Patents by Inventor Charles Joseph Vath, III

Charles Joseph Vath, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mold and method for encapsulation of electronic device
    Patent number: 6770163
    Abstract: A mold (1) is for molding a one-sided encapsulated electronic device. The mold (1) includes a first mold section (2) defining a mold cavity (4), and a second mold section (3) including a first recessed portion (6) adapted to receive a layer of material (15) attached to a leadframe (10), but not the leadframe (10).
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: August 3, 2004
    Assignee: ASM Technology Singapore PTE LTD
    Inventors: Teng Hock Kuah, Shu Chuen Ho, Charles Joseph Vath, III, Loon Aik Lim, Man Ho Hui, Juay Sim Koh