Patents by Inventor Charles J. Vath, III

Charles J. Vath, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capillary for wire bonding
    Patent number: 7427009
    Abstract: A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: September 23, 2008
    Assignee: ASM Technology Singapore Pte Ltd.
    Inventors: Loon A Lim, Charles J Vath, III
  • Mold for a semiconductor chip
    Patent number: 6674165
    Abstract: A mold (1) for a semiconductor chip (9) has two mold halves (2, 3). One mold half (3) includes sealing means (10) adapted to exert a sealing pressure between a surface of the mold and a surface (18) of a substrate (8) located in the mold (1) during a molding operation.
    Type: Grant
    Filed: August 15, 2001
    Date of Patent: January 6, 2004
    Assignee: ASM Technology Singapore PTE LTD
    Inventors: Shu Chuen Ho, Teng Hock Kuah, Si Liang Lu, Srikanth Narasimulau, Charles J. Vath, III