Abstract: A wafer-level cavity package with backside termination is disclosed. In one aspect, a package includes an air cavity that is adjacent to a substrate. Input/output (I/O) vias extend from the circuits in the air cavity through the substrate for connection to external pads for the package. A cap covers the air cavity and does not include metal conductors therethrough. By routing the vias through the substrate instead of the cap, numerous advantages are realized, including better thermal pathing, improved structural integrity of the cap, reductions in die and module stress, tighter frequency variation, enhanced yield, and options for shrinking overall package geometry.

Abstract: Systems and methods are disclosed herein to enable top-side and/or bottom-side cooling for double-sided molded (DSM) packages, thereby providing an enhanced thermal pathway to the ambient environment for densely packed DSM packages.

Abstract: Metal edge features on double-sided packages are disclosed. In one aspect, metal such as copper posts may be positioned in a double-sided laminate extending between packages during formation and prior to singulation. Then, during singulation, the post is sawn through. The posts may be used to provide wettable flanks on the side of the package to allow for an inspectable solder fillet. Alternatively, the posts may be used for greater structural integrity. By providing these edge-accessible metal features, designers are able to use double-sided packages with correspondingly small footprints in more environments, allowing for more flexibility in product design.

Abstract: The disclosure relates to a shielded electronic module which includes a module shielding structure and an electronic module with an interposer, a shielded electronic submodule over the interposer, and a module mold compound over the interposer and encapsulating sides of the shielded electronic submodule. Herein, the shielded electronic submodule includes an electronic submodule and a submodule side shielding structure, which covers sides of the electronic submodule to provide the sides of the shielded electronic submodule. A top surface of the electronic module is a combination of a top surface of the module mold compound and a top surface of the shielded electronic submodule, which is not covered by the module mold compound. The module shielding structure directly and continuously covers the top surface and sides of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the electronic submodule.

Abstract: Acoustic resonator packages are disclosed. A package may be formed with a plurality of devices having respective acoustic resonators. Acoustic devices in a first layer of acoustic devices may be relatively small and have correspondingly small pitches for the input/output (I/O) pins. This first layer of acoustic devices is mounted on a second layer formed from a single acoustic device. The single acoustic device in the second layer acts as a functional interposer for the first layer of acoustic devices. The single acoustic device may have a coarser pitch of I/O pins suitable for attachment to a laminate structure (e.g., a printed circuit board or the like) and provide interconnections between these coarser I/O pins to the fine pitch I/O pins of the devices in the first layer. Further, the single acoustic device may act as a heat spreader and/or heat sink for the acoustic devices in the first layer.

Abstract: The disclosure relates to a shielded electronic module which includes a module shielding structure and an electronic module with an interposer, a shielded electronic submodule over the interposer, and a module mold compound over the interposer and encapsulating sides of the shielded electronic submodule. Herein, the shielded electronic submodule includes an electronic submodule and a submodule side shielding structure, which covers sides of the electronic submodule to provide the sides of the shielded electronic submodule. A top surface of the electronic module is a combination of a top surface of the module mold compound and a top surface of the shielded electronic submodule, which is not covered by the module mold compound. The module shielding structure directly and continuously covers the top surface and sides of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the electronic submodule.

Abstract: The present disclosure relates to a multilevel system-in-package (SIP) module having a double-sided module and a redistribution structure located underneath the double-sided module. The double-sided module includes a laminate body, a top component attached to a top surface of the laminate body, a bottom component and multiple copper posts attached to a bottom surface of the laminate body, and a bottom mold compound formed on the bottom surface of the laminate body and at least encapsulating side surfaces of the bottom component and side surfaces of each copper post. A bottom surface of the bottom mold compound is a portion of a bottom surface of the double-sided module. The redistribution structure includes a redistribution layer with multiple patterned conductive features, which are separate from each other. Each patterned conductive feature is coupled to at least one of the bottom component and the copper posts.

Abstract: The disclosure relates to a shielded electronic module with compartmental integrated shielding. The disclosed shielded electronic module includes an electronic module having an interposer, a mold compound, a first device component, a second device component, and an interior shield wall, and a module shielding structure directly and completely covers a top surface and side surfaces of the electronic module. Herein, the first device component and the second device component are formed over a top surface of the interposer, and the mold compound resides over the top surface of the interposer and fully encapsulates the first device component and the second device component. The interior shield wall is a continuous metal sheet and extends vertically through the mold compound towards the top surface of the interposer to separate the first device component and the second device component. The module shielding structure is physically and electrically connected to the interior shield wall.

Abstract: The disclosure is directed to an electronic device with a solder interconnect and multiple material encapsulant. The electronic device includes a die last assembly with the die assembled to an electronic packaging substrate by a solder interconnect. At least a portion of a first dielectric material and the die are milled or ground, with a second dielectric material applied over an exposed portion of the die. A shield is then positioned over and electrically insulated from the die. Accordingly, such a configuration reduces a thickness or height of an electronic device with shielding and a die last assembly.

Abstract: Systems and methods for top side cooling for a power amplifier module are disclosed. The power amplifier module may be part of a system in a package that may be considered inverted relative to a normal orientation. A power amplifier die (and other elements) may be mounted on a metallization layer. Wire bond connections may communicatively couple the “top” of the power amplifier die to the metallization layer. A plated heat sink (PHS) laminate may be positioned “beneath” the power amplifier die in the metallization layer. The metallization layer may communicatively couple to vias that extend “up” and “above” the power amplifier die to a connection pad. The entire package is then inverted such that the connection pads may couple to a printed circuit board in a downward direction, and the PHS is now facing upward so that it may be coupled to a heat sink.

Abstract: The disclosure relates to a shielded electronic module which includes a module shielding structure and an electronic module with an interposer, a shielded electronic submodule over the interposer, and a module mold compound over the interposer and encapsulating sides of the shielded electronic submodule. Herein, the shielded electronic submodule includes an electronic submodule and a submodule side shielding structure, which covers sides of the electronic submodule to provide the sides of the shielded electronic submodule. A top surface of the electronic module is a combination of a top surface of the module mold compound and a top surface of the shielded electronic submodule, which is not covered by the module mold compound. The module shielding structure directly and continuously covers the top surface and sides of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the electronic submodule.

Abstract: The disclosure is directed to an electronic device with a solder interconnect and multiple material encapsulant. The electronic device includes a die last assembly with the die assembled to an electronic packaging substrate by a solder interconnect. At least a portion of a first dielectric material and the die are milled or ground, with a second dielectric material applied over an exposed portion of the die. A shield is then positioned over and electrically insulated from the die. Accordingly, such a configuration reduces a thickness or height of an electronic device with shielding and a die last assembly.

Abstract: A device including a piezoelectric substrate, an interdigital transducer (IDT), and an antireflective structure is disclosed herein. The piezoelectric substrate has a front-side surface and a smoothed back-side surface. The IDT is on the front-side surface of the piezoelectric substrate. The antireflective structure is over at least a portion of the smoothed back-side surface of the piezoelectric substrate. By having the antireflective structure on at least a portion of the smoothed back-side surface of the piezoelectric substrate, reflection of spurious bulk acoustic waves toward the front-side surface of the piezoelectric substrate can be reduced and/or eliminated to lessen interference with surface acoustic waves.

Abstract: A device including a piezoelectric substrate, an interdigital transducer (IDT), and an antireflective structure is disclosed herein. The piezoelectric substrate has a front-side surface and a smoothed back-side surface. The IDT is on the front-side surface of the piezoelectric substrate. The antireflective structure is over at least a portion of the smoothed back-side surface of the piezoelectric substrate. By having the antireflective structure on at least a portion of the smoothed back-side surface of the piezoelectric substrate, reflection of spurious bulk acoustic waves toward the front-side surface of the piezoelectric substrate can be reduced and/or eliminated to lessen interference with surface acoustic waves.

Abstract: The present disclosure relates to a packaging process using a low pressure encapsulant. According to an exemplary process, an assembly including a substrate, a surface mounted device (SMD) mounted on the substrate, and a space between the SMD and the substrate is provided. The SMD has a sealed cavity biased towards the substrate. A sheet mold compound is laid over the SMD and the assembly is heated such that the sheet mold compound transitions to a liquid phase to form a molten mold compound. Next, the assembly is subjected to a vacuum that creates a negative atmosphere allowing the molten mold compound to flow towards the top surface of the substrate and about the SMD. The molten mold compound is then pressed towards the substrate at a low pressure (<=2 Mpa) such that the space between the SMD and the substrate is substantially filled and the SMD is substantially encapsulated.

Abstract: The present disclosure relates to a packaging process using a low pressure encapsulant. According to an exemplary process, an assembly including a substrate, a surface mounted device (SMD) mounted on the substrate, and a space between the SMD and the substrate is provided. The SMD has a sealed cavity biased towards the substrate. A sheet mold compound is laid over the SMD and the assembly is heated such that the sheet mold compound transitions to a liquid phase to form a molten mold compound. Next, the assembly is subjected to a vacuum that creates a negative atmosphere allowing the molten mold compound to flow towards the top surface of the substrate and about the SMD. The molten mold compound is then pressed towards the substrate at a low pressure (<=2 Mpa) such that the space between the SMD and the substrate is substantially filled and the SMD is substantially encapsulated.

Abstract: Embodiments described herein may provide an acoustic wave device, a method of fabricating an acoustic wave device, and a system incorporating an acoustic wave device. The acoustic wave device may include a transducer disposed on a substrate, with a contact coupled with the transducer. The acoustic wave device may further include a wall layer and cap that define an enclosed opening around the transducer. A via may be disposed through the cap and wall layer over the contact, and a top metal may be disposed in the via. The top metal may form a pillar in the via and a pad on the cap above the via. The pillar may provide an electrical connection between the pad and the contact. In some embodiments, the acoustic wave device may be formed as a wafer-level package on a substrate wafer.

Abstract: Disclosed embodiments include a package having an electronic device disposed within a cavity formed by an enclosure that includes a sharp portion. The package may further include a photosensitive layer applied over the enclosure to provide a smooth portion that is adjacent to the sharp portion. Methods for manufacturing the package are also described. Other embodiments may be described and claimed.

Abstract: A textured whey protein product for use as a meat extender, meat analog, or snack food is prepared by thermoplastic extrusion of a composition containing whey protein and optionally an edible polysaccharide, such as cornstarch. Whey protein can also be mixed with other edible proteins in certain embodiments of the invention. Puffing of the extruded product results in an expanded snack food product. Methods of making the meat extender product and the snack food product are also shown.

Abstract: Methods, formulations and kits containing levulinate or levulinic acid are disclosed that have potent and unexpected properties to inhibit the growth and/or proliferation of Listeria monocytogenes bacteria in a food sample.