Abstract: An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity.

Abstract: An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity.

Abstract: An improved thermoplastic molding composition is provided which is particularly suited for use in the impervious void-free encapsulation on a relatively expeditious basis of an electronic component wherein the preformed electronic component is positioned in a mold cavity prior to the introduction of the molding composition via injection molding. The molding composition comprises a melt processable thermotropic liquid crystalline polymer which is of a relatively low weight average molecular weight of approximately 4,000 to 25,000 (e.g. approximately 4,000 to 10,000) and which is substantially incapable of further chain growth upon heating. Uniformly dispersed within the liquid crystalline polymer is approximately 40 to 80 percent by weight (e.g. approximately 50 to 75 percent by weight) of a particulate inorganic material (preferably of silicon dioxide) which serves to advantageously decrease its volumetric coefficient of thermal expansion and to advantageously increase its thermal conductivity.

Abstract: There is disclosed an improved modified polymer suitable for use in making hollow containers by conventional extrusion blow molding. It is a specific type of end-capped and branched polyethylene terephthalate polymer or copolymer. In the improvement, the end-cap comprises the reacted component of a difunctional acid or alkali metal salt of a difunctional acid having the formula: ##STR1## wherein: X has a valency of 6 and is selected from sulfur, selenium, and tellurium;M is an alkali metal or hydrogen; andY is hydrogen or an aliphatic group containing from 1 to 18 carbon atoms.The preferred difunctional acid is m-sulfobenzoic acid. The product typically contains few large gels having diameters greater than 0.1 mm.

Abstract: There is disclosed an improved modified polymer suitable for use in making hollow containers by conventional extrusion blow molding. It is a specific type of end-capped and branched polyethylene terephthalate polymer or copolymer. In the improvement, (a) the end-cap comprises the reacted component of a monofunctional acid having a normal boiling point or sublimation point less than above about 200.degree. C.; and (b) the monofunctional acid is an aromatic monocarboxylic acid having the formula: ##STR1## wherein: R.sub.3 and/or R.sub.5 is an alkoxy group containing from 1 to 10 carbon atoms; and, the remaining R's are hydrogen. The preferred monocarboxylic acid is m-anisic acid. The product typically contains few large gels having diameters greater than 0.1 mm.