Patents by Inventor Charles M. Dalton

Charles M. Dalton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple layer, tungsten/titanium/titanium nitride adhesion/diffusion barrier layer structure for gold-base microcircuit interconnection
    Patent number: 4753851
    Abstract: The inability of conventional adhesion/diffusion barrier Ti-TiN laminates to secure a narrow linewidth electrodeposited gold layer to a silicon structure and prevent unwanted gold diffusion during anneal cycles at temperatures greater than 370.degree. C. for substantial periods of time is overcome by the addition of a medium thickness (.gtoreq.1,500.ANG.) layer of tungsten over the exposed silicon prior to formation of the titanium/titanium nitride laminate structure.
    Type: Grant
    Filed: May 29, 1987
    Date of Patent: June 28, 1988
    Assignee: Harris
    Inventors: Bruce E. Roberts, Charles M. Dalton, Jimmy C. Black