Abstract: A wellbore pumping unit comprising a main pump, a power source, a controller, and a plurality of sensors is provided. A method of performing a diagnostic check of the unit controller and the plurality of sensors when power is applied to the unit controller. A diagnostic application executing in memory writes a status of the plurality of analog inputs of a plurality of valve position sensors, a status of a plurality of frequency inputs of a plurality of flowmeters, and a plurality of calibration data files that correlate to a plurality of sensors to a diagnostic report file. The status of the sensor inputs and calibration data files can be a pass or a fail. The status of the sensor inputs can be displayed on a human machine interface.

Abstract: A fuel injector for a turbine engine includes a fuel scheduling valve configured for regulation of fuel flow from a fuel inlet in response to fuel pressure received at the fuel inlet. Primary and secondary fuel circuits receive fuel from the scheduling valve, and an electrically-controlled valve is provided in fluid communication with the primary circuit, adapted and configured to actively control fuel through the primary circuit in response to a control signal.

Abstract: A fuel injector for a turbine engine includes a fuel scheduling valve configured for regulation of fuel flow from a fuel inlet, in response to fuel pressure received at the fuel inlet. Primary, secondary and auxiliary fuel circuits receive fuel from the scheduling valve, and an electrically-controlled valve is provided in fluid communication with the auxiliary circuit, which electrically-controlled valve is adapted and configured to actively control fuel through the auxiliary circuit in response to a control signal.

Abstract: A system includes an injector having a scheduling valve assembly and a nozzle in fluid communication with the valve assembly. The scheduling valve assembly is configured for regulation of flow from an inlet of the injector to the nozzle. An electromagnetic device is operatively connected to a hydromechanical valve spool of the valve assembly to selectively adjust position of the valve spool in the valve assembly.

Abstract: A fuel injector for a turbine engine includes a fuel scheduling valve configured for regulation of fuel flow from a fuel inlet in response to fuel pressure received at the fuel inlet. Primary and secondary fuel circuits receive fuel from the scheduling valve, and an electrically-controlled valve is provided in fluid communication with the primary circuit, adapted and configured to actively control fuel through the primary circuit in response to a control signal.

Abstract: A system includes an injector having a scheduling valve assembly and a nozzle in fluid communication with the valve assembly. The scheduling valve assembly is configured for regulation of flow from an inlet of the injector to the nozzle. The injector includes two fluid circuits between the inlet of the injector and two respective outlets of the nozzle for staged flow output from the nozzle. A first one of the two fluid circuits is a primary circuit, and a second one of the two fluid circuits is a secondary circuit. A solenoid valve is connected in fluid communication with the scheduling valve assembly, wherein the solenoid valve is configured to adjust position of a hydromechanical valve spool of the valve assembly.

Abstract: A system includes an injector including a scheduling valve assembly and a nozzle in fluid communication with the valve assembly. The scheduling valve assembly is configured for regulation of flow from an inlet of the injector to the nozzle. The injector includes one fluid circuit between the inlet of the injector and a respective outlet of the nozzle. A solenoid valve is connected in fluid communication with the scheduling valve assembly. The solenoid valve is configured to adjust position of a hydromechanical valve spool of the valve assembly.

Abstract: A system includes an injector having a scheduling valve assembly and a nozzle in fluid communication with the valve assembly. The scheduling valve assembly is configured for regulation of flow from an inlet of the injector to the nozzle. The injector includes two fluid circuits between the inlet of the injector and two respective outlets of the nozzle for staged flow output from the nozzle. A first one of the two fluid circuits is a primary circuit, and a second one of the two fluid circuits is a secondary circuit. A solenoid valve is connected in fluid communication with the scheduling valve assembly, wherein the solenoid valve is configured to adjust position of a hydromechanical valve spool of the valve assembly.

Abstract: A fuel injector for a turbine engine includes a fuel scheduling valve configured for regulation of fuel flow from a fuel inlet in response to fuel pressure received at the fuel inlet. Primary and secondary fuel circuits receive fuel from the scheduling valve, and an electrically-controlled valve is provided in fluid communication with the primary circuit, adapted and configured to actively control fuel through the primary circuit in response to a control signal.

Abstract: A system includes an injector having a scheduling valve assembly and a nozzle in fluid communication with the valve assembly. The scheduling valve assembly is configured for regulation of flow from an inlet of the injector to the nozzle. The injector includes two fluid circuits between the inlet of the injector and two respective outlets of the nozzle for staged flow output from the nozzle. A first one of the two fluid circuits is a primary circuit, and a second one of the two fluid circuits is a secondary circuit. A solenoid valve is connected in fluid communication with the scheduling valve assembly, wherein the solenoid valve is configured to adjust position of a hydromechanical valve spool of the valve assembly.

Abstract: An automatic closet system for inventorying, storing, retrieving, tracking and chronologically monitoring items of clothing to and from a closet storage area with the system including a track that extends around the inner perimeter of the storage area with the track having front and rear guides. A chain is positioned on the rear track guide and is driven by a motor. Hanger carriers are disposed in the track and receive hangars therein. The carrier includes sensors used to detect and track each hanger and the garment thereon.

Abstract: A communication device for event participants includes a communication module and a controller coupled to the communication module. The controller is configured to at least one of receive and generate a list of messages for an event participant, store the list of messages in the communication device, receive event information through the communication module, and modify the list of messages based on the received event information.

Abstract: A communication device for event participants includes a communication module and a controller coupled to the communication module. The controller is configured to at least one of receive and generate a list of messages for an event participant, store the list of messages in the communication device, receive event information through the communication module, and modify the list of messages based on the received event information.

Abstract: A hinge assembly and door closure assembly. The assembly generally includes fork members with slots to receive a connector and gears, where one or more pins pivotally couple the gears and connector to the fork members, and where the connector maintains the gears in meshing engagement through substantially 360 degrees of pivotal movement between the fork members. The closure assembly generally includes a rack and pinion, a biasing mechanism, a slider mechanism, and an arm pivotally coupled to the slider mechanism and the pinion, wherein the arm rotates the pinion in response to pivoting of the door, and where rotation of the pinion causes the rack to move against the force of biasing mechanism.

Abstract: An integrated circuit device (10) with a bonding surface (12) directly over its active circuitry, and a method of making such integrated circuits (FIGS. 2A-2E). To make the bonding surface (12), a wafer (20) is provided with vias (24) to its metallization layer (21) and then coated with a seed metal layer (25). A plating pattern (26) is formed on the wafer (20), exposing portions of the seed metal layer (25) and blocking the rest of the seed metal layer (25). These exposed portions are plated with successive metal layers (27, 28, 29), thereby forming a bonding surface (12) having a number of layered stacks (200) that fill the vias (24). The plating pattern and the nonplated portions of the seed metal layer (25) are then removed.

Abstract: An integrated circuit device (10) with a bonding surface (12) directly over its active circuitry, and a method of making such integrated circuits (FIGS. 2A-2E). To make the bonding surface (12), a wafer (20) is provided with vias (24) to its metallization layer (21) and then coated with a seed metal layer (25). A plating pattern (26) is formed on the wafer (20), exposing portions of the seed metal layer (25) and blocking the rest of the seed metal layer (25). These exposed portions are plated with successive metal layers (27, 28, 29), thereby forming a bonding surface (12) having a number of layered stacks (200) that fill the vias (24). The plating pattern and the nonplated portions of the seed metal layer (25) are then removed.

Abstract: A method and apparatus for uniformly solder plating leads on semiconductor packages wherein the leads are rotated during the solder plating process and the solder on the leads in planarized and solder between and bridging the leads is removed by the application of a hot gas to the device having the leads. The hot gas is preferably N2 which is inert to the process flow at the point in the process when it is utilized.

Abstract: A ring and ball tossing game apparatus is provided for use in playing a ring and ball tossing game according to a method of play. The game apparatus includes a ring-shaped element called a “root”, at least two stakes, and a ball. The root has a shape which permit easier rolling of the ball into the root. The game is played by players on opposing teams standing behind their respective stakes which are separated a distance apart, throwing the root toward their opponent's stake, and then throwing the ball toward either the root or the opponent's stake. Points are scored according to where the root and ball land, how they land, what they contact, and where the ball travels when it is tossed or thrown. Game play ends when a player's score reaches a set number of points or when a player lands the ball within the root which itself encircles the opponent's stake.

Abstract: A seal setting mechanism is provided that includes a pair of cross-members and a pair of downwardly extending force transfer members. The cross-members are linked with a linking member. When the cross-members are pivoted downwardly, the force is transferred through the force transfer members to a spring associated with each force transfer member. The spring applies a force on a sealing member. The sealing member is thus pressed against the floor, and held in place by the springs.

Abstract: A plastic packaged integrated circuit (20) having a thick copper plated top surface level interconnection structure. A semiconductor integrated circuit (20) is formed having devices at the surface of a semiconductor substrate (23). First and second metallization layers (27, 31) are formed over the substrate and contacting selected ones of said devices. The first and second levels of metallization may be in contact with one another through vias. A thick top surface level metal interconnect layer (35) is then formed over the second metal layer (31), either physically contacting it or selectively electrically contacting it. The surface level metal (35) is fabricated of a highly conductive copper layer. The thick surface level metal layer (35) substantially lowers the resistance of the interconnect metallization of the device (20) and further eliminates current debiasing and early failure location problems experienced with integrated circuits of the prior art.