Patents by Inventor Charles Hung-Hsiang Wu

Charles Hung-Hsiang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rule-based semiconductor die stacking and bonding within a multi-die package
    Patent number: 8399298
    Abstract: A rule-based method of optimizing wire bonding jumps is disclosed which minimizes the amount of wire used for wire bonds and/or minimizes a number of power and ground pads on a substrate to support all wired connections.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: March 19, 2013
    Assignee: SanDisk Technologies Inc.
    Inventor: Charles Hung-Hsiang Wu
  • Rule-Based Semiconductor Die Stacking And Bonding Within A Multi-Die Package
    Publication number: 20120196403
    Abstract: A rule-based method of optimizing wire bonding jumps is disclosed which minimizes the amount of wire used for wire bonds and/or minimizes a number of power and ground pads on a substrate to support all wired connections.
    Type: Application
    Filed: April 12, 2012
    Publication date: August 2, 2012
    Inventor: Charles Hung-Hsiang Wu
  • Rule-based semiconductor die stacking and bonding within a multi-die package
    Patent number: 8158457
    Abstract: A rule-based method of optimizing wire bonding jumps is disclosed which minimizes the amount of wire used for wire bonds and/or minimizes a number of power and ground pads on a substrate to support all wired connections.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: April 17, 2012
    Assignee: SanDisk Technologies Inc.
    Inventor: Charles Hung-Hsiang Wu
  • Rule-Based Semiconductor Die Stacking And Bonding Within A Multi-Die Package
    Publication number: 20110195529
    Abstract: A rule-based method of optimizing wire bonding jumps is disclosed which minimizes the amount of wire used for wire bonds and/or minimizes a number of power and ground pads on a substrate to support all wired connections.
    Type: Application
    Filed: February 8, 2010
    Publication date: August 11, 2011
    Inventor: Charles Hung-Hsiang Wu