Abstract: The present invention provides a copper oxide-containing composition that includes copper oxide nanoparticles and one or more heteroatom donor ligands bonded to the surface of the nanoparticles, where x and y are numbers having a ratio that is equal to the ratio of the average number of M atoms to the average number of O atoms in the nanoparticles. The nanoparticles are stabilized by the one or more heteroatom donor ligands which act as a protective layer that cap the surface of the nanoparticles. The present invention also provides a solution of the copper oxide nanoparticles that may be applied to a substrate and then subsequently reduced to copper metal. Finally, the invention provides a method of preparing the copper oxide nanoparticles.

Abstract: The invention relates to methods of making monodisperse nanocrystals comprising the steps of reducing a copper salt with a reducing agent, providing a passivating agent comprising a nitrogen and/or an oxygen donating moitey and isolating the copper nanocrystals. Moreover, the invention relates to methods for making a copper film comprising the steps of applying a solvent comprising copper nanocrystals onto a substrate and heating the substrate to form a film of continuous bulk copper from said nanocrystals. Finally, the invention also relates to methods for filling a feature on a substrate with copper comprising the steps of applying a solvent comprising copper nanocrystals onto the featured substrate and heating the substrate to fill the feature by forming continuous bulk copper in the feature.

Abstract: The invention relates to methods of making monodisperse nanocrystals comprising the steps of reducing a copper salt with a reducing agent, providing a passivating agent comprising a nitrogen and/or an oxygen donating moitey and isolating the copper nanocrystals. Moreover, the invention relates to methods for making a copper film comprising the steps of applying a solvent comprising copper nanocrystals onto a substrate and heating the substrate to form a film of continuous bulk copper from said nanocrystals. Finally, the invention also relates to methods for filling a feature on a substrate with copper comprising the steps of applying a solvent comprising copper nanocrystals onto the featured substrate and heating the substrate to fill the feature by forming continuous bulk copper in the feature.