Abstract: A two part curable composition is provided, where the composition comprises: (a) a first part comprising: (i) a (meth)acrylate component; (ii) 1,4-quinones, such as napthoquinone or benzoquinone and derivatives thereof in an amount less than or equal to about 0.05 weight percent; (iii) triaryl or alkaryl phenylphosphine in an amount greater than or equal to about 0.5 weight percent; and (iv) an amine; and (b) a second part comprising: (i) benzoyl peroxide in an amount greater than about 1.0 weight percent.

Abstract: The present invention provides fast fixturing two part adhesive compositions which include a first part containing a (meth)acrylic component and a cure system for the epoxy resin component of the second part and a second part containing an epoxy resin component and a cure system for the (meth)acrylic component of the first part.

Abstract: A two part curable composition is provided, where the composition comprises: (a) a first part comprising: (i) a (meth)acrylate component; (ii) 1,4-quinones, such as napthoquione or benzoquinone and derivatives thereof in an amount less than or equal to about 0.05 weight percent; (iii) triaryl or alkaryl phenylphosphine in an amount greater than or equal to about 0.5 weight percent; and (iv) an amine; and (b) a second part comprising: (i) benzoyl peroxide in an amount greater than about 1.0 weight percent.

Abstract: The present invention provides fast fixturing two part adhesive compositions which include a first part containing a (meth)acrylic component and a cure system for the epoxy resin component of the second part and a second part containing an epoxy resin component and a cure system for the (meth)acrylic component of the first part.

Abstract: The present invention relates to two-part, curable, (meth)acrylic adhesives containing naturally occurring fillers which inhibit free radical cure, such as wood flour, and oxygen scavenging components. Also provided are methods of preparing such adhesive compositions and methods of bonding substrates together with such adhesive compositions.

Abstract: The present invention relates to two-part, curable, (meth)acrylic adhesives containing naturally occurring fillers which inhibit free radical cure, such as wood flour, and oxygen scavenging components. Also provided are methods of preparing such adhesive compositions and methods of bonding substrates together with such adhesive compositions.

Abstract: This invention provides an acrylic epoxy adhesive as a two part composition, wherein each part is of suitable viscosity for use in pumping apparatus, but after mixing, the composition increases in viscosity, so that it will not sag, drip, or migrate after application to a surface during the open time. This effect is achieved with a reactive acid component that gels on mixing with the epoxy portion of the composition. Also provided is a method of preparing the adhesive composition, and method of using the composition to form laminated materials.

Abstract: The present invention provides two part, room-temperature curable epoxy resin/(meth)acrylate compositions. The compositions provide among other advantageous properties high flash point and low odor, and reaction products thereof demonstrate at least comparable and often improved fixture time, improved adhesion strength, and improved adhesion strength over time, to substrates which are ordinarily difficult to bond (such as plastics) with epoxy-based compositions, as contrasted to commercially available comparable products that are of low flash point and higher odor.

Abstract: The present invention provides two part, room-temperature curable epoxy resin/(meth)acrylate compositions. The compositions provide among other advantageous properties high flash point and low odor, and reaction products thereof demonstrate at least comparable and often improved fixture time, improved adhesion strength, and improved adhesion strength over time, to substrates which are ordinarily difficult to bond (such as plastics) with epoxy-based compositions, as contrasted to commercially available comparable products that are of low flash point and higher odor.

Abstract: The present invention provides a room-temperature curable, reinforced thermosetting epoxy resin composition. The composition includes an epoxy resin first component, and an epoxy resin hardener second component. The epoxy resin component includes an epoxy resin, and may further include an inorganic and/or organic filler component, such as a structural reinforcement component. The epoxy resin hardener component includes an amine-based hardener, and may further include an inorganic and/or organic filler component. Cured reaction products of the composition demonstrate at about room temperature an adhesive strength of at least about 6500 psi, such as about 8000 to about 10000, and a fracture toughness of at least about 10 in-lbs/in2, such as about 20 to about 35 in-lbs/in2. In addition, the cured reaction products of the composition demonstrate a creep resistance at about room temperature at least about 6000 psi of at least about 1 hour.

Abstract: The invention provides a system and method for fabricating an electrically resistive, high density diamond-packed thermal conduit for electrical components. An exemplary conduit provides superior thermal transfer between two objects. This is achieved by establishing, within a flowable and highly shrinkable electrically insulative carrier medium such as acrylic, intimate contact between diamond particles preferably having an aspect ratio of 1.35 or less.