Abstract: A system is including: an overmolded layer that is placed above a top surface and below a bottom surface of a circuit board, wherein the overmolded layer exposes at least communication interfaces on the circuit board and surrounds a heat generating component on the circuit board; a conductive layer that is placed over the overmolded layer on the top surface of the circuit board, wherein the conductive layer exposes the communication interfaces of the circuit board and covers the heat generating component on the circuit board; and wherein heat from the heat generating component is transferred into the conductive layer.

Abstract: 1. An inverter device is disclosed, including; an enclosure comprising a plurality of sides; an antenna port in a first side of the plurality of sides; and an antenna pass through module comprising: an exterior connector assembly comprising a plurality of pins and a base, wherein the plurality of pins are operable to be connected to respective ones of a plurality of antennas, wherein the plurality of pins passes through the antenna port to an exterior of the enclosure, wherein the base of the exterior connector assembly is sealed against the first side on an interior of the enclosure to provide ingress protection; and an interior antenna circuit configured to: terminate connections from a plurality of transceivers within the interior of the enclosure; and select antenna signals from at least the plurality of pins on the exterior connector assembly to route the plurality of transceivers.

Abstract: An insulating enclosure is disclosed, including: an opening in a side of the insulating enclosure, wherein the opening provides a conductor within a conduit passage into an interior of the insulating enclosure, wherein the conductor is to carry current from the inverter module, wherein a conductive sheath of the conduit is mechanically connected to the insulating enclosure via the opening; and a conductive liner, wherein the conductive liner provides a ground plane for components within the insulating enclosure, wherein the conductive liner covers at least a portion of the side of the insulating enclosure, and wherein the conductive liner is electrically connected to the conductive sheath of the conduit.

Abstract: A cover is disclosed, including: a first gasket that is placed along a portion of the cover that is to join with a heat sink; a second gasket that is placed around a cutout region of the cover, wherein the cover is configured to couple to a circuit board associated with the power module and expose a component on the circuit board through the cutout region; and a fastener that is configured to engage with the heat sink.

Abstract: 1. An inverter device is disclosed, including; an enclosure comprising a plurality of sides; an antenna port in a first side of the plurality of sides; and an antenna pass through module comprising: an exterior connector assembly comprising a plurality of pins and a base, wherein the plurality of pins are operable to be connected to respective ones of a plurality of antennas, wherein the plurality of pins passes through the antenna port to an exterior of the enclosure, wherein the base of the exterior connector assembly is sealed against the first side on an interior of the enclosure to provide ingress protection; and an interior antenna circuit configured to: terminate connections from a plurality of transceivers within the interior of the enclosure; and select antenna signals from at least the plurality of pins on the exterior connector assembly to route the plurality of transceivers.

Abstract: An insulating enclosure is disclosed, including: an opening in a side of the insulating enclosure, wherein the opening provides a conductor within a conduit passage into an interior of the insulating enclosure, wherein the conductor is to carry current from the inverter module, wherein a conductive sheath of the conduit is mechanically connected to the insulating enclosure via the opening; and a conductive liner, wherein the conductive liner provides a ground plane for components within the insulating enclosure, wherein the conductive liner covers at least a portion of the side of the insulating enclosure, and wherein the conductive liner is electrically connected to the conductive sheath of the conduit.

Abstract: A system is including: an overmolded layer that is placed above a top surface and below a bottom surface of a circuit board, wherein the overmolded layer exposes at least communication interfaces on the circuit board and surrounds a heat generating component on the circuit board; a conductive layer that is placed over the overmolded layer on the top surface of the circuit board, wherein the conductive layer exposes the communication interfaces of the circuit board and covers the heat generating component on the circuit board; and wherein heat from the heat generating component is transferred into the conductive layer.

Abstract: In various embodiments, an inductor thermal management system includes an inductor, and a heat sink. The heat sink includes a cavity and a spacer adapted to situate the inductor within the cavity and separate the inductor from at least one wall of the cavity such that heat is transferred from the inductor into the heat sink multi-directionally.

Abstract: A thermal interface sandwich is disclosed, including: a thermally conductive solid with a first surface and a second surface; a first thermal interface that is applied to the first surface of the thermally conductive solid; and a second thermal interface that is applied to the second surface of the thermally conductive solid.

Abstract: A gantry for thermal management is disclosed, including: a heat generating component that includes a top surface and a bottom surface; a heat sink; a thermally conductive and electrically insulating material that is in direct contact with the heat sink; and a gantry extending above the heat generating component, wherein the gantry pushes a pin against the top surface of the heat generating component such that the bottom surface of the heat generating component is pushed against the thermally conductive and electrically insulating material.

Abstract: Embodiments of a transistor package construction is disclosed, including: a transistor comprising: a source; and a drain; and a package comprising: a metallic back surface that is electrically connected to the drain; a top surface comprising a notch; and a thermally conductive and electrically insulating layer covering at least a portion of the metallic back surface of the package.

Abstract: An electronic rack includes a plurality of information technology (IT) components arranged in a stack, and a rack power supply having a voltage converter and a voltage regulator. The rack power supply to receive an input voltage from a power source, where the voltage converter is to convert the input voltage into an intermediate voltage, where the voltage regulator is to regulate the intermediate voltage to generate a regulated voltage to be supplied to the plurality of the IT components. Each electronic rack includes a fan system having one or more fan units coupled to the rack power supply to provide cooling air to reduce an operating temperature of the IT components, where each of the fan units is to receive the intermediate voltage without going through the voltage regulator and to provide power to a fan of the fan unit.

Abstract: An electronic rack includes a plurality of information technology (IT) components arranged in a stack, and a rack power supply having a voltage converter and a voltage regulator. The rack power supply to receive an input voltage from a power source, where the voltage converter is to convert the input voltage into an intermediate voltage, where the voltage regulator is to regulate the intermediate voltage to generate a regulated voltage to be supplied to the plurality of the IT components. Each electronic rack includes a fan system having one or more fan units coupled to the rack power supply to provide cooling air to reduce an operating temperature of the IT components, where each of the fan units is to receive the intermediate voltage without going through the voltage regulator and to provide power to a fan of the fan unit.

Abstract: An apparatus to widen the light dispersion pattern of a light source shining through an overlay window from the viewing side of an electrical computer system. The overlay window is coupled to a panel of the system. The overlay window includes a transparent material, which has a first surface facing the light source and a second surface facing away from the light source to define a viewing side. An opaque material can be disposed on the first surface to partially cover the first surface to form a viewing window. A first diffusing mechanism is disposed on the first surface, and a second diffusing mechanism is disposed on the second surface. In response to the passage of the light output through the viewing window, the light dispersion pattern of the light output from the viewing side of the overlay window has a viewing angle of up to about 180 degrees.

Abstract: An apparatus to widen the light dispersion pattern of a light source shining through an overlay window from the viewing side of an electrical computer system. The overlay window is coupled to a panel of the system. The overlay window includes a transparent material, which has a first surface facing the light source and a second surface facing away from the light source to define a viewing side. An opaque material can be disposed on the first surface to partially cover the first surface to form a viewing window. A first diffusing mechanism is disposed on the first surface, and a second diffusing mechanism is disposed on the second surface. In response to the passage of the light output through the viewing window, the light dispersion pattern of the light output from the viewing side of the overlay window has a viewing angle of up to about 180 degrees.

Abstract: An apparatus to widen the light dispersion pattern of a light source shining through an overlay window from the viewing side of an electrical computer system. The overlay window is coupled to a panel of the system. The overlay window includes a transparent material, which has a first surface facing the light source and a second surface facing away from the light source to define a viewing side. An opaque material can be disposed on the first surface to partially cover the first surface to form a viewing window. A first diffusing mechanism is disposed on the first surface, and a second diffusing mechanism is disposed on the second surface. In response to the passage of the light output through the viewing window, the light dispersion pattern of the light output from the viewing side of the overlay window has a viewing angle of up to about 180 degrees.

Abstract: An apparatus to widen the light dispersion pattern of a light source shining through an overlay window from the viewing side of an electrical computer system. The overlay window is coupled to a panel of the system. The overlay window includes a transparent material, which has a first surface facing the light source and a second surface facing away from the light source to define a viewing side. An opaque material can be disposed on the first surface to partially cover the first surface to form a viewing window. A first diffusing mechanism is disposed on the first surface, and a second diffusing mechanism is disposed on the second surface. In response to the passage of the light output through the viewing window, the light dispersion pattern of the light output from the viewing side of the overlay window has a viewing angle of up to about 180 degrees.

Abstract: An apparatus for mounting an integrated circuit chip to a main printed circuit board is disclosed. The mounting apparatus is particularly suitable for situations in which a cooling device of significant mass is used to cool the integrated circuit chip. In one embodiment, the mounting apparatus mounts the integrated circuit chip onto a daughter or sub-printed circuit (PC) board, attaches the cooling device to the integrated circuit chip, supports the cooling device (as well as the integrated circuit chip and the daughter or sub-PC board) with support members, and uses flexible conductors to electrically connect the daughter or sub-PC board to the main printed circuit board. In another embodiment, the mounting apparatus attaches the cooling device to the integrated circuit chip, supports the cooling device (as well as the integrated circuit chip) with support members, and uses a flexible connection means to electrically connect the integrated circuit chip to the printed circuit board.