Abstract: An apparatus for dispensing groups of integrated circuit (IC) packages in a pattern and quantity corresponding to the pattern of unpopulated IC sockets on a printed circuit board. The apparatus includes a plurality of storage racks stacked one on top of another, with each rack corresponding to one row of socket positions on the unpopulated printed circuit board. Each storage rack includes a number of loaded IC dispenser magazines corresponding to the number of positions in that rack's corresponding row of socket positions which are to be populated with IC packages. The storage racks are normally supported at an acute angle which is less than that at which IC packages will slide down the dispenser magazines. The bottom storage rack includes a handle and it is pivotable at its lower end. When the assembler-operator pulls up on the handle, the storage racks are pivoted to an angle at which one component is dispensed from each dispenser magazine.

Abstract: A crimping head for use in tools for crimping removable crimp style electrical socket contacts is disclosed. The head includes a tail crimper affixed to a frame for shaping the contact's tail section into a probe hook. A tail anvil, slidably mounted on the frame and engagable against the tail crimper, compresses the tail section against the tail crimper to form the probe hook. Upper and lower crimping jaws, attached to the tail crimper and tail anvil, respectively, crimp the contact onto the end of a wire as the tail section is simultaneously formed into the probe hook.

Abstract: The tool includes a limiting block, on one side of which is affixed a first gripping arm for grasping a first underside of the IC package. A second gripping arm is engagable with the second side of the limiting block for grasping the second underside of the IC package. Positioned above the limiting block, between the inner surfaces of the gripping arms, is an alignment head which supports the removal tool on the upper surface of the printed circuit board and positions the gripping arms in proper position to grasp the undersides of the IC package. Positioned above the alignment head and journaled between the gripping arms is a cylindrical cam having eccentric pivot points. To remove an IC package from a socket, the tool is positioned on the PC board with the legs of the alignment head straddling the ends of the IC socket. The second gripping arm is then engaged, causing the first and second gripping arms to grip opposite undersides of the IC package.

Abstract: An apparatus for simultaneously partially stripping the insulation from the ends of a plurality of wires in a twisted wire cable comprising a first clamp which clamps the midpoint of a length of the twisted wire cable and second and third clamps which clamp the wire ends to position them properly between stripper blades attached to the second and third clamps. The second and third clamps are mounted so they may be slid along a rail. Air activated cylinders pull the second and third clamps in a direction away from the midpoint of the twisted wire cable, partially stripping the insulation. Also disclosed is a modification to the air cylinders which allows the apparatus to simultaneously fully strip and untwist the ends of the wires.