Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Abstract: A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.

Abstract: A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.

Abstract: A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.

Abstract: The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85° C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

Abstract: A self scrubbing buckling beam contactor for contacting an array of pads positioned on a device under test is described. The contactor consists of three insulating dies: a top, an offset and a lower die separated from each other by an insulated spacer of variable thickness. Each die is provided with holes. The buckling beam has an array of flexible wires positioned substantially perpendicular to the dies, each of the flexible wires crossing a corresponding hole in each of the top, offset and lower dies to allow each wire respectively contact a pad of the device under test. By shifting the center of the hole of the lower die relative to the center of the offset die, the tip of the wire exits from the lower die at an angle with respect to the plane formed by the pads of the device under test.

Abstract: A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Abstract: A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive.

Abstract: The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85° C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

Abstract: A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive.

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Abstract: A buckling beam probe assembly and a process to make the assembly using insulated metal to hold the vertical beam probe wires. The buckling beam probe assembly electrically connects a test apparatus with contact pads on the surface of a device to be tested. The assembly is formed with a plurality of buckling beam wires each having a head, a body, and a tail. Each of the beam wires is pressed vertically onto the contact pads and buckles laterally to adapt to height differences of the contact pads caused by irregularities on the surface of the device to be tested. A top plate has a first plurality of apertures receiving the heads of the plurality of buckling beam wires. A bottom plate has a second plurality of apertures receiving the tails of the plurality of buckling beams wires. A plurality of intermediate metal sections are positioned between the top plate and the bottom plate.

Abstract: A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.

Abstract: Disclosed herein is an interconnection for electrical connection of two electrical devices. The interconnection comprises a conductive polymer disposed in contact with one or two solderable caps. Together, the solderable cap(s) and the conductive polymer form an interconnection that can be used to connect two electrical devices through the contact pads on the electrical devices. For example, a packaged integrated circuit chip can be connected to a “card” using an array of the interconnections. Since the interconnection has solderable surfaces, the interconnect can be used in place of solder balls in a conventional manufacturing line.

Abstract: An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burn-in to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation.

Abstract: An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burning to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation.

Abstract: A buckling beam probe assembly and a process to make the assembly using insulated metal to hold the vertical beam probe wires. The buckling beam probe assembly electrically connects a test apparatus with contact pads on the surface of a device to be tested. The assembly comprises a plurality of buckling beam wires each having a head, a body, and a tail and being pressed vertically onto the contact pads and buckling laterally to adapt to height differences of the contact pads caused by irregularities on the surface of the device to be tested. A top plate has a first plurality of apertures receiving the heads of the plurality of buckling beam wires. A bottom plate has a second plurality of apertures receiving the tails of the plurality of buckling beam wires. A plurality of intermediate metal sections are positioned between the top plate and the bottom plate.