Abstract: Described are ultrasound transducer modules and handheld ultrasound imagers including thermal and acoustic management features to produce high quality ultrasound images in a portable, handheld form factor.

Abstract: Described are ultrasound transducer modules and handheld ultrasound imagers including thermal and acoustic management features to produce high quality ultrasound images in a portable, handheld form factor.

Abstract: Described are ultrasound transducer modules and handheld ultrasound imagers including thermal and acoustic management features to produce high quality ultrasound images in a portable, handheld form factor.

Abstract: A transducer probe is presented. The transducer probe includes a housing having at least one curved surface at a first end. Further, the transducer probe includes a transducer unit including a plurality of electro-acoustic modules and configured to emit ultrasound signals towards a target volume. Also, the transducer probe includes at least one interconnect configured to electrically couple the transducer unit to a probe cable. Furthermore, the transducer probe includes an acoustic standoff positioned between the transducer unit and the curved surface of the housing and configured to propagate the ultrasound signals with minimal attenuation, minimal refraction, or both.

Abstract: An ultrasound transducer array for an ultrasound probe is presented. The ultrasound transducer array includes a support structure. Further, the ultrasound transducer array includes a plurality of electro-acoustic modules coupled to the support structure, wherein each of the plurality of electro-acoustic modules comprises at least one matrix acoustic array and an interconnect element, wherein each of the plurality of electro-acoustic modules is interchangeable on the support structure so as to adapt to one or more shapes of the ultrasound probe, and wherein each of the plurality of electro-acoustic modules operates in a manner substantially identical to each other of the plurality of electro-acoustic modules.

Abstract: A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.

Abstract: An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

Abstract: A method for forming a tileable detector array is presented.

Abstract: An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.

Abstract: An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

Abstract: An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.

Abstract: An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

Abstract: The present invention provides novel filled silicone compositions comprising a nano-particulate metal oxide filler selected from nano-particulate monoclinic alpha-phase bismuth oxide, nano-particulate erbium oxide, and mixtures thereof. The new composite compositions exhibit a combination of outstanding performance characteristics in both the cured and uncured states. Thus, the uncured formulations are typically free flowing liquids which are self-leveling, which de-gas readily under vacuum, are readily colorable through the addition of pigments, and which cure at temperatures of about 60° C. The cured compositions possess outstanding acoustic characteristics which make them ideally suited for use in applications such as acoustic lenses for medical imaging and therapy. For example, the acoustic impedance of compositions provided by the present invention is closely matched to the acoustic impedance of human tissue.

Abstract: A system for improving the acoustic performance of an ultrasound transducer by reducing artifacts within the acoustic spectrum is disclosed. The system includes an acoustic layer having an array of acoustic elements, a dematching layer coupled to the acoustic layer and having an acoustic impedance greater than an acoustic impedance of the acoustic layer, and an interposer layer coupled to the dematching layer and comprising a substrate and a plurality of conductive element. The interposer layer is formed to have an acoustic impedance lower than the acoustic impedance of the dematching layer. The ultrasound transducer also includes an integrated circuit coupled to the interposer layer and electrically connected to the array of acoustic elements through the dematching layer and the interposer layer.

Abstract: A method for forming a tileable detector array is presented.

Abstract: A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.

Abstract: The present invention provides novel filled silicone compositions comprising a nano-particulate metal oxide filler selected from nano-particulate monoclinic alpha-phase bismuth oxide, nano-particulate erbium oxide, and mixtures thereof. The new composite compositions exhibit a combination of outstanding performance characteristics in both the cured and uncured states. Thus, the uncured formulations are typically free flowing liquids which are self-leveling, which de-gas readily under vacuum, are readily colorable through the addition of pigments, and which cure at temperatures of about 60° C. The cured compositions possess outstanding acoustic characteristics which make them ideally suited for use in applications such as acoustic lenses for medical imaging and therapy. For example, the acoustic impedance of compositions provided by the present invention is closely matched to the acoustic impedance of human tissue.

Abstract: The present invention provides novel filled silicone compositions comprising a nano-particulate metal oxide filler selected from nano-particulate monoclinic alpha-phase bismuth oxide, nano-particulate erbium oxide, and mixtures thereof. The new composite compositions exhibit a combination of outstanding performance characteristics in both the cured and uncured states. Thus, the uncured formulations are typically free flowing liquids which are self-leveling, which de-gas readily under vacuum, are readily colorable through the addition of pigments, and which cure at temperatures of about 60° C. The cured compositions possess outstanding acoustic characteristics which make them ideally suited for use in applications such as acoustic lenses for medical imaging and therapy. For example, the acoustic impedance of compositions provided by the present invention is closely matched to the acoustic impedance of human tissue.

Abstract: A system for improving the acoustic performance of an ultrasound transducer by reducing artifacts within the acoustic spectrum is disclosed. The system includes an acoustic layer having an array of acoustic elements, a dematching layer coupled to the acoustic layer and having an acoustic impedance greater than an acoustic impedance of the acoustic layer, and an interposer layer coupled to the dematching layer and comprising a substrate and a plurality of conductive element. The interposer layer is formed to have an acoustic impedance lower than the acoustic impedance of the dematching layer. The ultrasound transducer also includes an integrated circuit coupled to the interposer layer and electrically connected to the array of acoustic elements through the dematching layer and the interposer layer.

Abstract: An ultrasound probe includes a transducer comprising an array of transducer elements removably disposed in a head portion. At least one or more stages of electronic circuit units is removably coupled to the transducer and configured to excite the transducer. A handle portion is detachably coupled to the head portion. The head portion and the handle portion are disposed enclosing the at least one or more stages of electronic circuit units. The ultrasound probe is used for one dimensional applications, two dimensional applications, and volumetric applications.