Patents by Inventor Charles Kinzel

Charles Kinzel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210272891
    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
    Type: Application
    Filed: May 18, 2021
    Publication date: September 2, 2021
    Inventors: Mark Ronay, Jorge E. Carbo, Trevor Spiegel Antonio Rivera, Charles Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
  • Publication number: 20200381349
    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 3, 2020
    Applicant: Liquid Wire Inc.
    Inventors: Mark Ronay, Jorge E. Carbo, Trevor Spiegel Antonio Rivera, Charles Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
  • Publication number: 20200066628
    Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 27, 2020
    Applicant: Liquid Wire Inc.
    Inventors: Mark Ronay, Trevor Spiegel Antonio Rivera, Michael Adventure Hopkins, Edward Godshalk, Charles Kinzel