Abstract: Mounting and supporting a solar panel. At least some of the illustrative embodiments are apparatuses including: a solar module comprising a cover layer; a solar array defining a first and a second side, the first side of the solar array coupled to the cover layer; a back cover that defines an inside surface and an outside surface opposite the inside surface, the inside surface coupled to the second side of the solar array; the cover layer, solar array and back cover together define an outer perimeter and a back cover plane; a first mounting flange coupled to the outside surface of the back cover, the first mounting flange extends outward beyond the outer perimeter; and a second mounting flange coupled to the outside surface of the back cover, the second mounting flange extends outward beyond the perimeter in a direction opposite the first mounting flange.

Abstract: Embodiments of the invention contemplate the formation of a high efficiency solar cell using novel methods to form metal contact structures of the solar cell device. In one embodiment, a solar cell device includes a substrate comprising a doped semiconductor material, a surface formed on the substrate having a second doped semiconductor layer having a conductivity type opposite to the first doped semiconductor material, a dielectric layer disposed on the surface of the substrate, a metal contact structure formed in the dielectric layer with a first predetermined cross sectional area, and a metal line formed on the metal contact structure with a second predetermined cross sectional area, wherein the second predetermined cross sectional area is larger than the first predetermined cross sectional area.

Abstract: In one embodiment, a solar cell module comprises a plurality of solar cells interconnected as a solar cell array. An interconnect assembly electrically connects the backsides of two adjacent solar cells. The interconnect assembly may have an interconnect that electrically connects a contact point on a backside of a solar cell to a contact point on a backside of another solar cell. The interconnect assembly may further include an interconnect shield placed between the solar cells and the interconnect.

Abstract: Transparent conductors for use in a variety of different photovoltaic devices are disclosed, comprising at least one ZnO transparent conductor layer having a predetermined level of haziness achieved, e.g., through appropriate variation in the parameters employed in formation of the transparent conductor (for example, by chemical vapor deposition) and/or through treatment of the transparent conductor subsequent to its formation. The concentration and/or relative rate of introduction of dopant during the deposition of the transparent conductor may be adjusted to prepare films having the desired morphology and/or structure. Alternatively, the morphology, composition and/or structure of the transparent conductor may be modified by suitable post-formation treatments. A combination of at least two transparent layers may also be employed, comprising at least a first layer designed primarily to maximize the optical properties and at least a second layer designed to maximize the electrical properties.

Abstract: A thin film photovoltaic module has transparent electrodes on front and back surfaces of a semiconductive layer. In one embodiment, both transparent electrodes pass light to the semiconductive layer for photovoltaic purposes. In another embodiment, the back electrode passes light which enters through the front electrode and is not absorbed by the semiconductive layer, so that the module is selectively transparent to the unabsorbed light. The spectral makeup of the transmitted light is controlled by controlling the optical characteristics of the layers of the module. The index of refraction of the back electrode is a primary source of transmission control, along with the refractive index of the front electrode and the thickness of the semiconductive layer itself. Light transmitted by the module can be used for nonphotovoltaic purposes, such as illuminating the interior of a vehicle or dwelling, or may be directed back into the semiconductive layer by a reflective surface behind the back electrode.

Abstract: A solid state color imaging device comprising a two dimensional array of stacked thin film photovoltaic devices with devices in each stack responsive to selected color bands. Color discrimination may be enhanced by design of intermediate transparent conductive layers to act as optical filters.

Abstract: Individual panels of solar cells are stacked one on top of the other and arranged so that incident light passes through each of the arrays of cells in each panel striking the one below it. The solar cells in each panel are selected to have a predetermined and different spectral response and thus are responsive to different frequencies of light. Electrical connection is individually made to each of the panels to collect the electrical energy generated from conversion of the light incident on the particular array of cells. Each of the panels may independently be constructed from microcrystalline thin films, amorphous silicon, single crystal silicon, compound semi-conductors, and the like. Individual panels may be constructed of the same semi-conductor material but compositionally modified to provide sensitivity to different portions of the light spectrum.

Abstract: A solar module comprising a solar cell string laminated between layers of pottant material and a transparent superstrate and a steel substrate. The steel substrate is roll formed to provide stiffening flanges on its edges while simultaneously forming a pan-shaped structure to hold other portions of the laminate in position during the laminating process. An improved terminal provides high voltage protection and improved mechanical strength. A conduit element provides protected raceways for external wires connected to module terminals.

Abstract: A method of forming semiconductor devices incorporates etching during the slicing of a semiconductor ingot from which semiconductor wafers are formed. In addition, a partial slicing through the ingot yields partially cut wafers which are maintained integral beyond a diffusion step. Grinding is then employed to remove unwanted material, to shape, and to accomplish the separation of the wafers. A doped, silicon ingot is used with a solution of sodium hydroxide or potassium hydroxide as the etchant. With the ingot in the [111] type of crystal orientation, the etching proceeds readily adjacent to the slicing cuts to facilitate the slicing, and proceeds slowly elsewhere to minimize material wastage. As a result, the formation of extremely thin wafers with minimal cutting loss is possible.

Abstract: A method for manufacturing solar cells from a silicon wafer having a p-n junction therein and front and back contacts thereon, the improvement comprising washing said wafer with a buffered hydrofluoric acid solution having a pH of from about 3.5 to about 6.5 and containing from about 2 to about 10 weight percent hydrofluoric acid based on the total weight of the solution.

Abstract: A method for manufacturing solar cells wherein a plurality of wafers of a first conductivity type are assembled and thereafter doped with an active impurity of an opposite conductivity imparting type to establish a p-n junction. Thereafter front and back contacts are formed on the wafers by metallization, the back contact material being chosen so that it penetrates any p-n junctions present in the area of the back contact, if any, and thereby forms a low resistance ohmic contact through any such junction. Thereafter the contact containing wafers are coin stacked and plasma etched so that the edge faces of the coin stacked wafers have removed therefrom sufficient p-n junction to electrically isolate the front junction from the back junction or junctions.