Patents by Inventor Charles L. Lassen

Charles L. Lassen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrates to interconnect electronic components
    Patent number: 4602318
    Abstract: Substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-determined pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.
    Type: Grant
    Filed: July 25, 1984
    Date of Patent: July 22, 1986
    Assignee: Kollmorgen Technologies Corporation
    Inventor: Charles L. Lassen
  • Process for the manufacture of substrates to interconnect electronic components
    Patent number: 4544442
    Abstract: A process for making substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-programmed pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.
    Type: Grant
    Filed: July 24, 1984
    Date of Patent: October 1, 1985
    Assignee: Kollmorgen Technologies Corporation
    Inventor: Charles L. Lassen
  • Process for the manufacture of substrates to interconnect electronic components and articles made by said process
    Patent number: 4541882
    Abstract: A process for making substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-programmed pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.
    Type: Grant
    Filed: July 25, 1984
    Date of Patent: September 17, 1985
    Assignee: Kollmorgen Technologies Corporation
    Inventor: Charles L. Lassen
  • Process for the manufacture of substrates to interconnect electronic components
    Patent number: 4500389
    Abstract: A process for making substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-programmed pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.
    Type: Grant
    Filed: April 14, 1981
    Date of Patent: February 19, 1985
    Assignee: Kollmorgen Technologies Corporation
    Inventor: Charles L. Lassen