Abstract: A hybrid nozzle that includes the use of both vacuum and mechanical gripping of components in a hybrid arrangement. It can easily be scaled down to the smallest foreseeable size of common components. The hybrid nozzle is made from commonly available material using a precision micro-machining process. There are no linkages or moving pistons to complicate the assembly and introduce tolerance buildup and wear concerns. The objective of this invention is to increase both throughput and yield in pick and place assembly operations at automated factories.

Abstract: An improved continuous adhesive backed carrier tape which eliminates the need for a lift pin to assist in removing components from the compartments in the carrier tape within which the components are adhesively retained. The improvements are achieved by utilizing a strip of continuous length containing a low tack adhesive coating within the central portion of the plastic strip located to underlie the entire bottom of each carrier tape compartment when the strip is affixed there to by either aggressive adhesive rails or by mechanical means, such as ultra sonic bonding. The unique feature is to affix low tack adhesive means underneath the compartment area of the carrier tape, sufficient to retain small, lightweight components yet an adhesion level that is low enough to enable the component to be removed using conventional vacuum pick tools without lift pin assistance.

Abstract: An improved adhesive-backed carrier tape system for packaging of components. Components or devices are held within the compartments of the carrier portion by a low tack adhesive level layer while a high tack adhesive layer is affixed to the carrier portion to provide means for high speed, low cost automated handling of the packaged components.

Abstract: The specification describes an improved carrier tape conveying method and system for sprocket wheel driven adhesive-backed carrier tape. The system is designed for precision placement of components on the adhesive-backed carrier tape. Each time the carrier tape is advanced stepwise for placement of a component, the sprocket hole position is measured by a follower indexing sprocket wheel positioned at the point where components are placed. If a hole is misaligned, the indexing wheel senses the misalignment and produces a re-registration signal causing the tape to move the correct distance to align the sprocket hole with the intended position.

Abstract: The specification describes methods for releasing adhered components to adhesive-backed carrier tapes. It is based on the recognition that with proper choice of the adhesive, i.e. a thermal release adhesive, selectively applied heat will modify the adhesive, eliminating or substantially reducing the adhesion between the tape and the IC chip. This allows components to be picked from the adhesive-backed carrier tape without mechanical assistance. Thermal release adhesives having fast rise times are preferred, allowing for pick and place cycles of less than one second, e.g., less than 0.5 seconds. Preferred means for applying selective heat to the adhesive on the carrier tape are ceramic heaters. Other choices are arc lamps, tungsten halogen lamps, xenon lamps, lasers, and infra-red lamps.

Abstract: An improvement in adhesive backed carrier tapes where the adhesion is substantially reduced by using a UV-sensitive adhesive tape which can be irradiated to reduce the adhesion within the compartment where each device will be placed. By reducing the initial aggressive adhesion levels minimally sufficient to retain devices securely as placed, the requirement for a lift pin or pushup pin to assist in removing the component can be eliminated. The principal benefits include substantial increase in throughputs and yields accompanied by proportionate cost reduction benefits.

Abstract: A carrier tape system for receiving, retaining and quickly releasing small components, such as singulated bare die or integrated circuit (IC) chips for automated assembly processing. The carrier tape system is comprised of a longitudinally elongated flexible carrier tape frame with a plurality of spaced apart aperture cavities and a pair of pressure sensitive adhesive tape rails affixed to one surface of the carrier tape frame with the adhesive surfaces facing into the aperture cavities of the carrier tape frame. Each PSA tape rail has a longitudinal linear side edge and a configured side edge, where the linear side edge is affixed to the surface of the of the carrier tape frame and the configured side edge extends into and overlaps the aperture cavities for adhesioning the back side of the small components. With the configured side edges of PSA tape rails, a range or adhesion levels can be achieved with the PSA tape rails in one fixed gap width location.

Abstract: The specification describes a method for dispensing IC chips from a chip carrier tape for a flip-chip assembly operation. In a conventional assembly operation, the solder bumped side of the chip is the top side of the chip as loaded on the tape, and is normally the side of the chip that engages the head of the pick tool. For flip-chip assembly it is necessary to invert the chip for solder bonding to an interconnect substrate. In the technique of the invention, the chip carrier tape is inverted and inserted into the dispensing machine upside down. The IC chips are then ejected through the back of the tape instead of being lifted from the from of the tape. In this way the pick tool head engages the back side of the solder bumped chip and the chip is in the proper orientation for flip-chip placement and bonding on the interconnect substrate. Carrier tapes designed for through-tape dispensing are also disclosed.

Abstract: The specification describes a method for dispensing IC chips from a chip carrier tape for a flip-chip assembly operation. In a conventional assembly operation, the solder bumped side of the chip is the top side of the chip as loaded on the tape, and is normally the side of the chip that engages the head of the pick tool. For flip-chip assembly it is necessary to invert the chip for solder bonding to an interconnect substrate. In the technique of the invention, the chip carrier tape is inverted and inserted into the dispensing machine upside down. The IC chips are then ejected through the back of the tape instead of being lifted from the from of the tape. In this way the pick tool head engages the back side of the solder bumped chip and the chip is in the proper orientation for flip-chip placement and bonding on the interconnect substrate.

Abstract: A carrier tape system for receiving, retaining and quickly releasing small components, such as singulated bare die, integrated circuit (IC) chips, or other small components for automated assembly processing. The carrier tape system is comprised of a longitudinal elongated flexible punched carrier tape frame and a solid width of pressure sensitive adhesive (PSA) tape affixed to one side of the carrier tape frame. The punched carrier tape frame has a plurality of spaced apart aperture cavities therethrough. The solid width of PSA tape also has a plurality of spaced apart configured apertures which are smaller than the plurality of aperture cavities of the punched carrier tape frame. These configured apertures of the PSA tape are centrally aligned and respectively located within the aperture cavities of the carrier tape frame.

Abstract: A carrier tape which includes a punched tape with a plurality of aperture cavities, and a backing tape having a thin flexible gel material between a pair of strips of parallel pressure sensitive adhesive material. The flexible gel material covers all of the aperture cavities of the punched tape, so that singulated die and other components with a single flat surface can be placed on the surface of the flexible gel layer to hold the die or other component precisely in place, even during handling or shipping. The gel layer has high resistance to shear forces (movements in X, Y and theta) yet minor resistance to peel forces (removal in the Z-axis). The die is retained within an aperture cavity and it is adhered to the thin flexible gel layer such that the small component is unable to move in the X, Y or theta directions. The gel layer holds the die in place securely while the carrier tape is moving during processing and prevents fallout or dislocation of the die during high speed automated processing.

Abstract: The present invention utilizes multiple and split pressure sensitive adhesive (PSA) tape stratums for carrier tape packaging systems to receive, retain and release small components in automated assembly processing. A carrier tape includes many small apertures which extend through the thickness of the carrier tape. Each aperture is designed to carry a small component. The present invention utilizes a pair of parallel lengths of pressure sensitive tape which are separated by a gap to retain each component within its respective aperture.

Abstract: An improved frame design for retaining a coin, medallion and other jewelry objects wherein a frame of one standard size can accommodate similarly shaped objects within a range of differing thicknesses. An improved shim which allows a standard size frame to accommodate similarly shaped objects whose perimeter dimensions are small enough so that the object can move inside the frame. An improved retaining ring which serves to impede the rotation of a circular object inside a cylindrical frame.