Abstract: A flexible infrared emissive module comprises an electrically insulating carrier layer (12), an electrically conductive layer (14) mounted to the carrier layer, an electrically insulating top layer (18) mounted to the carrier and electrically conductive layers on one side of the carrier layer and an electrically insulating bottom layer (16) mounted to the other side of the carrier layer. The carrier layer comprises a vinyl film, and the top and bottom layers comprise a polyester film, which are mounted to the carrier layer by a heat and pressure sensitive adhesive. The electrically conductive layer comprises a fibrous composite of a fluoroelastomer and carbon, wherein the electrically conductive layer is comprised mainly of the fluoroelastonier.