Abstract: The present invention involves a method for bonding together molecularly homogeneous objects including optical and semiconductor members. In particular, such method involves forming micro-thin grooves using high precision laser ablation in one of two surfaces to be bonded together. An adhesive is then flowed into such a groove to form chemical bonding of the members. Such bonding essentially eliminates the formation of an adhesive layer in the interface between the bonding surfaces allowing optical contacting in addition to the chemical bonding.