Abstract: An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals.

Abstract: A spray cooling system for extreme environments for providing a desired enclosed environment for electronic devices regardless of external environmental conditions. The spray cooling system for extreme environments includes an enclosure that isolates the electronic components from the external environment, a spray unit within the enclosure for thermally managing one or more electronic devices, a pump unit fluidly connected to the spray unit, a heat exchanger unit fluidly connected to the pump, and a control valve fluidly connected between the heat exchanger unit and the pump. An independent chamber preferably houses a heater unit, a first power supply and a control unit, whereby the heater unit initially heats the coolant within the independent chamber to a minimum operating temperature prior to operation of the electronic components.

Abstract: A spray cooling system for transverse thin-film evaporative spray cooling in a narrow gap which generally includes a framework, a cooling cavity, a plurality of atomizers oriented to transversely spray coolant across the electronic components to be cooled, and preferably a vapor recirculation system and a reduction in cross section from the inlet or spray side to the exit side.

Abstract: The present invention is a spray cooling thermal management device that cools an electronic component. Liquid coolant is dispensed upon a heated surface containing etched open microchannels.

Abstract: A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.

Abstract: A coolant recovery system for reducing coolant loss within thermal management systems. The coolant recovery system includes a thermal management unit having a spray chamber and a coolant recovery chamber, a first cooling coil within the coolant recovery chamber, and a chilled water supply fluidly connected to the first cooling coil. The coolant is sprayed upon the electronic device within the spray chamber and then is collected into the coolant recovery chamber for thermal conditioning. A removable chamber may be removably positioned within the spray chamber. In an alternative embodiment, a central unit may be connected to a plurality of thermal management units.

Abstract: A dynamic spray system for effectively thermally managing electronic components. The dynamic spray system includes one or more spray units each having a housing structure, a first portion, a first orifice within said first portion fluidly connected to a swirl chamber, a main jet fluidly connected to the swirl chamber, a plunger movably positioned within the main jet for adjusting fluid flow through the main jet, and at least one swirl inlet fluidly connected to the swirl chamber for generating a fluid swirl effect within the swirl chamber. The main jet is preferably aligned with the first orifice for dispersing a relatively narrow spray pattern from the first orifice when the fluid flow is increased through the main jet. The spray pattern is broadened when the fluid flow through the main jet is decreased.

Abstract: A semiconductor burn-in thermal management system for providing an effective thermal management system capable of maintaining a desired semiconductor temperature during a burn-in cycle. The semiconductor burn-in thermal management system includes a reservoir for storing a volume of fluid, a pump fluidly connected to the reservoir, and a plurality of spray units fluidly connected to the pump. The spray units dispense the fluid upon the surface of the semiconductor during burn-in thereby maintaining a relatively constant surface temperature. Each of the spray units preferably includes a stationary first portion with a second portion movably positioned within the first portion in a biased manner. When burning in semiconductors without an integrated heat sink that are deeply recessed within the sockets of a burn-in board, the fluid pressure to the second portion is increased thereby extending the second portion from the first portion thereby reducing the effective distance from the surface of the semiconductor.

Abstract: The present invention is a coldplate hotspot spray cooling system that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon a spray pin protruding from a base wherein the liquid creates a very high heat absorbing evaporative thin film. The spray pin is located over an area of the chip that produces a large heat flux, typically referred to as a hotspot. The small size and isolation of the spray pin provides the ability to generate very large heat fluxes. Multiple spray pins are possible.

Abstract: A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.

Abstract: A thermal management system configured to maximize the potential of single and multiple atomizers to effectively cool microprocessors and other electronic devices. The thermal management system, which may be a heat spreader, provides surfaces that are disposed to increase the effectiveness of impinging coolant droplets, provide additional heat transfer area in some embodiments, and permit the efficient, customized and disparate thermal management of a recipient object of the thermal management.

Abstract: An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attached to a substrate, a cap attached about the lid creating a heat dissipation chamber, and a semiconductor chip attached to the lid by a thermally conductive adhesive. The lid may or may not form a cavity about the semiconductor chip depending upon the substrate utilized. The lid preferably includes a plurality of fins extending from thereof defining a plurality of channels or a plurality of grooves thereby increasing the heat flux of the lid.

Abstract: A semiconductor burn-in thermal management system for providing an effective thermal management system capable of maintaining a desired semiconductor temperature during a burn-in cycle. The semiconductor burn-in thermal management system includes a reservoir for storing a volume of fluid, a pump fluidly connected to the reservoir, and a plurality of spray units fluidly connected to the pump. The spray units dispense the fluid upon the surface of the semiconductor during burn-in thereby maintaining a relatively constant surface temperature. Each of the spray units preferably includes a stationary first portion with a second portion movably positioned within the first portion in a biased manner. When burning in semiconductors without an integrated heat sink that are deeply recessed within the sockets of a burn-in board, the fluid pressure to the second portion is increased thereby extending the second portion from the first portion thereby reducing the effective distance from the surface of the semiconductor.

Abstract: A dynamic spray system for effectively thermally managing electronic components. The dynamic spray system includes one or more spray units each having a housing structure, a first portion, a first orifice within said first portion fluidly connected to a swirl chamber, a main jet fluidly connected to the swirl chamber, a plunger movably positioned within the main jet for adjusting fluid flow through the main jet, and at least one swirl inlet fluidly connected to the swirl chamber for generating a fluid swirl effect within the swirl chamber. The main jet is preferably aligned with the first orifice for dispersing a relatively narrow spray pattern from the first orifice when the fluid flow is increased through the main jet. The spray pattern is broadened when the fluid flow through the main jet is decreased.

Abstract: A spray cooling system for transverse thin-film evaporative spray cooling in a narrow gap which generally includes a framework, a cooling cavity, a plurality of atomizers oriented to transversely spray coolant across the electronic components to be cooled, and preferably a vapor recirculation system and a reduction in cross section from the inlet or spray side to the exit side.

Abstract: A spray cooled motor system with a motor housing with an interior and an exterior, a stator mounted within the interior of the motor housing, a rotor mounted within the interior of the motor housing, a coil winding mounted within the interior of the motor housing, a plurality of atomizers configured to spray a coolant on at least one of the stator and the rotor, a coolant pump in fluid communication with the plurality of atomizers; and an output shaft extending through an output shaft aperture from the interior to the exterior of the motor housing.

Abstract: A fluid control apparatus is adapted for use with a spray plate 100 having at least one atomizer 120 which cools an associated printed circuit board 200 carrying one or more heat-generating components such as integrated circuits 220. At least one spray plate and printed circuit board are carried within a coolant-tight enclosure such as a spray module 300. A preferred shroud 20 is supported by the spray plate. The shroud encloses a spray cavity 24 and provides control over the flow and direction of the spray coolant leaving the atomizers enclosed by the shroud. Control over the flow and direction of the coolant spray better cools the components carried on the printed circuit board and partially enclosed by the shroud.

Abstract: An EMI shielding fluid control shroud is adapted for use in spray cooling EMI producing or EMI sensitive components. The EMI shielding shroud, carried between a printed circuit board and a spray plate, defines an interior spray cavity which prevents interference with coolant spray directed at one or more heat-generating, EMI producing or sensitive components, such as integrated circuits. The size and shape of the shroud provide control over the flow and direction of the coolant spray and result in better cooling of the components carried on the printed circuit board and partially enclosed by the shroud. The shroud provides an EMI shield which prevents passage by EMI in either direction, while allowing coolant fluid to exit through the EMI shielding material.

Abstract: A method for manufacturing a spray plate includes the steps of making a plurality of layers from powdered metal, solidified by pressure between an appropriate upper die and lower die. The dies define appropriate holes required to form inlet ports, feed ports, swirl chamber or discharge apertures. Fluid pressure applied to the back side of the die flushes away green, unfired material in selected areas from each layer, thereby forming a layer having an array of swirl atomizer components. A multi-layered spray plate is assembled from a plurality of layers, which in a preferred version includes two to four layers, which are stacked so that the alignment features are in-line and associated atomizer components are aligned. The layers are then joined into a monolithic fused plate, by compacting and firing the layers.

Abstract: A spray cooled circuit card cage includes opposed card guides separated by opposed card cage side panels. Each card guide carries a top rail and lower manifold. The manifold provides coolant fluid to a plurality of spray plate assemblies, which direct a spray of coolant over the top surface of the electronic cards carried between the card guides. A VME or other type of electronic back plane is typically attached to the manifolds and a back plane support, and is in electronic communication with the circuit cards.