Abstract: An electronic rack includes a heat removal liquid manifold, a number of server slots, and a number of server blades inserted therein. The liquid manifold distributes heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain information technology (IT) components and a quick-release coupling assembly having a first liquid intake connector and a first liquid outlet connector coupled to a flexible hose to distribute the heat removal liquid to the IT components. The first liquid intake connector and the first liquid outlet connector are capable of extending outwardly external to the server tray to connect to, and disconnect from, a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold, respectively. The quick-release coupling assembly can self-retract and be secure to a block holder when disconnected.

Abstract: An electronic rack includes a back panel, a number of server slots, and a number of server blades inserted therein. The back panel includes a heat removal liquid manifold to provide heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain an information technology (IT) component and a self-fitting coupling assembly having a first liquid intake connector and a first liquid outlet connector to self-align with a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold mounted on the back panel. The first liquid intake connector and the first liquid outlet connector are capable of moving around within a predetermined tolerance space with respect to the server tray.

Abstract: An optimal controller is utilized minimize a total energy consumption of a CDU and cooling fans by optimizing a liquid pump speed of the CDU and fan speeds of the cooling fans collectively, while satisfying a set of constraints associated with liquid pump and the cooling fans. The total energy consumption includes a liquid pump energy cost and a fan energy cost. The optimal controller is to control the pump speed and fan speed at the same time to minimize the total energy cost, while keeping the processor's temperature below a predetermined reference temperature using an optimization function or model. The optimization model includes both the liquid and air cooling dynamics and converted the dynamics to a convex optimization problem. The optimization is performed to determine a set of pump speed and fan speeds such that the objective function reaches minimum, while the constraints are satisfied.

Abstract: An optimal controller is utilized minimize a total energy consumption of a CDU and cooling fans by optimizing a liquid pump speed of the CDU and fan speeds of the cooling fans collectively, while satisfying a set of constraints associated with liquid pump and the cooling fans. The total energy consumption includes a liquid pump energy cost and a fan energy cost. The optimal controller is to control the pump speed and fan speed at the same time to minimize the total energy cost, while keeping the processor's temperature below a predetermined reference temperature using an optimization function or model. The optimization model includes both the liquid and air cooling dynamics and converted the dynamics to a convex optimization problem. The optimization is performed to determine a set of pump speed and fan speeds such that the objective function reaches minimum, while the constraints are satisfied.

Abstract: A liquid control architecture is designed to control a liquid flow rate based on the workload of the IT components of an electronic rack, which provides sufficient cooling capability to each IT component, saving a total cost of pump energy. A coolant distribution unit (CDU) is included in each electronic rack to pump a liquid flow to a liquid supply manifold of the electronic rack. Each outlet on the supply manifold provides heat removal liquid to each IT component (e.g., one or more GPUs of a server blade) using flexible tubing. The liquid heat removal system utilizes the workload of each IT component to drive the CDU pump speed. In addition, the temperature of the IT components rather than return liquid temperature is utilized as a baseline to monitor the temperature of the electronic rack and change the control logic (e.g., liquid flow rate) as needed.

Abstract: An electronic rack includes a heat removal liquid manifold, a number of server slots, and a number of server blades inserted therein. The liquid manifold distributes heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain information technology (IT) components and a quick-release coupling assembly having a first liquid intake connector and a first liquid outlet connector coupled to a flexible hose to distribute the heat removal liquid to the IT components. The first liquid intake connector and the first liquid outlet connector are capable of extending outwardly external to the server tray to connect to, and disconnect from, a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold, respectively. The quick-release coupling assembly can self-retract and be secure to a block holder when disconnected.

Abstract: A liquid control architecture is designed to control a liquid flow rate based on the workload of the IT components of an electronic rack, which provides sufficient cooling capability to each IT component, saving a total cost of pump energy. A coolant distribution unit (CDU) is included in each electronic rack to pump a liquid flow to a liquid supply manifold of the electronic rack. Each outlet on the supply manifold provides heat removal liquid to each IT component (e.g., one or more GPUs of a server blade) using flexible tubing. The liquid heat removal system utilizes the workload of each IT component to drive the CDU pump speed. In addition, the temperature of the IT components rather than return liquid temperature is utilized as a baseline to monitor the temperature of the electronic rack and change the control logic (e.g., liquid flow rate) as needed.

Abstract: An electronic rack includes a back panel, a number of server slots, and a number of server blades inserted therein. The back panel includes a heat removal liquid manifold to provide heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain an information technology (IT) component and a self-fitting coupling assembly having a first liquid intake connector and a first liquid outlet connector to self-align with a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold mounted on the back panel. The first liquid intake connector and the first liquid outlet connector are capable of moving around within a predetermined tolerance space with respect to the server tray.

Abstract: An electronic rack includes a housing to contain one or more IT components arranged in a stack, a first rack aisle formed on a first side of the one or more IT components to direct cooler air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the one or more IT components to direct warmer air to the cooling unit downwardly. The electronic rack further includes a cooling unit having one or more cooling units disposed underneath the IT components to receive first liquid from an external chiller system, to exchange heat carried by the warmer air using the first liquid to generate the cooler air, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the external chiller system.

Abstract: An electronic rack includes a housing to contain one or more IT components arranged in a stack, a first rack aisle formed on a first side of the one or more IT components to direct cooler air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the one or more IT components to direct warmer air to the cooling unit downwardly. The electronic rack further includes a cooling unit having one or more cooling units disposed underneath the IT components to receive first liquid from an external chiller system, to exchange heat carried by the warmer air using the first liquid to generate the cooler air, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the external chiller system.

Abstract: A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.

Abstract: A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.

Abstract: A semiconductor-lid structure and method of forming a semiconductor-lid structure includes a semiconductor die, an ultrahigh thermal conductivity lid disposed on the semiconductor die, and a thermal interface layer between said semiconductor die and said ultrahigh thermal conductivity lid. The ultrahigh thermal conductivity lid includes a coupon having at least one uneven surface, a first layer on said at least one uneven surface formed from a process comprising one of sputter coating a highly adhesive metal over said uneven surface and sputtering a metallic seed layer, and a second layer on said first layer formed from a process comprising one of sputtering a metallic diffusion barrier layer over said first layer and electroplating the metallic seed layer with a highly conductive metal. The ultrahigh thermal conductivity lid has a smooth outer surface formed by chemical and/or mechanical processing of the ultrahigh thermal conductivity lid after formation of the second layer.

Abstract: A heat sink comprises a heat sink base and a row of heat sink extensions that are attached to one side of the heat sink base. An interleaved heat sink structure includes a first row and a second row of heat sink extensions. The first row and the second row of heat sink extensions are coupled respectively to a first and a second heat sink bases. The first and the second heat sink bases are thermally coupled to a first plurality of memory packages and a second plurality of memory packages, respectively. The first row of heat sink extensions is parallel to and at least partially interleaved with the second row of heat sink extensions. A memory heat dissipation control system and a method for assembly a memory part that includes a DIME and two heat sinks are also described.

Abstract: An electro-desorption actuator comprises a fixed member, a movable member which is coupled to the fixed member, a pressure chamber which is disposed between the fixed member and the movable member, and a sorption compression system which is in communication with the pressure chamber. The sorption compression system comprises first and second electrical conductors, a sorbent which is positioned between the first and second conductors, a sorbate which is capable of combining with the sorbent in an adsorption reaction to form a sorbate/sorbent compound, and a power supply which is connected to the conductors and which is selectively actuated to generate a current that is conducted through the sorbate/sorbent compound to desorb the sorbate from the sorbent in a desorption reaction. The sorbate is communicated from the sorption compression system to the pressure chamber during the desorption reaction and from the pressure chamber back to the sorption compression system during the adsorption reaction.