Abstract: A reinforcement structure to protect an integrated circuit module located within a card-type data carrier or smart card. The reinforcement structure is rigid, having a modulus of elasticity higher than modulus of elasticity of the smart card, and has a thickness dimension that is co-extensive with the thickness dimension of the smart card. The reinforcement structure is provided with a cavity for housing the integrated circuit module. In a preferred embodiment, the reinforcement structure is constructed of thermally and electrically conductive material that is castable or formable to facilitate integration of additional electronic circuit elements therein. In another embodiment, the reinforcement structure is configured in the shape of a SIMM card and is used in place of the normally flexible plastic SIMM card body.

Abstract: A reinforcement structure to protect an integrated circuit module located within a smart card. The integrated circuit module is disposed in the smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, is completely surrounded by the smart card and separated from the integrated circuit module. The integrated circuit module can also be completely surrounded by the smart card. In addition, the smart card can have a plurality of layers, with the integrated circuit module and/or the reinforcement structure extending into one or more of the card layers. The reinforcement structure relieves stress on the integrated circuit module during bending and torsion of the card.

Abstract: A reinforcement structure to protect an integrated circuit module located within a smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, is positioned within the smart card and has a cavity extending partially through the reinforcement structure or an opening which extends completely through the reinforcement structure. The integrated circuit module is positioned in the cavity or opening of the reinforcement structure. When the integrated circuit module is positioned in a cavity, the integrated circuit module is completely disposed in the cavity. An additional layer can be formed on the card to enclose the integrated circuit module and reinforcement structure. The reinforcement structure, which can have various shapes, relieves stress on the integrated circuit module during bending and torsion of the card.

Abstract: A reinforcement structure to protect an integrated circuit module located within a smart card. The integrated circuit module is positioned in a cavity formed in a first surface of the smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, is positioned in a cavity formed in a second surface of the smart card. The first and second surfaces of the smart card are opposing surfaces of the smart card. The reinforcement structure can have various shapes. In addition, the reinforcement structure can be substantially planar, or can have flanges. An additional layer can be formed over the first surface to enclose the integrated circuit module. The reinforcement structure relieves stress on the integrated circuit module during bending and torsion of the card.

Abstract: A reinforcement structure to protect an integrated circuit module located within a smart card. The smart card has two semi-rigid layers, with a first opening through the first layer located below the second layer. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, has a first portion extending through the first opening and a second portion extending over the upper surface of the first card layer. The integrated circuit module is positioned in the second card layer and is separated from the reinforcement structure by the second card layer. The reinforcement structure, which can have various shapes, relives stress on the integrated circuit module during bending and torsion of the card.

Abstract: A reinforcement structure to protect an integrated circuit module is located within a smart card. The integrated circuit module is positioned in a cavity formed in a first surface of the smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, is positioned in the same cavity over the integrated circuit module. The reinforcement structure can have various shapes. In addition, the reinforcement structure can be substantially planar and can also have flanges extending downward into the cavity. The reinforcement structure relives stress on the integrated circuit module during bending and torsion of the card.

Abstract: A reinforcement structure to protect an integrated circuit module located within a smart card. The integrated circuit module is positioned in a cavity formed in a first surface of the smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, is connected to a second surface and outer edge surfaces of the smart card. The first and second surfaces of the smart card are opposing surfaces and are joined by the outer edge surfaces at the outer perimeter of the smart card. In other embodiments, the reinforcement structure includes a second reinforcement structure connected to the first reinforcement structure and to the first surface of the smart card. The reinforcement structure relieves stress on the integrated circuit module during bending and torsion of the card.

Abstract: A reinforcement structure to protect an integrated circuit module located within a smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, substantially laterally surrounds the integrated circuit module in certain embodiments. In other embodiments, the reinforcement structure is a plate positioned adjacent to the integrated circuit module. The reinforcement structure relieves stress on the integrated circuit module during bending and torsion of the card.

Abstract: A flexible structure includes two or more electronic and/or electromagnetic devices, electrical connection being made between the devices by flexible and compressible electrically conductive plugs located within cavities or holes formed within the flexible structure. The structure is assembled so that the plugs are compressed between electrical contacts formed on or connected to the respective devices. As a result, good electrical contact is maintained between the devices. Additionally, if the structure is flexible, when the flexible structure is bent or deformed, the plugs bend or deform with the rest of the flexible structure so that the electrical connections between the plugs and the respective device electrical contacts are not broken.