Abstract: In a binder such as a window binder having two opaque thermoplastic sheets sandwiching therebetween front and rear panels, a spine panel, and an outer clear panel forming a window over the spine panel and the front and rear panels, the spine has a depression or slot for receiving a spine label without substantial friction that would inhibit the insertion and removal of the spine label. The spine panel may either be sandwiched between the two opaque sheets, or it may be disposed on the outside of both of the opaque sheets, and the slot may be either open or closed at the side that faces the label printing. When disposed on the outside of the opaque sheets, the spine panel may be colored to provide a colored spine for an otherwise white or differently colored window binder.

Abstract: In a binder such as a window binder having two opaque thermoplastic sheets sandwiching therebetween front and rear panels, a spine panel, and an outer clear panel forming a window over the spine panel and the front and rear panels, the spine has a depression or slot for receiving a spine label without substantial friction that would inhibit the insertion and removal of the spine label. The spine panel may either be sandwiched between the two opaque sheets, or it may be disposed on the outside of both of the opaque sheets, and the slot may be either open or closed at the side that faces the label printing. When disposed on the outside of the opaque sheets, the spine panel may be colored to provide a colored spine for an otherwise white or differently colored window binder.

Abstract: A system for inspecting a component, such as a die formed on a silicon wafer, is provided. The system includes a two dimensional inspection system that can locate one or more features, such as bump contacts on the die, and which can also generate feature coordinate data. The system also includes a three dimensional inspection system that is connected to the two dimensional inspection system, such as through an operating system of a processor. The three dimensional inspection system receives the feature coordinate data and generates inspection control data.

Abstract: In a binder such as a window binder having two opaque thermoplastic sheets sandwiching therebetween front and rear panels and a spine panel and an outer clear thermoplastic panel forming a window over at least the spine, the outer surface of the spine panel has a depression formed in it such that the spine is thicker or otherwise raised near its vertical edges, and thinner or otherwise depressed between the raised portions. The opaque sheet covering the outward face of the spine panel is sufficiently flexible so as to deflect inwardly into the depression in the spine panel. The deflection of the thermoplastic sheet into the spine depression allows a spine label to be inserted into the pocket between the thermoplastic sheet with relatively little force.

Abstract: An illumination system for wire bonding at wire bonding locations which includes a first light source for directing light to the location to be illuminated along a predetermined axis, preferably normal to the wire bonding location, and a second light source having an aperture therethrough extending along the predetermined axis directing light in a pattern from around the aperture to the location to be illuminated. A portion of the light is reflectable back from the location to be illuminated through the aperture. The first light source directs light therefrom through the aperture. The light from the second light source for viewing of the lead frame comes from around the object and is diffused so that it scatters in all directions and at all angles. The amount of scattering depends upon the surface roughness at the edge of the light conductor from which the light exits the light conductor.

Abstract: An inspection system determines if leads of a semiconductor device are in proper positions. Images from at least two sides of the semiconductor device are captured along with calibration marks formed in the side of a track upon which the semiconductor device is mounted. All leads and calibration marks are captured in a single video image, the images from one side of the semiconductor device being off set from the image from the other side.

Abstract: An illumination system for wire bonding at wire bonding locations which includes an illuminator having a highly light transmissive portion with an end surface and an axial bore extending therethrough and terminating at the end surface. The illuminator includes a first light source for directing light substantially axially through the bore to the end surface and a second light source for directing light substantially axially through the highly light transmissive portion to the end surface. The end surface is preferably a light diffusing surface. The bore is preferably tapered with the taper widening in a direction toward the end surface. The surface of the bore is preferably a light diffusing surface. The bore can alternately include a layer of highly light reflecting material disposed on its surface. The highly light transmissive portion has an outer surface which can include a layer of highly light reflecting material disposed thereon.

Abstract: A device (10) identifies a defective object (12) from an image of the object (12) stored as pixel data in a pixel-data memory (52, 54, 56, 58). An inspection-point memory (72, 74, 76, 78) stores inspection-point data for the object (12). The inspection-point data represents inspection points (122, 124, . . . ) that are arranged in circuital (112, 136) and transverse (110) groups, where member inspection points of the circuital groups (112, 136) are also members of different ones of the transverse groups (110). A program memory (84) stores a program, which is executed by a processor (64, 66, 68, 70).

Abstract: An inspection system utilizes an image doubler design that includes a plurality of mirrors that effectively folds the object distance by reflecting the image along a folded path. Strobed illumination is used in conjunction with a shutterless camera. Increased image resolution results from an optional anamorphic lens with vertical magnification. The lens assembly includes concentric toroidal lens that are produced from a single piece of machineable optical material.

Abstract: The invention is to a system and apparatus for determining the planarity of leads on a semiconductor device. An image system is used to locate the leads with reference to a reference plate on which the device is mounted, and a real-time reference which is used to provide a known correlation between image pixels and linear measurement such as mils.

Abstract: A single camera container inspection system that views the entire interior surface of a container during one pass, producing a single image of the interior surfaces to detect defects and contaminants in the interior surfaces of the container.