Abstract: A carrier for mass transferable semiconductor substrate processing and handling comprises a two part shell including top and bottom semicylindrical halves made from clear fused quartz tubing and releasably assembled to form a cylindrical shell. A semiconductor substrate carrier is removably suspendable in the shell when assembled, and includes four clear fused quartz rods having axially running slots for supporting substrates and clear fused quartz end braces connected to the ends of the rods and clear fused quartz pick-up tubes connected to the end braces.