Abstract: Aspects of the present disclosure may be directed to a wrap-around antenna capable of being wrapped around a support structure to provide antenna patterns for a communication system. Such an assembly may be aesthetically pleasing and, because the antenna assembly allows for radiation away from the support structure, scattering effects due to interference from the support structure may be eliminated.

Abstract: Aspects of the present disclosure may be directed to a multi-layer feed-board with all the functional components, including phase shifters, diplexers, and dipole element, employed thereon. Therefore, solder interfaces at cable to functional component interfaces are no longer necessary. Instead, component interfaces are within the confines of the multi-layer feed-board, thereby reducing PIM issues attributed to solder joint interfaces.

Abstract: Aspects of the present disclosure may be directed to a wrap-around antenna capable of being wrapped around a support structure to provide antenna patterns for a communication system. Such an assembly may be aesthetically pleasing and, because the antenna assembly allows for radiation away from the support structure, scattering effects due to interference from the support structure may be eliminated.

Abstract: Aspects of the present disclosure may be directed to a wrap-around antenna capable of being wrapped around a support structure to provide antenna patterns for a communication system. Such an assembly may be aesthetically pleasing and, because the antenna assembly allows for radiation away from the support structure, scattering effects due to interference from the support structure may be eliminated.

Abstract: In one embodiment, an antenna assembly in a cellular network has a radome that houses a plurality of antenna arrays and an electronics module. The electronics module has a weatherproof housing that encloses electronics for processing signals received by and transmitted from a first of the antenna arrays. The electronics module is physically removeably connected to an outer surface of the radome and electrically removeably connected to the first antenna array, such that the electronics module can be removed without (i) disrupting service to other antenna arrays and (ii) removing the antenna assembly from the cell tower on which the antenna assembly is installed.

Abstract: Aspects of the present disclosure may be directed to a multi-layer feed-board with all the functional components, including phase shifters, diplexers, and dipole element, employed thereon. Therefore, solder interfaces at cable to functional component interfaces are no longer necessary. Instead, component interfaces are within the confines of the multi-layer feed-board, thereby reducing PIM issues attributed to solder joint interfaces.

Abstract: Aspects of the present disclosure may be directed to a wrap-around antenna capable of being wrapped around a support structure to provide antenna patterns for a communication system. Such an assembly may be aesthetically pleasing and, because the antenna assembly allows for radiation away from the support structure, scattering effects due to interference from the support structure may be eliminated.

Abstract: In one embodiment, an antenna assembly in a cellular network has a radome that houses a plurality of antenna arrays and an electronics module. The electronics module has a weatherproof housing that encloses electronics for processing signals received by and transmitted from a first of the antenna arrays. The electronics module is physically removeably connected to an outer surface of the radome and electrically removeably connected to the first antenna array, such that the electronics module can be removed without (i) disrupting service to other antenna arrays and (ii) removing the antenna assembly from the cell tower on which the antenna assembly is installed.

Abstract: In one embodiment, an antenna assembly in a cellular network has a radome that houses a plurality of antenna arrays and an electronics module. The electronics module has a weatherproof housing that encloses electronics for processing signals received by and transmitted from a first of the antenna arrays. The electronics module is physically removeably connected to an outer surface of the radome and electrically removeably connected to the first antenna array, such that the electronics module can be removed without (i) disrupting service to other antenna arrays and (ii) removing the antenna assembly from the cell tower on which the antenna assembly is installed.

Abstract: A modular wireless communications station includes a standard antenna interface, a wireless communications antenna, and a remote radio head. The standard interface includes an antenna mount for the wireless communications antenna and at least one radio head mount. The radio head mount includes at least one linear guided support structure. The wireless communications antenna includes a bracket configured to engage the antenna mount and at least one RF interconnection module, the wireless communications antenna being mounted on the antenna mount. The remote radio head(s) include a low friction car configured to engage the linear guided support structure of the standard interface and an RF connector configured to engage the RF interconnection module of the antenna. The remote radio head may slide into engagement with the antenna and locked into place.

Abstract: In one embodiment, an antenna assembly in a cellular network has a radome that houses a plurality of antenna arrays and an electronics module. The electronics module has a weatherproof housing that encloses electronics for processing signals received by and transmitted from a first of the antenna arrays. The electronics module is physically removeably connected to an outer surface of the radome and electrically removeably connected to the first antenna array, such that the electronics module can be removed without (i) disrupting service to other antenna arrays and (ii) removing the antenna assembly from the cell tower on which the antenna assembly is installed.

Abstract: An RF interconnection module includes a housing having a perimeter, a capacitive coupling, and a float gasket disposed about the perimeter of the housing. When the housing is mounted in an opening, the float gasket is positioned between the housing and the opening. The float gasket may be made of an elastomer material and may include a plurality of outwardly extending ribs for movable securing the gasket in the opening. In addition, a mount assembly includes a bracket assembly attachable to a tower-mounted equipment and at least one jumper cable having at least one ohmic connector for connecting to the tower-mounted equipment and at least one capacitive connector. The capacitive connector may comprise an RF interconnection module mounted on the bracket assembly. The bracket assembly may be adjustable to accommodate tower mounted equipment of various sizes.

Abstract: A modular wireless communications station includes a standard antenna interface, a wireless communications antenna, and a remote radio head. The standard interface includes an antenna mount for the wireless communications antenna and at least one radio head mount. The radio head mount includes at least one linear guided support structure. The wireless communications antenna includes a bracket configured to engage the antenna mount and at least one RF interconnection module, the wireless communications antenna being mounted on the antenna mount. The remote radio head(s) include a low friction car configured to engage the linear guided support structure of the standard interface and an RF connector configured to engage the RF interconnection module of the antenna. The remote radio head may slide into engagement with the antenna and locked into place.

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole.

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole.