Abstract: The present disclosure includes apparatus, system, and method embodiments that provide micro electro mechanical system optical switching and methods of manufacturing switches. For example, one optical switch embodiment includes at least one micro electro mechanical system type pivot mirror structure disposed along a path of an optical signal, the structure having a mirror and an actuator, and the mirror having a pivot axis along a first edge and having a second edge rotatable with respect to the pivot axis, the mirror being capable of and arranged to be actuated to pivot between a position parallel to a plane of an optical signal and a position substantially normal to the plane of the optical signal.

Abstract: One apparatus embodiment includes an optical emitter and a photodetector. At least a portion of the optical emitter extends a radial distance from a center point. The photodetector provided around at least a portion of the optical emitter and positioned outside the radial distance of the portion of the optical emitter.

Abstract: A parallel mounted MEMs optical diagnostic switch disposed within an optical connector for directing optical signals from one or a plurality of light sources to one or a plurality of light collectors by activating a feedback loop through the use of micro electro mechanical systems (MEMS). The present invention includes one or more mirrors mounted parallel to the path of optical transmission through the tool. The mirrors and can be automatically activated at power up or selectively thereafter for detecting faults in any upstream fiber optic component. When in the passive mode, the present invention retracts away from the optical path so as not to interfere with normal system operations.

Abstract: An active optical device having a plurality of optical receiving or transmitting elements is secured to a carrier having two holes adapted to receive respective alignment pins of the connector. The optical device is secured to the carrier by a first solder ball contract array pattern on a surface of the optical device substrate and a second matching solder ball contact array pattern on a surface of the carrier. Solder balls disposed between the first solder ball contact array pattern of the optical device substrate and the second solder ball contact array pattern are melted so that solder reflow self-aligns the patterns, and further positions the optical device array in a predetermined orientation with respect to the alignment holes in the carrier. A flexible electrical interconnect member having a plurality of electrical traces is coupled to the active optical device at one of its ends and the other end is available for coupling to another device.

Abstract: A method of terminating multiple optical fibers, by placing terminal ends of the fibers into a connector to create a fiber end face array, locating a plurality of optical devices on a substrate in an array having a matching geometry as the fiber end face array, and positioning the connector with respect to the substrate to align the fiber end face array with the optical device array. The optical device substrate can be formed as part of a fiber termination fixture which further includes a carrier having two holes adapted to receive respective alignment pins of the connector.

Abstract: A method of terminating multiple optical fibers, by placing terminal ends of the fibers into a connector to create a fiber end face array, locating a plurality of optical devices on a substrate in an array having a matching geometry as the fiber end face array, and positioning the connector with respect to the substrate to align the fiber end face array with the optical device array. The optical device substrate can be formed as part of a fiber termination fixture which further includes a carrier having two holes adapted to receive respective alignment pins of the connector.

Abstract: An adhesive layer is applied to the surface of a flat, transparent flexible circuit that contains electrically conductive traces one, or more, electronic components is secured by the adhesive layer to the flexible circuit. A dam is formed that encircles at least a substantial portion of the component. A potting material fills the dam such that it encapsulates at least a substantial portion of the component. At least one via is provided in the flexible circuit and the adhesive layer in which electrically conductive material forms an electrical connection to the component. Additional vias are formed in the flexible circuit and the adhesive layer as required to make electrical connections to the traces of the flexible circuit. The component may be secured to a heat sink and the potting fill material may be removed to that it does not entirely cover the surface of the heat sink so that the surface of the heat sink that is remote from the component allows heat to escape into the surrounding environment.