodiment, the semiconductor capacitor comprises a boron (P) implanted region in a substrate of P- type conductivity followed by a shallow arsenic (N) implant into the boron implanted region. The boron implanted region provides a P type conductivity which has a higher concentration of P type impurities than the concentration of impurities contained in the substrate which is of P- type conductivity.

Abstract: A floating gate memory cell has its control gate self-aligned to the floating gate in the source to drain direction and its floating gate self-aligned to the channel region in that direction and the direction transverse thereto without overlaying the field oxide.

Abstract: This disclosure is directed to an improved semiconductor capacitor structure especially useful in an integrated semiconductor structure with an MOS device and fabrication methods therefor. This semiconductor capacitor is particularly useful for forming the capacitor portion of a single MOS memory cell structure in a dynamic MOS random access memory which utilizes one MOS device in combination with a capacitor. In one specific disclosure embodiment, the semiconductor capacitor comprises a boron (P) implanted region in a substrate of P- type conductivity followed by a shallow arsenic (N) implant into the boron implanted region. The boron implanted region provides a P type conductivity which has a higher concentration of P type impurities than the concentration of impurities contained in the substrate which is of P- type conductivity.

Abstract: A floating gate memory cell has its control gate self-aligned to the floating gate in the source to drain direction and its floating gate self-aligned to the channel region in that direction and the direction transverse thereto without overlaying the field oxide.

Abstract: A charge coupled device is controlled to conserve energy during charge transfer. By connecting the storage electrode corresponding to the substrate region in which a charge packet is stored to an adjacent electrode, the potential at the storage electrode is reduced and the potential on the adjacent electrode is increased to a level where charge transfer is initiated to transfer a portion of the charge packet to the substrate region corresponding to the next adjacent storage electrode.

Abstract: In a memory circuit, first and second bit line portions, each having a plurality of memory cells coupled thereto as provided for reading and writing electrical potentials into and out of the coupled memory cells. A bistable flip-flop type sensing amplifier is coupled between the first and second bit portion for sensing the voltage difference therebetween and for latching into one of the two states in response to sensing either a "0" or a "1" accessed to one of the bit line portions from an addressed memory cell to be read out of the memory. A high input impedance amplifier is provided between the respective bit line portion and the respective input terminal of the sensing amplifier for isolating (buffering) the stray capacitance of the sensing amplifier circuit from the capacitance of its bit line. Switchable restore circuitry bypasses each of the isolating line amplifiers for the purposes of restoring electrical potentials read out of the addressed memory cells.

Abstract: In a memory circuit, first and second bit line portions, each having a plurality of memory cells coupled thereto are provided for reading and writing electrical potentials into and out of the coupled memory cells. A bistable flip-flop type sensing amplifier is coupled between the first and second bit portion for sensing the voltage difference therebetween and for latching into one of the two states in response to sensing either a "0" or a "1" accessed to one of the bit line portions from an addressed memory cell to be read out of the memory. A high input impedance amplifier is provided between the respective bit line portion and the respective input terminal of the sensing amplifier for isolating (buffering) the stray capacitance of the sensing amplifier circuit from the capacitance of its bit line. Switchable restore circuitry bypasses each of the isolating line amplifiers for the purposes of restoring electrical potentials read out of the addressed memory cells.