Patents by Inventor Charles L. Reynolds, Jr.

Charles L. Reynolds, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-destructive low melt test for off-composition solder
    Patent number: 6016947
    Abstract: A non-destructive method for identifying off-composition solder columns of for example, a ceramic column grid array. The method is performed at the ceramic module level prior to card assembly to avoid costly loss or rework post card assembly. The assembly of solder columns on a substrate is heated to a temperature below the melting temperature of pure-composition solder and above the temperature of attachment of a solder column to an organic board. Heating the assembly produces visually detectable changes characteristic of off-composition solder which are used for identifying which solder columns are composed of off-composition solder.
    Type: Grant
    Filed: October 21, 1997
    Date of Patent: January 25, 2000
    Assignee: International Business Machines Corporation
    Inventors: Timothy W. Donahue, Ellyn M. Ingalls, Chon Cheong Lei, Wai Mon Ma, Horatio Quinones, Charles L. Reynolds, Jr., Peter J. Brofman