Abstract: A device for fragmenting a surgical implant includes a cap. The cap includes a first channel extending from a first end of the cap to the second end of the cap. The device includes a first electrode, a second electrode, and an endoscope coupled with the cap.

Abstract: A cleaning device for use with an endoscope. The device includes an elongated and flexible base and a set of discs axially spaced along the base. Each disc is positioned along the base at a center point of the disc. The size and spacing of the discs may vary within the set of discs.

Abstract: A cleaning device for use with an endoscope. The device includes an elongated and flexible base and a set of discs axially spaced along the base. Each disc is positioned along the base at a center point of the disc. The size and spacing of the discs may vary within the set of discs.

Abstract: A sawing device includes a wire assembly (15) supported on wire-guiding rolls (11, 12) and pressed against a workpiece to be sawn (20) fixed on a support table (21). An oscillating device (23) produces a relative reciprocating movement between the workpiece and the wire assembly (15) around an oscillation axis (A) whereof the spatial position can be adjusted and programmed so that the oscillation axis (A) is at a programmable and adjustable distance from an effective axis of rotation (28) of the oscillating device (23).

Abstract: The invention concerns a sawing device comprising a wire assembly (15) supported on wire-guiding rolls (11, 12) and pressed against a workpiece to be sawn (20) fixed on a support table (21). A oscillating device (23) enables to produce a relative reciprocating movement between the workpiece to be sawn and the wire assembly (15) around an oscillation axis (A) whereof the spatial position can be adjusted and programmed so that said oscillation axis (A) is at a programmable and adjustable distance from an effective axis of rotation (28) of the oscillating device (23). In one embodiment, the oscillating device (23) comprises therefor rotating members (27), and translating members along two directions (Z and Y) contained in the cutting plane, thereby enabling to obtain very planar sawn slices with very even surface texture and improved sawing efficiency.

Abstract: The wire sawing device includes two external wire guide cylinders (1, 2) having a diameter (D1) smaller than that (D2) of the two internal wire guide cylinders (3, 4). The external wire guide cylinders are driven in rotation by a power drive to cause the movement of the wires of a layer of wires (6), whilst the internal wire guide cylinders (3, 4) ensure only the function of guidance without driving the wires of the layer of wires. By the separation of the drive function from the guide function of the wire, substantial heating of the guiding wire guide cylinders can be avoided, which permits obtaining sawed pieces of high precision without undulations.

Abstract: A slicing center includes a first structure (23) to carry out operations (24) necessary for the production of processed slices in trays or packaged, from pieces to be sliced. These operations (24) are controlled and interconnected by a second structure (25) so as to form subgroups (26) consisting of a positioning unit, a slicing unit, a processing unit and a final treatment unit. These subgroups (26) are in turn interconnected by third structure (27) comprising devices for storing and devices for handling and transportation of the slices, thereby to form a chain of transfer in which all the elements are compatible and interconnected.

Abstract: The wire sawing device includes two external wire guide cylinders (1, 2) having a diameter (D1) smaller than that (D2) of the two internal wire guide cylinders (3, 4). The external wire guide cylinders are driven in rotation by a power drive to cause the movement of the wires of a layer of wires (6), whilst the internal wire guide cylinders (3, 4) ensure only the function of guidance without driving the wires of the layer of wires. By the separation of the drive function from the guide function of the wire, substantial heating of the guiding wire guide cylinders can be avoided, which permits obtaining sawed pieces of high precision without undulations.

Abstract: The invention concerns a wire sawing device comprising at least a support table (35) bearing a piece to be sawed (34) urged against the set of wires layer (26, 27) two outer wire-guide rolls (10, 11) powered by motors (14, 15) and at least two inner wire-guide rolls (16, 17). The wire (18) is wound on the wire-guide rolls so as to constitute between the inner wire-guide rolls (16, 17) two cross sets of wires (26, 27) whereof the projecting wires are parallel and at a distance from a first space (31) and so as to be returned by the outer wire-guide rolls (10, 11) whereon is provided a second space (30) twice the first space (31). Such an arrangement enables a balanced distribution of forces on the inner wire-guides (16, 17), the surfaces of the sawed slices to be perfectly parallel, the shearing forces on the piece to be sawed (34) to be reduced, a decrease in the cutting pressure, a greater cutting speed and to improve the precision of the resulting slices.

Abstract: A slicing device using yarn includes at least two yard-guide cylinders on which the yarn is wound and by which the yarn can be moved with a reciprocating or continuous motion pressed against a piece to be sliced fixed on a supporting table. The yarn is wound on the yarn-guide so as to form at least two layers of yarn intersecting with one or several non-null intersecting angles (&bgr;) and so as to pass in a straight line from one cylinder to the other. The angle of inclination between the moving direction of the piece to be sliced and a line perpendicular to the plane of the yarn cylinder axes is adjustable so as to obtain strictly parallel slices. The intersection of the yarn layers improves the quality of slices obtained by facilitating the subsequent mechanical treatment operations of surfaces with crossed faults. Moreover, the angle of the yarn layers reduces the shearing and torsional stresses on the support of the piece to be sliced when the slices are being cut.

Abstract: The cutting device includes a web (2) of parallel wires capable of an alternating or a continuous motion while pressing against a work piece (1) fixed to a support table (3). The device includes angle changing devices (13, 16) for realigning the wires relative to the support table.

Abstract: The sawing device comprises a layer of parallel wires (2) moving with alternating or continuous movement whilst bearing against a piece (1) to be sawed fixed on a support table (3), the whole being maintained by a frame (14). The device comprises wire guide cylinders (4) having an interchangeable surface constituted by removable segments (6) fixed mechanically and/or by cementing. The removable segments (6) are pre-incised or not, with grooves (9). Said wire guide cylinders (4) need accordingly not be taken out of the frame (14) for the changing operation of the removable segments (6) and/or of the regeneration of the surface.

Abstract: The process and device (1) for positioning several single crystals (2) on a support (3) for their simultaneous cutting in directions well defined relative to the crystal structure of each single crystal; they avoid the adjustment in the machine and minimize the cutting time by providing a positioning outside the machine about angles of rotation (d,g) obtained mathematically from measured and/or given data and which position each geometric single crystal in a plane perpendicular to the cutting direction (z'") whilst bringing the cutting plane of each single crystal (2) parallel to the cutting direction of the machine. The device for practicing the process comprises a frame (5), a gripping device (8) mounted rotatably on the frame and carrying single crystals (2) and a rotatable plate (11) adapted to maintain the cutting support (3) belonging both to the positioning device (1) and to the cutting machine.

Abstract: A sawing device comprises a layer of parallel wires (8) which move with reciprocal or continuous movement whilst bearing against a member (9) to be sawed fixed to a support table (10). The wire comes from a management region (41a) of the wire, constituted by two spools of wire, one (2a) a payout spool and the other (14a) a take-up spool, which do not rotate, but which have a revolving spooling and unspooling member (42) about the spools permitting rendering the sawing device independent of the mass of the spools of wire (2a, 14a) and hence of the length of the wire.

Abstract: Sawing device comprising a layer of parallel wires (2) moving with alternating or continuous movement bearing against a piece (1) to be sawed fixed on a support table (3), the whole being maintained by a frame (7). The device comprises, removably or not, an in situ cutting mechanism for the grooves (11) on the surface of the wire guide cylinders (4) forming the support of the layer of wires (2). It is accordingly not necessary to dismount and withdraw the wire guide cylinders (4) from the frame (7) for the cutting operation of the grooves (11), which permits higher productivity and increased cutting precision.

Abstract: The sawing device includes parallel wires (2) moving with alternating or continuous movement and supported by wire guide cylinders (4). The cylinders each include a rotatable sleeve (7) turning about a fixed shaft (5). There is thus obtained a better distribution of the loads applied to the rotating material, a decrease in heat sources, an improvement of the precision of sawing and a greater facility for disassembly and maintenance.

Abstract: A positioning process and device (1) for a single crystal (2) for cutting in predetermined directions avoids the adjustment of the cutting machine and minimizes the cutting time by positioning outside of the machine, according to rotational angles (d,g) obtained mathematically from measured and/or imposed data, and which positions the geometric single crystal in a plane perpendicular to the cutting direction (z'") while bringing the cutting plane of the single crystal (2) parallel to the direction of cutting of the machine. The device for practicing the method comprises a frame (5), two cylinders (8) mounted rotatably on the frame and supporting the single crystal (2) and a rotatable plate (12) adapted to maintain the cutting support (3) belonging both to the positioning device (1) and the cutting machine.

Abstract: A thread sawing device comprising a frame carrying thread guide cylinders and having a thread trained about the thread guide cylinders. A support is provided for a part to be sawed, and the thread and support are movable toward and away from each other to saw the part supported by the support. The relative position of the cylinders and the part to be sawed is detected, and responsive to that detection, the temperature of a portion of the device is changed so as to cause that portion to undergo thermal expansion or contraction, so as to maintain the desired relative position constant in a direction transverse to the direction in which the thread and the support move toward and away from each other to saw the part to be sawed. The portion of the device whose temperature is changed is one of the cylinders, or the support.

Abstract: A cutter bit comprising a cutting edge (1), a nose (2) and a chip-breaker (3) formed by a throat situated along the cutting edge. This chip-breaking throat is delimited inwardly of the bit by a heel (6), whose height relative to the bottom of the throat decreases from the nose in a direction toward the center of the bit.