Patents by Inventor CHARLES IAN DADUYA FERRARIS

CHARLES IAN DADUYA FERRARIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image capturing module and optical auxiliary unit thereof
    Patent number: 9411136
    Abstract: An image capturing module includes an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame for covering the image sensing chip and a movable lens assembly movably disposed in the housing frame. The movable lens assembly includes a movable casing movably disposed in the housing frame, at least one optical lens group disposed in the movable casing, a microlens array substrate disposed in the movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: August 9, 2016
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventor: Charles Ian Daduya Ferraris
  • Image capturing module and image sensing unit thereof
    Patent number: 9077880
    Abstract: An image capturing module includes an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate, an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, a microlens array substrate disposed on the image sensing chip, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability. The optical auxiliary unit includes a housing frame and a movable lens assembly. The housing frame is disposed on the carrier substrate to cover the image sensing chip, the microlens array substrate and the nonconductive photosensitive film layer, and the movable lens assembly is movably disposed in the housing frame.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: July 7, 2015
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventor: Charles Ian Daduya Ferraris
  • IMAGE CAPTURING MODULE AND OPTICAL AUXILIARY UNIT THEREOF
    Publication number: 20150116575
    Abstract: An image capturing module includes an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame for covering the image sensing chip and a movable lens assembly movably disposed in the housing frame. The movable lens assembly includes a movable casing movably disposed in the housing frame, at least one optical lens group disposed in the movable casing, a microlens array substrate disposed in the movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.
    Type: Application
    Filed: October 29, 2013
    Publication date: April 30, 2015
    Applicant: LARVIEW TECHNOLOGIES CORP.
    Inventor: CHARLES IAN DADUYA FERRARIS
  • IMAGE CAPTURING MODULE AND ACTUATOR STRUCTURE THEREOF
    Publication number: 20150116588
    Abstract: An image capturing module includes an image sensing unit and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate. The actuator structure includes a first actuator unit and a second actuator unit. The first actuator unit includes a first housing frame and a first movable assembly movably disposed inside the first housing frame and above the image sensing unit. The second actuator unit includes a second housing frame and a second movable assembly movably disposed inside the second housing frame and above the image sensing unit, and the second movable assembly includes a second movable casing movably disposed in the second housing frame, a microlens array substrate disposed in the second movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.
    Type: Application
    Filed: October 25, 2013
    Publication date: April 30, 2015
    Applicant: LARVIEW TECHNOLOGIES CORP.
    Inventor: CHARLES IAN DADUYA FERRARIS
  • IMAGE CAPTURING MODULE AND IMAGE SENSING UNIT THEREOF
    Publication number: 20150077625
    Abstract: An image capturing module includes an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate, an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate, a microlens array substrate disposed on the image sensing chip, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability. The optical auxiliary unit includes a housing frame and a movable lens assembly. The housing frame is disposed on the carrier substrate to cover the image sensing chip, the microlens array substrate and the nonconductive photosensitive film layer, and the movable lens assembly is movably disposed in the housing frame.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 19, 2015
    Inventor: CHARLES IAN DADUYA FERRARIS