Abstract: A tunable grating apparatus includes a plurality of grating structures contained within an optical transmission path. A microelectromechanical (MEMS) actuator is operatively connected to each grating structure for changing the separation between the grating structures and tuning the grating to a desired wavelength selectivity. The grating structures preferably form a Bragg grating.

Abstract: The gauge length of an acoustic signal detector is dynamically variable by adjusting the location of an induced light reflection interface within a section of optical waveguide to which an acoustic stimulus is coupled. In an interferometer based architecture, a light beam is applied to each of an ‘acoustic signal detection’ optical waveguide and a ‘reference’ optical waveguide. The ‘acoustic signal detection’ waveguide is coupled to an acoustic energy transmission element. The acoustic input modifies the index of refraction of the optical waveguide and modulates the light passing through the waveguide. Since the index of refraction of the optical waveguide section is modified by the acoustic stimulus, the signal beam has a phase delay dependent upon the acoustic signal and the distance between one end of the signal waveguide section and an induced reflection interface.

Abstract: An electronic device includes a package surrounding at least one integrated circuit, a micro-fluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet impingement cooling. The electronic device may comprise a power consumption sensor connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the power consumption sensor. A temperature sensor may be connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the sensed temperature. The micro-fluidic cooler may comprise at least one droplet generator for generating and impinging droplets of cooling fluid onto the integrated circuit. The at least one droplet generator may comprise at least one micro-electromechanical (MEMs) pump.

Abstract: A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.

Abstract: A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use.

Abstract: A thermally enhanced microcircuit package includes a microcircuit package having a microcircuit device cavity that receives a microcircuit device. A microelectromechanical (MEMS) cooling module is operatively connected to the microcircuit package and forms a capillary pumped loop cooling circuit having an evaporator, condenser and interconnecting cooling fluid channels for passing vapor and fluid between the evaporator and condenser and evaporating and condensing the cooling fluid. The evaporator is operatively associated with the microcircuit device for cooling the device when in use.

Abstract: An electronic device includes a package surrounding at least one integrated circuit, a micro-fluidic cooler in the package, and a controller for controlling the micro-fluidic cooler so that the cooling fluid provides evaporative cooling, such as droplet impingement cooling. The electronic device may comprise a power consumption sensor connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the power consumption sensor. A temperature sensor may be connected to the at least one integrated circuit, and the controller may control the micro-fluidic cooler responsive to the sensed temperature. The micro-fluidic cooler may comprise at least one droplet generator for generating and impinging droplets of cooling fluid onto the integrated circuit. The at least one droplet generator may comprise at least one micro-electromechanical (MEMs) pump.

Abstract: A multi-chip module has an integral capacitor element embedded within the substrate and comprises a plurality of substrate layers forming a multi-chip module substrate. The substrate has a cut edge and forms at the cut edge a bondable edge. A via is formed in the substrate, and a dielectric capacitive material fills the via for a plurality of substrate layers and defines a multilayer capacitor. The multilayer capacitor and via are positioned at the bondable edge and connects to the bondable edge. In one aspect, the via having the dielectric capacitive material is positioned at the cut edge, and includes a conductive material filling at least a portion of the cut via to form the bondable edge. The dielectric capacitive material and bondable edge form a junction surface. A signal trace can be formed on a substrate layer and connected to the capacitor to form a DC blocking capacitor structure. A ground line can be formed on one substrate layer and engage the capacitive material.

Abstract: A phased array antenna includes an antenna housing including a subarray assembly and a plurality of beam forming network modules positioned on the subarea assembly. An antenna support and interconnect member are mounted on the antenna housing and include a carrier member having a front antenna mounting surface substantially orthogonal to the module support for supporting at least one antenna element. A rear surface has a receiving slot. At least one conductive via is associated with the receiving slot and positioned to extend through the carrier member to a circuit element, such as an antenna element, supported by the mounting surface. A launcher member is fitted into the receiving slot and has a module connecting end that extends rearward to a beam forming network. The launcher member includes conductive signal traces that extend along the launcher member from the conductive via to the module connecting end.

Abstract: An RF interface is configured as a laminate structure having a core layer of a ferromagnetic ceramic material, such as barium strontium titanate, whose permitivity is electrically controllable to modify the behavior of impinging electromagnetic energy, as one of minimally attenuated transmission, maximally attenuated absorption, and highly unattenuated reflection. Opposite surfaces of the ceramic core are coated with an electrically lossy material, such as indium tin oxide, to which a differential DC voltage is applied, and thereby imparting a DC electric field to the core layer. For an antenna application, during transmit/receive mode, the differential voltage has a magnitude that renders the laminate's core highly conductive, and thereby reflective to the RF wavelength being sourced from or received by an associated feed horn. During other times, the differential voltage renders the laminate effectively transparent to RF wavelengths in a prescribed band of interest (e.g.

Abstract: An integrated circuit package includes a ceramic substrate having a cut out configured to receive a flip chip. The cut out includes vias formed as through holes. A flip chip is received within the cut out of the ceramic substrate and has conductive bumps formed thereon corresponding to the electrical input/output contacts of the flip chip. The conductive bumps are received within the through holes of the ceramic substrate. A second integrated circuit chip is mounted on the flip chip in back-to-back relationship. A controlled impedance line is secured to the conductive bumps and acts as a coax. In another aspect of the present invention, a heat sink can be mounted on the back of the flip chip, and the second integrated circuit chip mounted on the heat sink.

Abstract: An integrated circuit package includes a substrate having a circuitry pattern formed on the substrate. A thermoplastic attachment film is positioned on the substrate and has vias that expose the circuitry pattern. A flip chip has input/output contacts formed as conductive bumps and mounted on the thermoplastic attachment film such that the conductive bumps are received within the cut openings and engage the circuitry pattern. The thermoplastic attachment film forms an underfill and a thermoplastic bond between the substrate and the flip chip, which allows ready removal of the flip chip upon application of heat. A method is also disclosed forming the integrated circuit package using the flip chip, thermoplastic attachment film and substrate of the present invention.

Abstract: An integrated circuit package includes a ceramic substrate having a cut out configured to receive a flip chip. The cut out includes vias formed as through holes. A flip chip is received within the cut out of the ceramic substrate and has conductive bumps formed thereon corresponding to the electrical input/output contacts of the flip chip. The conductive bumps are received within the through holes of the ceramic substrate. A second integrated circuit chip is mounted on the flip chip in back-to-back relationship. A controlled impedance line is secured to the conductive bumps and acts as a coax. In another aspect of the present invention, a heat sink can be mounted on the back of the flip chip, and the second integrated circuit chip mounted on the heat sink.

Abstract: A method of forming a sensor for sensing signals on conductors includes the step of forming a plurality of antenna element openings in a plurality of green tape ceramic sheets. Each antenna element opening includes a central opening and annular opening surrounding the central opening. The method includes the step of stacking successive green tape ceramic sheets so that central and annular openings are aligned with each other while also forming a planar sensor face that is to be placed adjacent the conductors to be sensed. The central openings and annular openings are filled with conductive paste. The stacked green tape ceramic sheets are heated to cure the green tape ceramic sheets and conductive paste. A signal processing integrated circuit is mounted on the side opposite the planar sensor face that is to be placed adjacent the conductors to be sensed. The method also includes the step of connecting the cured conductive paste filling central opening to the signal processing integrated circuit.

Abstract: A multi-chip module has an integral capacitor element embedded within the substrate and includes a plurality of substrate layers forming a multi-chip module substrate. The substrate has a cut edge and forms at the cut edge a bondable edge. A via is formed in the substrate, and a dielectric capacitive material fills the via for a plurality of substrate layers and defines a multilayer capacitor. The multilayer capacitor and via are positioned at the bondable edge and connects to the bondable edge. In one aspect, the via having the dielectric capacitive material is positioned at the cut edge, and includes a conductive material filling at least a portion of the cut via to form the bondable edge. The dielectric capacitive material and bondable edge form a junction surface. A signal trace can be formed on a substrate layer and connected to the capacitor to form a DC blocking capacitor structure. A ground line can be formed on one substrate layer and engage the capacitive material.

Abstract: An integrated circuit package includes a substrate having a circuitry pattern formed on the substrate. A thermoplastic attachment film is positioned on the substrate and has vias that expose the circuitry pattern. A flip chip has input/output contacts formed as conductive bumps and mounted on the thermoplastic attachment film such that the conductive bumps are received within the cut openings and engage the circuitry pattern. The thermoplastic attachment film forms an underfill and a thermoplastic bond between the substrate and the flip chip, which allows ready removal of the flip chip upon application of heat. A method is also disclosed forming the integrated circuit package using the flip chip, thermoplastic attachment film and substrate of the present invention.

Abstract: A method for making an RF device, such as an antenna, having a non-planar shape with a high degree of accuracy includes the steps of forming an electrical conductor pattern on a flexible substrate, and positioning the flexible substrate onto the mold having the non-planar shape so that the electrical conductor pattern is exposed. The method also includes forming a rigid layer on the flexible substrate so that the exposed electrical conductor pattern will be transferred to the rigid layer upon separation from the flexible substrate. The rigid layer is separated from the flexible substrate with the electrical conductor pattern remaining on the rigid layer. The method preferably further includes forming an additional thickness of conductive material onto the electrical conductor pattern remaining on the rigid layer. The electrical conductor pattern may be a metal pattern which may be printed onto the substrate.

Abstract: An apparatus senses signals on conductors and includes a ceramic sensor body. A plurality of antenna elements are formed in the ceramic sensor body. Each antenna element includes a conductor sensing end and forms an array having a substantially planar face that is to be placed adjacent to conductors to be sensed. Each of the antenna elements further comprises a central electrode and a surrounding shield electrode spaced from the central electrode. A signal processor is connected to each antenna element and receives the signal output from each antenna element and processes the received signals for determining the presence of signals passing to the conductors. The central electrode and surrounding shield electrode are formed of a hardened, conductive paste received within the ceramic sensor body.

Abstract: A packaging assembly for a semiconductor circuit chip is formed of a hermetically sealable, `tub`-like structure. The tub-like structure is comprised a laminated stack of thin layers of low temperature co-fired ceramic (LTCC) material. The laminated stack of LTCC layers contains an internally distributed network of interconnect links through which a semiconductor die, that has been mounted at a floor portion of the tub, may be electrically connected to a plurality of conductive recesses or pockets located at top and bottom sidewall edge portions of the tub, thereby allowing multiple tubs to be joined together as a hermetically sealed assembly and electrically interconnected at the conductive pockets of adjacent tubs.

Abstract: A packaging assembly for a semiconductor circuit chip is formed of a hermetically sealable, `tub`-like structure. The tub-like structure is comprised a laminated stack of thin layers of low temperature co-fired ceramic (LTCC) material. The laminated stack of LTCC layers contains an internally distributed network of interconnect links through which a semiconductor die, that has been mounted at a floor portion of the tub, may be electrically connected to a plurality of conductive recesses or pockets located at top and bottom sidewall edge portions of the tub, thereby allowing multiple tubs to be joined together as a hermetically sealed assembly and electrically interconnected at the conductive pockets of adjacent tubs.