Patents by Inventor Charles G. POTTER
Charles G. POTTER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978647Abstract: Embodiments disclosed herein include a method of calibrating a processing chamber. In an embodiment, the method comprises placing a sensor wafer onto a support surface in the processing chamber, wherein a process kit displaceable in the Z-direction is positioned around the support surface. In an embodiment, the method further comprises measuring a first gap distance between the sensor wafer and the process kit with a sensor on an edge surface of the sensor wafer. In an embodiment, the method further comprises displacing the process kit in the Z-direction. In an embodiment, the method further comprises measuring an additional gap distance between the sensor wafer and the process kit.Type: GrantFiled: November 3, 2022Date of Patent: May 7, 2024Assignee: Applied Materials, Inc.Inventors: Charles G Potter, Eli Mor, Sergio Lopez Carbajal
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Patent number: 11908724Abstract: Embodiments disclosed herein include a method of determining the position of a sensor wafer relative to a pedestal. In an embodiment, the method comprises placing a sensor wafer onto the pedestal, wherein the sensor wafer comprises a first surface that is supported by the pedestal, a second surface opposite the first surface, and an edge surface connecting the first surface to the second surface, wherein a plurality of sensor regions are formed on the edge surface, and wherein the pedestal comprises a major surface and an annular wall surrounding the sensor wafer. In an embodiment, the method further comprises determining a gap distance between each of the plurality of sensor regions and the annular wall. In an embodiment, the method may further comprise determining a center-point offset of a center-point of the sensor wafer relative to a center point of the annular wall from the gap distances.Type: GrantFiled: June 21, 2022Date of Patent: February 20, 2024Assignee: Applied Materials, Inc.Inventors: Charles G. Potter, Anthony D. Vaughan
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Publication number: 20230052210Abstract: Embodiments disclosed herein include a method of calibrating a processing chamber. In an embodiment, the method comprises placing a sensor wafer onto a support surface in the processing chamber, wherein a process kit displaceable in the Z-direction is positioned around the support surface. In an embodiment, the method further comprises measuring a first gap distance between the sensor wafer and the process kit with a sensor on an edge surface of the sensor wafer. In an embodiment, the method further comprises displacing the process kit in the Z-direction. In an embodiment, the method further comprises measuring an additional gap distance between the sensor wafer and the process kit.Type: ApplicationFiled: November 3, 2022Publication date: February 16, 2023Inventors: CHARLES G. POTTER, ELI MOR, SERGIO LOPEZ CARBAJAL
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Patent number: 11521872Abstract: Embodiments disclosed herein include a method of calibrating a processing chamber. In an embodiment, the method comprises placing a sensor wafer onto a support surface in the processing chamber, wherein a process kit displaceable in the Z-direction is positioned around the support surface. In an embodiment, the method further comprises measuring a first gap distance between the sensor wafer and the process kit with a sensor on an edge surface of the sensor wafer. In an embodiment, the method further comprises displacing the process kit in the Z-direction. In an embodiment, the method further comprises measuring an additional gap distance between the sensor wafer and the process kit.Type: GrantFiled: August 20, 2019Date of Patent: December 6, 2022Assignee: Applied Materials, Inc.Inventors: Charles G. Potter, Eli Mor, Sergio Lopez Carbajal
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Publication number: 20220319887Abstract: Embodiments disclosed herein include a method of determining the position of a sensor wafer relative to a pedestal. In an embodiment, the method comprises placing a sensor wafer onto the pedestal, wherein the sensor wafer comprises a first surface that is supported by the pedestal, a second surface opposite the first surface, and an edge surface connecting the first surface to the second surface, wherein a plurality of sensor regions are formed on the edge surface, and wherein the pedestal comprises a major surface and an annular wall surrounding the sensor wafer. In an embodiment, the method further comprises determining a gap distance between each of the plurality of sensor regions and the annular wall. In an embodiment, the method may further comprise determining a center-point offset of a center-point of the sensor wafer relative to a center point of the annular wall from the gap distances.Type: ApplicationFiled: June 21, 2022Publication date: October 6, 2022Inventors: Charles G. Potter, Anthony D. Vaughan
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Patent number: 11404296Abstract: Embodiments disclosed herein include a method of determining the position of a sensor wafer relative to a pedestal. In an embodiment, the method comprises placing a sensor wafer onto the pedestal, wherein the sensor wafer comprises a first surface that is supported by the pedestal, a second surface opposite the first surface, and an edge surface connecting the first surface to the second surface, wherein a plurality of sensor regions are formed on the edge surface, and wherein the pedestal comprises a major surface and an annular wall surrounding the sensor wafer. In an embodiment, the method further comprises determining a gap distance between each of the plurality of sensor regions and the annular wall. In an embodiment, the method may further comprise determining a center-point offset of a center-point of the sensor wafer relative to a center point of the annular wall from the gap distances.Type: GrantFiled: August 20, 2019Date of Patent: August 2, 2022Assignee: Applied Materials, Inc.Inventors: Charles G. Potter, Anthony D. Vaughan
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Patent number: 11342210Abstract: Embodiments disclose herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the first surface, wherein the sensor regions comprise self-referencing capacitive sensors. In an embodiment, the sensor wafer further comprises a vibration sensor embedded within the substrate.Type: GrantFiled: August 20, 2019Date of Patent: May 24, 2022Assignee: Applied Materials, Inc.Inventors: Charles G. Potter, Terrance Allen Neal
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Patent number: 11054317Abstract: Disclosed herein is a method of measuring the chucking force of an electrostatic chuck. The method comprises placing a sensor wafer onto the electrostatic chuck, wherein the sensor wafer comprises a plurality of pressure sensors, and applying a chucking voltage to the electrostatic chuck. The method further comprises measuring the chucking force with the plurality of pressure sensors to determine a first chucking force profile of the electrostatic chuck, and processing a plurality of wafers on the electrostatic chuck. The method further comprises placing the sensor wafer onto the electrostatic chuck, and applying the chucking voltage to the electrostatic chuck. The method further comprises measuring the chucking force with the plurality of pressure sensors to determine a second chucking force profile of the electrostatic chuck.Type: GrantFiled: September 10, 2019Date of Patent: July 6, 2021Assignee: Applied Materials, Inc.Inventors: Charles G. Potter, Wendell Glenn Boyd, Jr., Govinda Raj, Robert Hirahara
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Patent number: 10847393Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the edge surface, wherein each sensor region comprises a self-referencing capacitive sensor.Type: GrantFiled: September 4, 2018Date of Patent: November 24, 2020Assignee: Applied Materials, Inc.Inventors: Charles G. Potter, Eli Mor
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Patent number: 10794681Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface and a second surface opposite the first surface. In an embodiment, the sensor wafer further comprises a first conductive pad with a first surface area, wherein the first conductive pad has a surface that is substantially coplanar with the first surface of the substrate. In an embodiment, the sensor wafer further comprises a second conductive pad with a second surface area that is smaller than the first surface area, wherein the second conductive pad has a surface that is substantially coplanar with the first surface of the substrate.Type: GrantFiled: September 4, 2018Date of Patent: October 6, 2020Assignee: Applied Materials, Inc.Inventors: Charles G. Potter, Eli Mor
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Publication number: 20200103294Abstract: Embodiments disclosed herein include a method of measuring the chucking force of an electrostatic chuck. In an embodiment, the method comprises placing a sensor wafer onto the electrostatic chuck, wherein the sensor wafer comprises a plurality of pressure sensors, and applying a chucking voltage to the electrostatic chuck. In an embodiment, the method further comprises measuring the chucking force with the plurality of pressure sensors to determine a first chucking force profile of the electrostatic chuck, and processing a plurality of wafers on the electrostatic chuck. In an embodiment, the method further comprises placing the sensor wafer onto the electrostatic chuck, and applying the chucking voltage to the electrostatic chuck. In an embodiment, the method further comprises measuring the chucking force with the plurality of pressure sensors to determine a second chucking force profile of the electrostatic chuck.Type: ApplicationFiled: September 10, 2019Publication date: April 2, 2020Inventors: Charles G. Potter, Wendell Glenn Boyd, JR., Govinda Raj, Robert Hirahara
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Publication number: 20200072594Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface and a second surface opposite the first surface. In an embodiment, the sensor wafer further comprises a first conductive pad with a first surface area, wherein the first conductive pad has a surface that is substantially coplanar with the first surface of the substrate. In an embodiment, the sensor wafer further comprises a second conductive pad with a second surface area that is smaller than the first surface area, wherein the second conductive pad has a surface that is substantially coplanar with the first surface of the substrate.Type: ApplicationFiled: September 4, 2018Publication date: March 5, 2020Inventors: Charles G. POTTER, Eli MOR
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Publication number: 20200075369Abstract: Embodiments disclose herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the first surface, wherein the sensor regions comprise self-referencing capacitive sensors. In an embodiment, the sensor wafer further comprises a vibration sensor embedded within the substrate.Type: ApplicationFiled: August 20, 2019Publication date: March 5, 2020Inventors: Charles G. Potter, Terrance Allen Neal
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Publication number: 20200075368Abstract: Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the edge surface, wherein each sensor region comprises a self-referencing capacitive sensor.Type: ApplicationFiled: September 4, 2018Publication date: March 5, 2020Inventors: Charles G. POTTER, Eli MOR
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Publication number: 20200075370Abstract: Embodiments disclosed herein include a method of determining the position of a sensor wafer relative to a pedestal. In an embodiment, the method comprises placing a sensor wafer onto the pedestal, wherein the sensor wafer comprises a first surface that is supported by the pedestal, a second surface opposite the first surface, and an edge surface connecting the first surface to the second surface, wherein a plurality of sensor regions are formed on the edge surface, and wherein the pedestal comprises a major surface and an annular wall surrounding the sensor wafer. In an embodiment, the method further comprises determining a gap distance between each of the plurality of sensor regions and the annular wall. In an embodiment, the method may further comprise determining a center-point offset of a center-point of the sensor wafer relative to a center point of the annular wall from the gap distances.Type: ApplicationFiled: August 20, 2019Publication date: March 5, 2020Inventors: Charles G. Potter, Anthony D. Vaughan
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Publication number: 20200075367Abstract: Embodiments disclosed herein include a method of calibrating a processing chamber. In an embodiment, the method comprises placing a sensor wafer onto a support surface in the processing chamber, wherein a process kit displaceable in the Z-direction is positioned around the support surface. In an embodiment, the method further comprises measuring a first gap distance between the sensor wafer and the process kit with a sensor on an edge surface of the sensor wafer. In an embodiment, the method further comprises displacing the process kit in the Z-direction. In an embodiment, the method further comprises measuring an additional gap distance between the sensor wafer and the process kit.Type: ApplicationFiled: August 20, 2019Publication date: March 5, 2020Inventors: Charles G. Potter, Eli Mor, Sergio Lopez Carbajal