Patents by Inventor Charles Grosjean
Charles Grosjean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8667665Abstract: One embodiment of the present inventions sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with a compensating material (for example, an oxide) wherein the temperature coefficient of Young's Modulus (TCE) of the compensating material has a sign opposite to a TCE of the material of the resonating element.Type: GrantFiled: July 31, 2012Date of Patent: March 11, 2014Assignee: SiTime CorporationInventors: Paul Merritt Hagelin, Charles Grosjean
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Publication number: 20120295384Abstract: One embodiment of the present inventions sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with a compensating material (for example, an oxide) wherein the temperature coefficient of Young's Modulus (TCE) of the compensating material has a sign opposite to a TCE of the material of the resonating element.Type: ApplicationFiled: July 31, 2012Publication date: November 22, 2012Inventors: Paul Merritt Hagelin, Charles Grosjean
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Patent number: 8234774Abstract: One embodiment of the present invention sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with oxide. By growing oxide within the slots, the amount of oxide growth on the outside surfaces of the MEMS resonator may be reduced. Furthermore, by situating the slots in the areas of large flexural stresses, the contribution of the embedded oxide to the overall TCF of the MEMS resonator is increased, and the total amount of oxide needed to decrease the overall TCF of the MEMS resonator to a particular target value is reduced. As a result, the TCF of the MEMS resonator may be reduced in a manner that is more effective relative to prior art approaches.Type: GrantFiled: December 21, 2007Date of Patent: August 7, 2012Assignee: SiTime CorporationInventors: Paul Merritt Hagelin, Charles Grosjean
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Publication number: 20090158566Abstract: One embodiment of the present invention sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with oxide. By growing oxide within the slots, the amount of oxide growth on the outside surfaces of the MEMS resonator may be reduced. Furthermore, by situating the slots in the areas of large flexural stresses, the contribution of the embedded oxide to the overall TCF of the MEMS resonator is increased, and the total amount of oxide needed to decrease the overall TCF of the MEMS resonator to a particular target value is reduced. As a result, the TCF of the MEMS resonator may be reduced in a manner that is more effective relative to prior art approaches.Type: ApplicationFiled: December 21, 2007Publication date: June 25, 2009Inventors: Paul Merritt Hagelin, Charles Grosjean
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Publication number: 20090160581Abstract: One embodiment of the present invention sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with oxide. By growing oxide within the slots, the amount of oxide growth on the outside surfaces of the MEMS resonator may be reduced. Furthermore, by situating the slots in the areas of large flexural stresses, the contribution of the embedded oxide to the overall TCF of the MEMS resonator is increased, and the total amount of oxide needed to decrease the overall TCF of the MEMS resonator to a particular target value is reduced. As a result, the TCF of the MEMS resonator may be reduced in a manner that is more effective relative to prior art approaches.Type: ApplicationFiled: December 21, 2007Publication date: June 25, 2009Inventors: Paul Merritt Hagelin, Charles Grosjean
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Patent number: 7544531Abstract: To suppress stiction of a MEMS resonator during fabrication, conductive structures of the MEMS resonator are electrically coupled via a ground strap during the step of forming isolation trenches around their contact structures. After the isolation trenches have been formed, the ground strap is transformed into a non-conductive material to complete the electrical isolation of the conductive structures. An etch mask formed on top of the ground strap prevents etching of the ground strap during the formation of the trenches. Depending on the etching process, the ground strap may be formed as a bridge that suspends above the isolation trench or as a column that extends down to the bottom of the isolation trench.Type: GrantFiled: June 28, 2007Date of Patent: June 9, 2009Assignee: SiTime Inc.Inventor: Charles Grosjean
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Publication number: 20080119001Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.Type: ApplicationFiled: November 15, 2007Publication date: May 22, 2008Inventors: Charles Grosjean, Paul Merritt Hagelin, Nicholas Ian Buchan
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Publication number: 20080116534Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.Type: ApplicationFiled: November 15, 2007Publication date: May 22, 2008Inventors: Charles Grosjean, Paul Merritt Hagelin, Nicholas Ian Buchan
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Publication number: 20080119003Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.Type: ApplicationFiled: November 15, 2007Publication date: May 22, 2008Inventors: Charles Grosjean, Paul Merritt Hagelin, Nicholas Ian Buchan
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Publication number: 20080119002Abstract: One embodiment of the present invention sets forth a substrate contact for a MEMS device die, where the substrate contact is formed through an electrically insulative layer in the device die that is positioned between a handle wafer layer and a MEMS device layer formed on the handle wafer layer. The substrate contact serves as a path to ground for the MEMS handle wafer layer and is formed during the fabrication process of the MEMS device. One advantage of the disclosed invention is that a robust, low-impedance path to ground is provided for the MEMS handle wafer layer, with minimal impact on the process of fabricating a MEMS device.Type: ApplicationFiled: November 15, 2007Publication date: May 22, 2008Inventors: Charles Grosjean, Paul Merritt Hagelin, Nicholas Ian Buchan
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Publication number: 20070242917Abstract: An optical apparatus comprises: a semiconductor substrate; a semiconductor optical device integrally formed on the substrate and having a device end face; and a low-index planar optical waveguide integrally formed on the semiconductor substrate at the device end face. The waveguide is end-coupled at its proximal end to the optical device through the device end face and is arranged so as to comprise a waveguide mode converter. The waveguide is arranged at its distal end to transmit or receive an optical signal through its distal end to or from another low-index optical waveguide end-coupled with the integrally-formed waveguide and assembled with the integrally-formed waveguide, optical device, or substrate. The optical apparatus can further comprise a discrete low-index optical waveguide assembled with the integrally-formed waveguide, optical device, or substrate so as to be end-coupled with the integrally-formed waveguide at its distal end.Type: ApplicationFiled: June 19, 2007Publication date: October 18, 2007Inventors: Henry Blauvelt, David Vernooy, Joel Paslaski, Charles Grosjean, Hao Lee, Franklin Monzon, Katrina Nguyen
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Publication number: 20060110100Abstract: An optical apparatus comprises a semiconductor optical device waveguide formed on a semiconductor substrate, and an integrated end-coupled waveguide formed on the semiconductor substrate. The integrated waveguide may comprise materials differing from those of the device waveguide and the substrate. Spatially selective material processing may be employed for first forming the optical device waveguide on the substrate, and for subsequently depositing and forming the integrated end-coupled waveguide on the substrate. Spatially selective material processing enables accurate spatial mode matching and transverse alignment of the waveguides, and multiple device waveguides and corresponding integrated end-coupled waveguides may be fabricated concurrently on a common substrate on a wafer scale.Type: ApplicationFiled: January 9, 2006Publication date: May 25, 2006Inventors: Henry Blauvelt, David Vernooy, Joel Paslaski, Charles Grosjean, Hao Lee, Franklin Monzon, Katrina Nguyen
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Patent number: 6699394Abstract: A micromachined fluid handling device having improved properties. The valve is made of reinforced parylene. A heater heats a fluid to expand the fluid. The heater is formed on unsupported silicon nitride to reduce the power. The device can be used to form a valve or a pump. Another embodiment forms a composite silicone/parylene membrane. Another feature uses a valve seat that has concentric grooves for better sealing operation.Type: GrantFiled: December 22, 2000Date of Patent: March 2, 2004Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Xing Yang, Charles Grosjean, Xuan-Qi Wang
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Patent number: 6612535Abstract: A valve where the valve membrane is made from silicone rubber. Preferably the valve is a microelectromechanical systems (MEMS) thermopneumatic valve. Because of the advantageous physical properties of silicone rubber, the valve provides desirable performance with reasonable power consumption.Type: GrantFiled: January 23, 1998Date of Patent: September 2, 2003Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Xing Yang, Charles Grosjean
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Patent number: 6536213Abstract: A micromachined fluid handling device having improved properties. The valve is made of reinforced parylene. A heater heats a fluid to expand the fluid. The heater is formed on unsupported silicon nitride to reduce the power. The device can be used to form a valve or a pump. Another embodiment forms a composite silicone/parylene membrane. Another feature uses a valve seat that has concentric grooves for better sealing operation.Type: GrantFiled: June 18, 2001Date of Patent: March 25, 2003Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Xing Yang, Charles Grosjean, Xuan-Qi Wang
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Patent number: 6520753Abstract: A micropump including a chamber plate with connected pumping chambers for accepting small volumes of a fluid and a pumping structure. The pumping structure includes a flexible membrane, portions of which may be inflated into associated pumping chambers to pump the fluid out of the chamber or seal the chamber. A working fluid in cavities below the flexible membrane portions are used to inflate the membrane. The cavities may include a suspended heating element to enable a thermopneumatic pumping operation. The pumping chambers are shaped to closely correspond to the shape of the associated flexible membrane portion in its inflated state.Type: GrantFiled: June 5, 2000Date of Patent: February 18, 2003Assignee: California Institute of TechnologyInventors: Charles Grosjean, Yu-Chong Tai
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Patent number: 6499297Abstract: A micromachined fluid handling device having improved properties. The valve is made of reinforced parylene. A heater heats a fluid to expand the fluid. The heater is formed on unsupported silicon nitride to reduce the power. The device can be used to form a valve or a pump. Another embodiment forms a composite silicone/parylene membrane. Another feature uses a valve seat that has concentric grooves for better sealing operation.Type: GrantFiled: December 22, 2000Date of Patent: December 31, 2002Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Xing Yang, Charles Grosjean, Xuan-Qi Wang
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Publication number: 20020062645Abstract: A micromachined fluid handling device having improved properties. The valve is made of reinforced parylene. A heater heats a fluid to expand the fluid. The heater is formed on unsupported silicon nitride to reduce the power. The device can be used to form a valve or a pump. Another embodiment forms a composite silicone/parylene membrane. Another feature uses a valve seat that has concentric grooves for better sealing operation.Type: ApplicationFiled: June 18, 2001Publication date: May 30, 2002Applicant: California Institute of TechnologyInventors: Yu-Chong Tai, Xing Yang, Charles Grosjean, Xuan -Qi Wang
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Patent number: 6345502Abstract: A micromachined fluid handling device having improved properties. The valve is made of reinforced parylene. A heater heats a fluid to expand the fluid. The heater is formed on unsupported silicon nitride to reduce the power. The device can be used to form a valve or a pump. Another embodiment forms a composite silicone/parylene membrane. Another feature uses a valve seat that has concentric grooves for better sealing operation.Type: GrantFiled: November 12, 1998Date of Patent: February 12, 2002Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Xing Yang, Charles Grosjean, Xuan-Qi Wang
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Patent number: 6334761Abstract: A silicone rubber diaphragm pump utilizing a pair of MEMS Parylene check valves and a miniature solenoid plunger and actuator is comprised of a spacer sandwiched by a silicone rubber diaphragm on one side and a check valve support on the other. The check valves in the check valve support form the inlet and outlet to a pumping chamber defined between the check valve support and silicone rubber diaphragm. The pumping action has been demonstrated by driving the silicone diaphragm with the plunger using the solenoid type actuator to generate over and under pressures in the chamber. This forces the pumped medium into and out of the chamber, thus allowing the medium to be transported. Tubing or connectors affixed to the inlet and outlet ports of the check valve support structure allow for external fluidic access. The pump works with both gas and liquid.Type: GrantFiled: March 2, 2000Date of Patent: January 1, 2002Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Ellis Meng, Xuan-Qi Wang, Charles Grosjean