Abstract: One or more thin film layers of material may be formed on an integrated circuit substrate and anisotropically etched to produce a monolithic thermal detector. A first layer of material may be placed on the integrated circuit substrate and anisotropically etched to form a plurality of supporting structures for the thermal sensors of the associated focal plane array. The thermal sensors of the focal plane array may be provided by anisotropically etching one or more thin film layers of material formed on the supporting structures. In an exemplary thermal detector, one of the thin film layers preferably includes pyroelectric material such as barium strontium titanate. A layer of thermal insulating material may be disposed between the integrated circuit substrate and the pyroelectric film layer to allow annealing of the pyroelectric film layer without causing damage to the associated integrated circuit substrate.

Abstract: A hybrid thermal detector and method for producing same where the optical coating 32 of the hybrid thermal detector has elongated parallel thermal isolation stots 62 along one axis. The elongated parallel slots 62 improve the acuity, or MTF of the resultant image produced by the detector along one axis. The optical coating 32 may be corrugated, or elevated, in order to add structural support and allow mechanical compliance along the axis of the slots.

Abstract: A thermal isolation structure (10) is disposed between a focal plane array and an integrated circuit substrate (12). The thermal isolation structure (10) includes a mesa-type formation (16) and a mesa strip conductor (18, 26) extending from the top of the mesa-type formation (16) to an associated contact pad (14) on the integrated circuit substrate (12). After formation of the mesa-type formation (16) and the mesa strip conductor (18, 26), an anisotropic etch using the mesa strip conductor (18, 26) as an etch mask removes excess mesa material to form trimmed mesa-type formation (24) for improved thermal isolation. Bump bonding material (20) may be deposited on mesa strip conductor (18, 26) and can also be used as an etch mask during the anisotropic etch. Thermal isolation structure (100) can include mesa-type formations (102), each with a centrally located via (110) extending vertically to an associated contact pad (104) of integrated circuit substrate (106).

Abstract: A thermal imaging system (10) contains a focal plane array (30) including a plurality of thermal sensors (32) mounted on a substrate (62). Each thermal sensor (32) includes a film layer (34) of infrared sensitive material which is both electronically and thermally isolated from the associated integrated circuit substrate (62). An image may be formed on the film layer (34) in response to infrared radiation from a scene (12). Electromagnetic radiation (22) from a source (visible light or near infrared) (20) is used to reproduce or transfer the image from the thermal sensors (32) onto the first surface (68) of the substrate (62). A thermoelectric cooler/heater (66) may be provided to optimally adjust the temperature of the substrate (62) to improve overall image quality.

Abstract: A thermal imaging system (10) contains a focal plane array (14) including a plurality of thermal sensors (50) mounted on a substrate (52). The focal plane array (14) generates both a reference signal which represents the temperature of the substrate (52) and a biased signal corresponding to the total radiance emitted by a scene (11). Electronics (16) process the reference signal and the biased signal to obtain an unbiased signal representing radiance differences emitted by objects in the scene (11). A thermoelectric cooler/heater (38) may be provided to optimally adjust the temperature of the substrate (52) to improve overall image quality. Each thermal sensor (50) contains an electrode (66 and 68) that electrically couples the thermal sensor (50) to the substrate (52) and also allows the thermal sensor (50) to deflect, contact, and thermally shunt with the substrate (52).

Abstract: A mesa-type structure (52) is formed from polyimide (or a similar polymer material) to achieve a supporting structure for mounting a focal plane array (30 and 130) on an integrated circuit substrate (70 and 170). In an exemplary thermal imaging system (20 and 120), a thermal isolation structure (50 and 150) is disposed on an integrated circuit substrate (70 and 170) for electrically connecting and mechanically bonding a corresponding focal plane array (30 and 130) of thermal sensors (40 and 140). Each mesa-type structure (52 and 152) initially includes a polyimide mesa (54) over which is formed a reinforcing layer (56 and 156) and a metal conductor (58, 158 and 168) that extends from the top of the mesa-type structure (52 and 152) to an adjacent contact pad (72, 172 and 174). After the focal plane array (30 and 130) is bonded to the corresponding array of mesa-type structures (52 and 152), the polyimide mesas (54) are removed to create void spaces (60 and 160).

Abstract: A thermal isolation structure (10) is disposed between a focal plane array and an integrated circuit substrate (12). The thermal isolation structure (10) includes a mesa-type formation (16) and a mesa strip conductor (18, 26) extending from the top of the mesa-type formation (16) to an associated contact pad (14) on the integrated circuit substrate (12). After formation of the mesa-type formation (16) and the mesa strip conductor (18, 26), an anisotropic etch using the mesa strip conductor (18, 26) as an etch mask removes excess mesa material to form trimmed mesa-type formation (24) for improved thermal isolation. Bump bonding material (20) may be deposited on mesa strip conductor (18, 26) and can also be used as an etch mask during the anisotropic etch. Thermal isolation structure (100) can include mesa-type formations (102), each with a centrally located via (110) extending vertically to an associated contact pad (104) of integrated circuit substrate (106).

Abstract: A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).

Abstract: In an exemplary thermal imaging system (20, 120, 220 and 320), a thermal isolation structure (50 and 150) is disposed on an integrated circuit substrate (70 and 170) for electrically connecting and mechanically bonding a focal plane array (30 and 230) of thermal sensors (40 and 240). Each mesa-type structure (52, 54 and 152) includes at least one mesa conductor (56, 58, 156 and 158) that extends from the top of the mesa-type structure (52, 54 and 152) to an adjacent contact pad (72 and 74). The mesa conductors (56, 58, 156 and 158) provide both biasing voltage (V.sub.B) for the respective thermal sensor (40 and 240) and a signal flow path (V.sub.S) for the respective thermal sensor (40 and 240). The mesa conductors (56, 56, 156 and 158) may be used to provide biasing voltage (V.sub.B) to either a single ferroelectric element (242) or a pair of ferroelectric elements (42 and 44).

Abstract: In an exemplary thermal imaging system (20, 120, 220 and 320), a thermal isolation structure (50 and 150) is disposed on an integrated circuit substrate (70 and 170) for electrically connecting and mechanically bonding a corresponding focal plane array (30, 130, and 230) of thermal sensors (40, 140, and 240). Each mesa-type structure (52, 54 and 152) includes at least one mesa conductor (56, 58, 156 and 158) that extends from the top of the mesa-type structure (52, 54 and 152) to an adjacent contact pad (72 and 74). The mesa conductors (56, 58, 156 and 158) provide both biasing voltage (V.sub.B) for the respective thermal sensor (40 and 240) and a signal flowpath (V.sub.s) for the respective thermal sensor (40 and 240). The mesa conductors (56, 58, 156 and 158) may be used to provide biasing voltage (V.sub.B) to either a single ferroelectric element (242 and 243) having a void space (277 and 279) or a pair of ferroelectric elements (42 and 44).

Abstract: A thermal detection system (100, 200) includes a focal plane array (102, 202), a thermal isolation structure (104, 204) and an integrated circuit substrate (106, 206). The focal plane array (102, 202) includes thermal sensors (114, 214) formed from a pyroelectric element (116, 216), such as barium strontium titanate (BST). One side of the pyroelectric element (116, 216) is coupled to a contact pad (110, 210) disposed on the integrated circuit substrate (106, 206) through a mesa strip conductor (112, 212) of the thermal isolation structure (104, 204). The other side of the pyroelectric element (116, 216) is coupled to a common electrode (120, 220). In one embodiment, slots (128) are formed in the common electrode (120) intermediate the thermal sensors (114) to improve inter-pixel thermal isolation. In another embodiment, slots (236) are formed in the optical coating (224) to improve inter-pixel thermal isolation.

Abstract: A video system is disclosed having a weapon-mounted video camera (12) transmitting video signals to a remotely located video display (14). The video display is mounted to the helmet (40) of a soldier (36), and includes a sight reticle (50) superimposed on the image of the target (46) so that the soldier (36) can aim the weapon (38) by moving it until the target object (46) as displayed by the video display (14) is aligned with the sight reticle (50). A low probability of transmission interception of the video signals is accomplished by using a nonvisible light carrier wavelength in free space, which wavelength is characterized by a high degree of absorption due to atmospheric water vapor.

Abstract: A monolithic infrared detector readout circuit for a capacitive detection element wherein a high gain preamplifier is biased by a large amplifier feedback resistance, on the order of 10.sup.12 ohms. The output of the preamplifier is bandlimited by a low pass single-pole filter having a high value resistor on the order of 10.sup.9 ohms and then is buffered prior to being multiplexed by row address signals. The output from the multiplexer switch is then applied to the column line for output to a video circuit or the like.

Abstract: A video display (38) provides a visual representation of a video signal over a matrix of pixels (40). Each pixel comprises a picture element (64) operable to radiate responsive to an externally applied voltage determined by the video signal. To prevent the intensity of a selected picture element (64) from being dependent upon the threshold potentials of the switching elements connecting the externally applied voltage to the picture elements (64), feedback lines (46) are provided to sense the voltage at the picture element (64). The voltage at the picture element (64) is adjusted until it equals the desired voltage.

Abstract: A video system is disclosed having a weapon-mounted video camera (12) transmitting video signals to a remotely located video display (14). The video display is mounted to the helmet (40) of a soldier (36), and includes a sight reticle (50) superimposed on the image of the target (46) so that the soldier (36) can aim the weapon (38) by moving it until the target object (46) as displayed by the video display (14) is aligned with the sight reticle (50). A low probability of transmission interception of the video signals is accomplished by using a nonvisible light carrier wavelength in free space, which wavelength is characterized by a high degree of absorption due to atmospheric water vapor.

Abstract: The capacitive bolometer comprises a detection capacitor having a first-order phase transition ferroelectric material between two electrodes. The detection capacitor operates during a detection step and a subsequent readout step. During the detection step, a preselected electric field is applied to the detection capacitor to maximize its sensitivity to temperature. A second electric field is applied to the capacitor during the readout step in order to increase responsivity of the detection cell. The detection cells according to the invention can be assembled into disclosed detection arrays.

Abstract: A video system is disclosed having a weapon-mounted video camera (12) transmitting video signals to a remotely located video display (14). The video display is mounted to the helmet (40) of a soldier (36), and includes a sight reticle (50) superimposed on the image of the target (46) so that the soldier (36) can aim the weapon (38) by moving it until the target object (46) as displayed by the video display (14) is aligned with the sight reticle (50). A low probability of transmission interception of the video signals is accomplished by using a nonvisible light carrier wavelength in free space, which wavelength is characterized by a high degree of absorption due to atmospheric water vapor.

Abstract: The capacitive bolometer comprises a detection capacitor having a first-order phase transistion ferroelectric material between two electrodes. The detection capacitor operates during a detection step and a subsequent readout step. During the detection step, a preselected electric field is applied to the detection capacitor to maximize its sensitivity to temperature. A second electric field is applied to the capacitor during the readout step in order to increase responsivity of the detection cell. The detection cells according to the invention can be assembled into disclosed detection arrays.

Abstract: A video system is disclosed having a weapon-mounted video camera (12) transmitting video signals to a remotely located video display (14). The video display is mounted to the helmet (40) of a soldier (36), and includes a sight reticle (50) superimposed on the image of the target (46) so that the soldier (36) can aim the weapon (38) by moving it until the target object (46) as displayed by the video display (14) is aligned with the sight reticle (50). A low probability of transmission interception of the video signals is accomplished by using a nonvisible light carrier wavelength in free space, which wavelength is characterized by a high degree of absorption due to atmospheric water vapor.

Abstract: The capacitive bolometer comprises a detection capacitor having a first-order phase transition ferroelectric material between two electrodes. The detection capacitor operates during a detection step and a subsequent readout step. During the detection step, a preselected electric field is applied to the detection capacitor to maximize its sensitivity to temperature. A second electric field is applied to the capacitor during the readout step in order to increase responsivity of the detection cell. The detection cells according to the invention can be assembled into disclosed detection arrays.