Patents by Inventor Charles G. Mejia

Charles G. Mejia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7057895
    Abstract: A thermal management system is described for cooling an electronic component mounted on a printed circuit board. The thermal management system includes a heat sink coupled to an electronic component generating heat on a primary side of the printed circuit board and a cooling structure coupled to a secondary side of the printed circuit board. The thermal management system further includes a heat transfer element to transfer heat from the heat sink to the cooling structure. The heat transfer element is routed through the printed circuit board to establish thermal connection between the heat sink and the cooling structure.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: June 6, 2006
    Assignee: Intel Corporation
    Inventors: Charles G. Mejia, Bahman Moallem
  • Publication number: 20040264142
    Abstract: A thermal management system is described for cooling an electronic component mounted on a printed circuit board. The thermal management system includes a heat sink coupled to an electronic component generating heat on a primary side of the printed circuit board and a cooling structure coupled to a secondary side of the printed circuit board. The thermal management system further includes a heat transfer element to transfer heat from the heat sink to the cooling structure. The heat transfer element is routed through the printed circuit board to establish thermal connection between the heat sink and the cooling structure.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Inventors: Charles G. Mejia, Bahman Moallem