Abstract: A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-silicon vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.

Abstract: Three-dimensional (3D) neuromorphic computing systems are provided. A system includes a logic wafer having a plurality of processors. The system further includes a double-sided interposer bonded to the logic wafer and incorporating a signal port ring for sending and receiving signals. The system also includes a plurality of 3D memory modules bonded to the double-sided interposer. The double-sided interposer is a wafer scale or a panel scale providing communication between the plurality of processors and the plurality of 3D memory modules.

Abstract: A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-silicon vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.

Abstract: A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-hole vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.

Abstract: A method is provided to supply power to wafer-scale ICs. The method includes receiving a wafer containing ICs placed on the top of the wafer. The wafer has through-hole vias to provide power from the bottom to the ICs. The method also includes a printed circuit board, which has power rails in a pattern on the top of the printed circuit board, where the rails provide voltage and ground. The method continues with placing metal solder spheres between the bottom of the wafer and the top of the printed circuit board, where the spheres provide connections between the two, and where the spheres are free to move and operate as mechanical springs to resist clamping forces. The method also includes applying clamping pressure to the structure to establish connections by compressing the spheres, where no soldering is required.

Abstract: Three-dimensional (3D) neuromorphic computing systems are provided. A system includes a logic wafer having a plurality of processors. The system further includes a double-sided interposer bonded to the logic wafer and incorporating a signal port ring for sending and receiving signals. The system also includes a plurality of 3D memory modules bonded to the double-sided interposer. The double-sided interposer is a wafer scale or a panel scale providing communication between the plurality of processors and the plurality of 3D memory modules.

Abstract: A method of removing lesions by implanting a radioactive seed at the location of the lesion, locating the lesion with the radioactive seed, and removing the lesion with the radioactive seed. A kit is also provided by the present invention for use in removing lesions by implanting a radioactive seed at the location of the lesion, locating the lesion with the radioactive seed, and removing the lesion with the radioactive seed. Other embodiments of the invention include: a disposable needle preloaded with radioactive seed(s); and radioactive seeds comprising hooks to ensure proper localization of the seed(s) in the patient.

Abstract: A method of removing lesions by implanting a radioactive seed at the location of the lesion, locating the lesion with the radioactive seed, and removing the lesion with the radioactive seed.

Abstract: A method of removing lesions by implanting a radioactive seed at the location of the lesion, locating the lesion with the radioactive seed, and removing the lesion with the radioactive seed.

Abstract: A method of removing lesions by implanting a radioactive seed at the location of the lesion, locating the lesion with the radioactive seed, and removing the lesion with the radioactive seed.

Abstract: A method of removing lesions by implanting a radioactive seed at the location of the lesion, locating the lesion with the radioactive seed, and removing the lesion with the radioactive seed.

Abstract: A method of removing lesions by implanting a radioactive seed at the location of the lesion, locating the lesion with the radioactive seed, and removing the lesion with the radioactive seed.

Abstract: A method of decreasing the permeabilty of dentin by the application of an effective amount of oxalic acid potassium salt, dihydrate in an aqueous solution at a pH of about 2.0 to 4.0 to the dentin.

Abstract: A barrier device for a traffic bollard to protect movable secondary objects, such a vehicle doors, from damage during contact, such as when the doors are opened. Devices are provided which circumferentially span and connect to the bollard. Various attachment methods are taught, including the incorporation of the attachment device embedded in the device during the molding process. Alternatively, a trench design is disclosed to provide concealment of the attachment device following installation. The use of panels cut from the tread section of used vehicular tire casings is disclosed. One embodiment of this design bonds two such panels together placing the attachment apparatus secured longitudinally therebetween. Draw straps are disclosed as a practical attachment device. Printed images may be applied to the exterior surface to enhance the aesthetic appeal of the device or provide a platform for advertisement material.

Abstract: A composite encoder/syndrome generating circuit computes both check symbols and error syndromes using a single set of multiplier devices with varying tap weights having values that provide a maximum preselected error correction capability but is readily adjustable, such as by programmable latches, to eliminate from the circuit selectable multiplier devices to reduce the error correction capability without requiring a change in the tap weight values. The circuit may be used to increase or decrease error correction capability (a) according to which of a plurality of concentric bands of recording tracks is being accessed in a banded direct access data storage device, (b) according to noise level as sensed in a data communications channel having an output subject to noise, or (c) according to changes in sending rates in a sending device that sends data at variable rates.

Abstract: This invention is directed to a new and simplified method of installing a vehicle window glass in the glass carrier or regulator of a vehicle. By this method the glass can be mounted more securely and in considerably less time than has heretofore been required. An attachment member, preferably formed of plastic or nylon, is provided. The attachment member is reuseable permitting removal and replacement of the existing glass or a replacement glass. The attachment member has a central aperture and a plurality of circumferentially spaced axially extending angular prongs partially overlying the central aperture and having humps at about the mid-section of the extending surfaces. The inner ends of the axially extending members are of slightly less diameter than are the precut internal diameter of the apertures in the replacement window.

Abstract: This invention is directed to a new and simplified method of installing a vehicle window glass in the glass carrier or regulator of a vehicle. By this method the glass can be mounted more securely and in considerably less time than has heretofore been required. A flat washer shaped member, preferably formed of nylon, and having a central aperture and a plurality of circumferentially spaced axially extending angular projections partially overlying the central aperture and having humps at about the mid-section of the axially extending surfaces have become known as "window things", because they do so many good things so well. The inner ends of the axially extending members are of slightly less diameter than are the precut internal diameter of the holes in the replacement window. These members, being formed of nylon, will deflect inwardly sufficiently to permit the slightly enlarged humps of the "window things" to be snapped through the precut holes in the replacement windows.

Abstract: A method and apparatus for multiplying an N bit number X(t) by an M bit number O, and a method for making such an apparatus for multiplying numbers are described. The N bit number is partitioned into K non-overlapping bit groups having priorities ranging from 0, which corresponds to the least significant bits in the value X(t), to K-1, which corresponds to the most significant bits in the value X(t). Each bit group functions as an address which accesses a first value in a respective Look Up Table (LUT). The values from the respective LUTs represent a sum of a constant, which is different for different LUTs, and the product of C and the binary value of the bit group to which the LUT corresponds. The values of the LUTs are added together, effectively bit shifted in accordance with their relative priorities, to form a partial product. The process is repeated with the remaining bit groups of X(t) in their order of priority, highest to lowest. An adder partial products until a single result is obtained.

Abstract: Deflector at top of toasting chamber enhances flow of cooling air in a space between the outer cover of a toaster and the inner wall of a "double wall" structure by projection inward relative to the top opening in the toaster cover.

Abstract: Utilization of a standard, portable oxygen tank and regulator in an emergency respiratory system including an endotracheal adaptor in fluid communication with the regulator and having a first, flexible tube insertable in the windpipe of a patient undergoing emergency treatment, and a second flexible, manually-operable tube attached to the adaptor in opposed relation to the first tube and compressible to direct the oxygen flowing between the regulator and adaptor into the patient's lungs by way of the first tube.