Patents by Inventor Charles Lecornec

Charles Lecornec has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for fabricating interconnect networks
    Patent number: 7064061
    Abstract: The process includes depositing a filling material in trenches formed in at least one layer of dielectric so as to fill open pores in the dielectric. The filling material is intended to prevent the subsequent diffusion of the interconnect metal and/or of a metal of a diffusion barrier, and may be non-porous. The filling material preferably has a low dielectric constant.
    Type: Grant
    Filed: January 17, 2002
    Date of Patent: June 20, 2006
    Assignees: STMicroelectronics SA, Commissariat a l'Energie Atomique
    Inventors: Gérard Passemard, Emmanuel Sicurani, Charles Lecornec
  • Method for making interconnection networks
    Publication number: 20040115910
    Abstract: The process includes depositing a filling material in trenches formed in at least one layer of dielectric so as to fill open pores in the dielectric. The filling material is intended to prevent the subsequent diffusion of the interconnect metal and/or of a metal of a diffusion barrier, and may be non-porous. The filling material preferably has a low dielectric constant.
    Type: Application
    Filed: November 24, 2003
    Publication date: June 17, 2004
    Inventors: Gerard Passemard, Emmanuel Sicurani, Charles Lecornec