Abstract: Structure and method for temporarily holding at least one integrated circuit chip during packaging thereof are presented. A support plate has a release film secured to a main surface thereof. The support plate and release film allow UV light to pass therethrough. A UV curable chip adhesive is disposed over the release film for holding the at least one integrated circuit chip. After placement of the at least one integrated circuit chip in the WV curable chip adhesive, the WV curable chip adhesive is cured by WV light shone through the support plate and release film. As one example, the release film includes a WV release adhesive and the WV curable chip adhesive and UV release adhesive have a differential response to UV light which allows curing of the WV curable chip attach without release of the UV release adhesive.