Abstract: A communication device for event participants includes a communication module and a controller coupled to the communication module. The controller is configured to at least one of receive and generate a list of messages for an event participant, store the list of messages in the communication device, receive event information through the communication module, and modify the list of messages based on the received event information.

Abstract: A communication device for event participants includes a communication module and a controller coupled to the communication module. The controller is configured to at least one of receive and generate a list of messages for an event participant, store the list of messages in the communication device, receive event information through the communication module, and modify the list of messages based on the received event information.

Abstract: A hinge assembly and door closure assembly. The assembly generally includes fork members with slots to receive a connector and gears, where one or more pins pivotally couple the gears and connector to the fork members, and where the connector maintains the gears in meshing engagement through substantially 360 degrees of pivotal movement between the fork members. The closure assembly generally includes a rack and pinion, a biasing mechanism, a slider mechanism, and an arm pivotally coupled to the slider mechanism and the pinion, wherein the arm rotates the pinion in response to pivoting of the door, and where rotation of the pinion causes the rack to move against the force of biasing mechanism.

Abstract: An integrated circuit device (10) with a bonding surface (12) directly over its active circuitry, and a method of making such integrated circuits (FIGS. 2A-2E). To make the bonding surface (12), a wafer (20) is provided with vias (24) to its metallization layer (21) and then coated with a seed metal layer (25). A plating pattern (26) is formed on the wafer (20), exposing portions of the seed metal layer (25) and blocking the rest of the seed metal layer (25). These exposed portions are plated with successive metal layers (27, 28, 29), thereby forming a bonding surface (12) having a number of layered stacks (200) that fill the vias (24). The plating pattern and the nonplated portions of the seed metal layer (25) are then removed.

Abstract: An integrated circuit device (10) with a bonding surface (12) directly over its active circuitry, and a method of making such integrated circuits (FIGS. 2A-2E). To make the bonding surface (12), a wafer (20) is provided with vias (24) to its metallization layer (21) and then coated with a seed metal layer (25). A plating pattern (26) is formed on the wafer (20), exposing portions of the seed metal layer (25) and blocking the rest of the seed metal layer (25). These exposed portions are plated with successive metal layers (27, 28, 29), thereby forming a bonding surface (12) having a number of layered stacks (200) that fill the vias (24). The plating pattern and the nonplated portions of the seed metal layer (25) are then removed.

Abstract: A method and apparatus for uniformly solder plating leads on semiconductor packages wherein the leads are rotated during the solder plating process and the solder on the leads in planarized and solder between and bridging the leads is removed by the application of a hot gas to the device having the leads. The hot gas is preferably N2 which is inert to the process flow at the point in the process when it is utilized.

Abstract: A ring and ball tossing game apparatus is provided for use in playing a ring and ball tossing game according to a method of play. The game apparatus includes a ring-shaped element called a “root”, at least two stakes, and a ball. The root has a shape which permit easier rolling of the ball into the root. The game is played by players on opposing teams standing behind their respective stakes which are separated a distance apart, throwing the root toward their opponent's stake, and then throwing the ball toward either the root or the opponent's stake. Points are scored according to where the root and ball land, how they land, what they contact, and where the ball travels when it is tossed or thrown. Game play ends when a player's score reaches a set number of points or when a player lands the ball within the root which itself encircles the opponent's stake.

Abstract: A seal setting mechanism is provided that includes a pair of cross-members and a pair of downwardly extending force transfer members. The cross-members are linked with a linking member. When the cross-members are pivoted downwardly, the force is transferred through the force transfer members to a spring associated with each force transfer member. The spring applies a force on a sealing member. The sealing member is thus pressed against the floor, and held in place by the springs.

Abstract: A plastic packaged integrated circuit (20) having a thick copper plated top surface level interconnection structure. A semiconductor integrated circuit (20) is formed having devices at the surface of a semiconductor substrate (23). First and second metallization layers (27, 31) are formed over the substrate and contacting selected ones of said devices. The first and second levels of metallization may be in contact with one another through vias. A thick top surface level metal interconnect layer (35) is then formed over the second metal layer (31), either physically contacting it or selectively electrically contacting it. The surface level metal (35) is fabricated of a highly conductive copper layer. The thick surface level metal layer (35) substantially lowers the resistance of the interconnect metallization of the device (20) and further eliminates current debiasing and early failure location problems experienced with integrated circuits of the prior art.

Abstract: A plastic packaged integrated circuit (20) having a thick copper plated top surface level interconnection structure. A semiconductor integrated circuit (20) is formed having devices at the surface of a semiconductor substrate (23). First and second metallization layers (27, 31) are formed over the substrate and contacting selected ones of said devices. The first and second levels of metallization may be in contact with one another through vias. A thick top surface level metal interconnect layer (35) is then formed over the second metal layer (31), either physically contacting it or selectively electrically contacting it. The surface level metal (35) is fabricated of a highly conductive copper layer. The thick surface level metal layer (35) substantially lowers the resistance of the interconnect metallization of the device (20) and further eliminates current debiasing and early failure location problems experienced with integrated circuits of the prior art.

Abstract: A vertical movement accommodating apparatus for use with a wall panel includes a cap mounted on a ceiling structure of a room, and a support assembly mounted on a top edge of the wall panel and at least partially disposed within the cap for vertical movement with respect to the cap. The cap is a U-shaped member opening down. The support assembly includes an upper rail, a lower rail, and a truss assembly interconnecting the upper and lower rails. A sealing member is disposed between the upper rail and the cap to provide a sound reducing seal therebetween. The lower rail defines a channel in which a roller mounted on the upper edge of the wall panel is allowed to roll in the longitudinal direction.

Abstract: A thick plated interconnect (80) may be fabricated by forming a metal layer (20) above a semiconductor layer (12). A dielectric layer (22) may be formed on the metal layer (20). A via (24) may be formed in the dielectric layer (22) to expose the metal layer (20). A copper lead (50) may be formed electrically coupled to the metal layer (20) through the via (24) of the dielectric layer (22). A barrier member (88) may be formed on the copper lead (50). A bondable member (86) comprising aluminum may be formed on the barrier member (88).

Abstract: A thick plated interconnect (80) comprising a copper lead (50) and a bonding cap (84) coupled to the copper lead (50). The bonding cap (84) may include a bondable member (86) formed from a bondable layer (62) comprising aluminum. A barrier member (88) may be formed from a barrier layer (60). The barrier member (88) may be disposed between the bondable member (86) and the copper lead (50).

Abstract: A multi-layered iridescent reflective coating for a fishing lure and the method for applying the coating to the surface of the lure. The coating preferably comprises a base layer, an optical stack comprising at least 3 layers of refractive material, and a protective layer. The layers of refractive material are vacuum deposited on a lure pre-coated with an ultraviolet cured polymer base layer. The optical stack can be applied to painted lures, pre-colored lures, or undecorated lures. The substrate, or lure surface, does not affect the process but can yield varying iridescent effects, depending on the texture and color of the substrate surface. The relative thickness of each optical layer and its relation to the other layers in the optical stack combine to achieve a variety of iridescent effects. A protective layer having a low refractive index is applied over the finished optical stack.

Abstract: A ring and ball tossing game apparatus is provided for use in playing a ring and ball tossing game according to a method of play. The game apparatus includes a ring-shaped element called a "root", at least two stakes, and a ball. The root has a shape which permit easier rolling of the ball into the root. The game is played by players on opposing teams standing behind their respective stakes which are separated a distance apart, throwing the root toward their opponent's stake, and then throwing the ball toward either the root or the opponent's stake. Points are scored according to where the root and ball land, how they land, what they contact, and where the ball travels when it is tossed or thrown. Game play ends when a player's score reaches a set number of points or when a player lands the ball within the root which itself encircles the opponent's stake.

Abstract: A bond pad (18, 58) may comprise a base (20, 60) of bondable material. The base (20, 60) may have a periphery (26, 66). A segment of an interconnect (24, 64) may contact an extended section (28, 68) of the periphery (26, 66) to electrically couple the interconnect (24, 64) to the bond pad (18,58). The interconnect (24, 64) may comprise a material less resistive than the bondable material.

Abstract: A Plug-and-Play (PnP) configuration driver initilization routine and PnP configuration utility for use in PCI bus architectures supporting dynamic I/O bus configurations. The PnP configuration driver includes a logical-to-physical PCI bus mapping scheme maintaining a PCI bus mapping table, and creating a logical-to-physical map table at start-of-day. PCI device drivers access devices through the logical bus numbers, thereby avoiding errors resulting when physical bus numbers change as a result of the addition or removal of buses within a computer system supporting dynamic I/O bus configurations.

Abstract: The invention is to a header for a power semiconductor device and a method for making the header. A ground pin is mounted or formed on the header mounting base and a header ground lead is placed over the ground pin and fused to the pin by a laser beam.

Abstract: A steam cooker processes large quantities of food products such as meat, fish, poultry and produce passed therethrough in a spiral conveyor path. The continuously running conveyor is provided with loading and unloading stations outside the cooker and with a continuously operable spray detergent cleaning bath.Efficient cooking is achieved without loss of humidity, flavor or appearance by maintaining water drop free steam at near 100.degree. C. and 100% humidity at a pressure greater than atmospheric and by features of the apparatus including control of steam flow out of the cooking chamber and introduction of cold air thereinto.Two separate steam sources, internal and external, are provided with the internal source comprising a heated pool of water on the floor of the cooker chamber, which is agitated for heat transfer efficiency and to remove fat or drippings from the cooking products.